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Winbond Electronics Corporation W25Q64FVSFJQ

Part No.:
W25Q64FVSFJQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q64FVSFJQ.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,628

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Product details

Overview

W25Q64FVSFJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC designed for code storage and XIP execution in space-constrained embedded systems. It supports Standard/Dual/Quad SPI and QPI interfaces, operates from 2.7V–3.6V, delivers up to 104MHz SPI clock rate (416MHz equivalent in Quad I/O), and features 4KB uniform sectors, 20-year data retention, and hardware write protection via /WP and /HOLD pins. It is commonly used in microcontroller boot code storage and firmware update storage.

For engineers reviewing the W25Q64FVSFJQ datasheet, W25Q64FVSFJQ pinout, W25Q64FVSFJQ application, or W25Q64FVSFJQ equivalent, key selection criteria include Quad SPI timing compliance, sector-erase flexibility for OTA updates, JEDEC ID and SFDP register support for auto-configuration, and compatibility with 3.3V I/O microcontrollers requiring low-power active and deep power-down modes.

Technical Context

The W25Q64FVSFJQ implements a flexible SPI command architecture supporting four operational modes: Standard (4-wire), Dual I/O (2-wire bidirectional), Quad I/O (4-wire bidirectional), and QPI (4-wire with 2-cycle instruction encoding). Its internal block diagram includes a 256-byte page buffer, sector/block erase logic, status register control (with QE bit enabling Quad mode), and security registers with OTP locks.

Hardware control signals (/CS, /WP, /HOLD) operate independently of interface mode - but /WP and /HOLD are repurposed as IO2 and IO3 when Quad Enable (QE=1) is set in Status Register-2. The device uses a single power supply and supports continuous read with wrap (8/16/32/64-byte), enabling true execute-in-place (XIP) operation without external buffering.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8 MB); enables full MCU firmware image storage including bootloader, application, and configuration data in one device.
Interface Support Standard/Dual/Quad SPI + QPI; allows software-selectable bandwidth scaling from ~30 MB/s (Standard) to 50 MB/s (Quad Fast Read).
Max Clock Frequency 104 MHz SPI clock; yields 416 MHz effective throughput in Quad I/O mode using Fast Read Quad I/O (EBh), critical for real-time XIP latency.
Erase Granularity Uniform 4 KB sectors (2,048 total); permits fine-grained firmware partitioning (e.g., separate app/config/security regions) without over-erasing.
Data Retention 20 years at +25°C; ensures long-term reliability for industrial and automotive applications without refresh cycles.
Power Consumption 4 mA active current, <1 µA power-down (typ.); reduces system standby power in battery-backed or energy-harvesting designs.
Operating Voltage 2.7 V – 3.6 V; compatible with standard 3.3 V logic families and tolerant of rail droop during brown-out conditions.
Temperature Range –40°C to +85°C; qualified for extended industrial environments without derating.

Pinout & Package

W25Q64FVSFJQ is packaged in an 8-pin SOIC 300-mil (package code SF), with pin 1 assigned to /HOLD (IO3), pin 7 to /CS, and pins 8–16 including 8 NC terminals. This wide-body SOIC variant provides mechanical robustness and hand-soldering compatibility for prototyping and low-volume production.

Pin/Terminal Circuit Role Design Meaning
1 /HOLD (IO3) Active-low pause signal; halts ongoing read/write while preserving internal state - essential when sharing SPI bus with multiple peripherals.
2 VCC Primary 2.7–3.6 V power supply; must be decoupled with ≥100 nF ceramic capacitor near pin for stable high-speed operation.
3–6 NC No-connect pins; left unconnected per datasheet - no internal bonding or function; PCB layout must avoid routing or thermal pads.
7 /CS Chip select input; falling edge initiates command acceptance; must track VCC ramp at power-up to prevent spurious writes.
8 DO (IO1) Data output (Standard/Dual SPI) or bidirectional I/O (Quad/QPI); requires pull-up if shared with other devices in open-drain configurations.
9 /WP (IO2) Hardware write protect input (active low); disables status register writes when asserted - used with BP bits for immutable boot sector protection.
10 GND Digital ground reference; must be connected to system ground plane with low-inductance path to minimize SPI noise coupling.
11–14 NC No-connect pins; electrically isolated and unbonded - no internal connection; must remain floating per design specification.
15 DI (IO0) Data input (Standard/Dual SPI) or bidirectional I/O (Quad/QPI); carries commands, addresses, and program data on rising CLK edge.
16 CLK Serial clock input; synchronous timing reference for all SPI operations; maximum 104 MHz frequency defines worst-case setup/hold margins.

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead to 2 clocks per command, enabling deterministic XIP latency and eliminating mode-switching delays between read/write ops.
Continuous Read Mode with Wrap Supports 8/16/32/64-byte burst wrap; eliminates address increment overhead during sequential reads - critical for cache-line-aligned MCU fetches.
Erase/Program Suspend & Resume Allows background erase or program to be paused for urgent reads; prevents firmware lockup during concurrent OTA update and real-time logging.
64-bit Unique Serial Number Factory-programmed per-device ID; enables secure device binding, anti-cloning, and field firmware version tracking without external EEPROM.
SFDP Register Support JEDEC JESD216-compliant parameter table; allows host MCU to auto-detect density, timing, erase blocks, and Quad Enable requirements at boot.
Three 256-byte Security Registers OTP-lockable nonvolatile storage for keys, certificates, or calibration data; isolated from main array to prevent accidental overwrite during firmware updates.

Applications

Boot Code Storage Firmware Over-the-Air (OTA) Updates

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers.

IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP capability; serves as direct instruction source during reset vector fetch and runtime execution.

