Winbond Electronics Corporation W25Q64FVSSIF

Overview

W25Q64FVSSIF from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 32,768 × 256-byte pages with uniform 4KB sector erase, 32KB/64KB block erase, and chip erase capabilities. It operates from 2.7V to 3.6V, draws 4mA active current and <1µA in power-down mode, and is qualified for industrial temperature range (–40°C to +85°C). It is commonly used for code storage, XIP execution, firmware updates, and parameter retention in microcontroller-based embedded systems.

For engineers reviewing the W25Q64FVSSIF datasheet, W25Q64FVSSIF pinout, W25Q64FVSSIF application, or W25Q64FVSSIF equivalent, key selection criteria include its 104MHz SPI clock support, Quad Enable (QE) bit configuration, hardware write-protect (/WP) and hold (/HOLD) pin behavior in dual/quad modes, JEDEC ID (EF4017), and SOIC-8 208-mil (SS) package compatibility with legacy PCB footprints.

Technical Context

The W25Q64FVSSIF implements a flexible SPI-compatible command set with dedicated instructions for fast read (0Bh), dual I/O (BBh), quad I/O (EBh), QPI enable (38h), and security register access (42h/48h). Its status register architecture includes volatile/non-volatile bits for Quad Enable (QE), Block Protect (BP2–BP0), Top/Bottom protection (TB), and Erase/Program Suspend (SUS).

It supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes. The device integrates three 256-byte one-time-programmable (OTP) security registers, SFDP v1.6 compliance, and a factory-programmed 64-bit unique ID - all accessible via standardized commands without external configuration.

Key Specifications

Pinout & Package

W25Q64FVSSIF is packaged in an 8-pin SOIC 208-mil (package code SS), with pins arranged in standard dual-inline configuration. Pin functions are shared across SPI modes: /CS enables communication, CLK synchronizes transfers, DI/DO serve as unidirectional I/O in standard SPI, and become bidirectional IO0–IO3 in quad mode when QE=1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with W25Q64FVSSIF, MX25L6433FZNI-10G omits QPI and SFDP - increasing firmware porting effort - while S25FL064L0XMFI001 trades peak speed for octal DTR capability and hardware reset, better suited for automotive ASIL-B contexts where deterministic reset behavior is mandated.

Availability

W25Q64FVSSIF is available at Aetrix Electronics and suitable for industrial control systems, IoT edge gateways, medical diagnostic equipment, and automotive camera modules requiring stable component supply, long-term lifecycle assurance, and guaranteed traceability.

Supply support for W25Q64FVSSIF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer applications.

The W25Q series targets high-performance, space-constrained embedded systems requiring robust code storage, fast XIP execution, and integrated security - with W25Q64FVSSIF optimized for industrial temperature operation and SOIC-8 footprint compatibility.

FAQ

What is the package type and pin count of W25Q64FVSSIF?

W25Q64FVSSIF uses an 8-pin SOIC 208-mil package (package code SS), with standard pinout: /CS, DO(IO1), /WP(IO2), GND, DI(IO0), CLK, /HOLD(IO3), and VCC. This footprint is backward-compatible with legacy W25Qxx series designs and supports hand-soldering and automated assembly without retooling.

Does W25Q64FVSSIF support Quad SPI mode out of the box?

No - W25Q64FVSSIF requires the Quad Enable (QE) bit in Status Register-2 to be set (via Write Status Register command 01h) before /WP and /HOLD pins function as IO2 and IO3. Until QE=1, those pins retain their hardware write-protect and hold roles. Default power-on state is QE=0.

How does W25Q64FVSSIF handle power-down and wake-up sequencing?

W25Q64FVSSIF enters ultra-low-power mode (<1 µA typical) upon receiving Power-down (B9h) command. Wake-up occurs automatically on next /CS low transition, with no delay - but /CS must remain low for ≥30 ns before first clock edge. No external reset or voltage ramp monitoring is required.

Can W25Q64FVSSIF be used for secure boot applications?

Yes - W25Q64FVSSIF supports secure boot via three 256-byte OTP security registers (lockable with LB1–LB3 bits), factory-programmed 64-bit unique ID for device binding, and JEDEC-standard SFDP for verified parameter discovery. These features enable cryptographic signature verification and anti-cloning measures in bootloader implementations.

What is the difference between W25Q64FVSSIF and W25Q64FVSIQ?

W25Q64FVSSIF uses SOIC-8 208-mil packaging (SS), while W25Q64FVSIQ uses SOIC-8 300-mil (SF) with 16 pins - 8 of which are NC. The SS variant has compact footprint and standard 8-pin routing; the SIQ variant provides extra spacing for high-voltage isolation or thermal relief but offers identical electrical specs and command set.