Use Value: Eliminates need for external RAM loading; reduces BOM count and boot time by enabling immediate execution from flash at 104 MHz SPI clock.

Use Scenario: Hosting field-upgradable firmware images in smart meters, industrial gateways, and connected appliances.

IC Role / Device Role / Timing Role: Dual-bank update storage with atomic sector erase; isolates active and pending firmware partitions.

Use Value: Enables safe rollback on failed update using 4KB sector granularity - avoids bricking due to partial write corruption.

Secure Device Identity Configuration & Calibration Data

Use Scenario: Binding cryptographic keys and device-specific certificates in IoT edge nodes and payment terminals.

IC Role / Device Role / Timing Role: Tamper-resistant storage for security registers with OTP lock bits; accessed only via dedicated SPI instructions (42h/48h/44h).

Use Value: Prevents key extraction via physical probing; ensures private keys remain inaccessible even if main flash array is dumped.

Use Scenario: Storing factory-calibrated sensor offsets, display gamma tables, and user preferences in medical monitors and HMI panels.

IC Role / Device Role / Timing Role: Parameter storage with individual 4KB sector protection; allows independent update of config vs. firmware without erasing code.

Use Value: Guarantees data integrity across power cycles and firmware upgrades - no risk of config loss during application reflash.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 64 M-bit, 104 MHz max clock, same SOIC-16 package (SF), but lacks QPI mode and SFDP register. Requires fixed-mode initialization; unsuitable for auto-configuring hosts expecting JEDEC SFDP discovery. Select when QPI and dynamic parameter detection are unnecessary and legacy SPI-only firmware is deployed.
S25FL164K0XMFI010 64 M-bit, 85 MHz max clock, supports Octal DTR mode (not in W25Q64FVSFJQ), different security register implementation. Higher bandwidth in Octal mode but incompatible instruction set; security model relies on volatile lock bits instead of OTP. Select for migration paths to Cypress/Infineon platforms where Octal DTR timing and alternate security policy are required.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64FVSFJQ offers superior configurability via SFDP and deterministic low-latency XIP via QPI, while maintaining pin-compatible SOIC-16 footprint and identical 4KB sector architecture for seamless firmware partitioning.

Availability

W25Q64FVSFJQ is available at Aetrix Electronics and suitable for industrial control systems, automotive infotainment head units, and medical diagnostic equipment requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for W25Q64FVSFJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage products for embedded and consumer markets.

The W25Q64FV series was engineered for high-reliability code storage in resource-constrained MCUs, emphasizing fast XIP performance, flexible erase granularity, and integrated security features for secure boot and firmware authenticity.

FAQ

What is the package type and pin count of W25Q64FVSFJQ?

W25Q64FVSFJQ uses an 8-pin SOIC 300-mil package (package code SF) with 16 physical leads - eight functional pins (including /CS, CLK, DI, DO, /WP, /HOLD, VCC, GND) and eight no-connect (NC) terminals. This wide-body SOIC variant improves mechanical stability and solder joint reliability compared to narrow SOIC variants.

Does W25Q64FVSFJQ support Quad SPI mode, and how is it enabled?

Yes, W25Q64FVSFJQ supports Quad SPI mode via the non-volatile Quad Enable (QE) bit in Status Register-2. To activate it, issue Write Enable (06h), then Write Status Register (01h) with value 02h to set QE=1. Once enabled, /WP and /HOLD become IO2 and IO3, allowing four-wire bidirectional data transfer for instructions like Fast Read Quad I/O (EBh).

What is the minimum erase unit size supported by W25Q64FVSFJQ?

W25Q64FVSFJQ supports uniform 4 KB sector erase as its smallest erase unit, with 2,048 such sectors across the 64 M-bit array. This granularity enables precise firmware partitioning - for example, dedicating one sector to immutable bootloader code and others to upgradable application modules - without risking corruption of adjacent regions.

How does W25Q64FVSFJQ handle power-down and wake-up sequences?

W25Q64FVSFJQ enters ultra-low-power mode (<1 µA typical) upon receiving Power-down (B9h) command. Wake-up is triggered by /CS falling edge - no additional command needed. During power-up, /CS must transition from high to low after VCC stabilizes; a pull-up resistor on /CS ensures proper initialization and prevents spurious writes during rail ramp.

Can W25Q64FVSFJQ be used for execute-in-place (XIP) operation, and what features enable it?

Yes, W25Q64FVSFJQ is explicitly designed for XIP operation. Key enablers include Continuous Read Mode (with as few as 8 clocks to address memory), QPI instruction encoding (reducing command overhead), and 104 MHz SPI clock support yielding up to 50 MB/s sustained read throughput - all allowing CPU instruction fetch directly from flash without intermediate RAM buffering.

W25Q64FVSFJQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q64FVSFJQ FAQ

1.How can I place an order for W25Q64FVSFJQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVSFJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVSFJQ reliable?

The price and inventory of W25Q64FVSFJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVSFJQ is usually 5 days.

3.What payment methods are accepted for W25Q64FVSFJQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVSFJQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVSFJQ?

W25Q64FVSFJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVSFJQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVSFJQ?

For technical support, including W25Q64FVSFJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVSFJQ requirements.

6.How does Aetrix verify that W25Q64FVSFJQ is sourced from the original manufacturer or authorized distributors?

All W25Q64FVSFJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVSFJQ meets industry standards.

7.What is the process for return or replacement of W25Q64FVSFJQ?

All W25Q64FVSFJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVSFJQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVSFJQ part is unused and in its original packaging.

Return procedure for W25Q64FVSFJQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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