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Winbond Electronics Corporation W25Q64FVSSIG TR

Part No.:
W25Q64FVSSIG TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25Q64FVSSIG TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,220

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Product details

Overview

W25Q64FVSSIG TR from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 32,768 × 256-byte pages with uniform 4KB sector erase, 32KB/64KB block erase, and chip erase. It operates from 2.7V to 3.6V, draws 4mA active current and <1µA in power-down, and delivers up to 104MHz SPI clock (416MHz equivalent Quad I/O), enabling XIP execution in embedded boot code storage.

For engineers reviewing the W25Q64FVSSIG TR datasheet, W25Q64FVSSIG TR pinout, W25Q64FVSSIG TR application, or W25Q64FVSSIG TR equivalent, key selection criteria include Quad Enable (QE) bit configuration for IO2/IO3 remapping, /WP and /HOLD pin behavior in standard vs. Quad mode, 4KB sector granularity for firmware partitioning, and JEDEC ID (EF4017h) and SFDP register support for automated configuration.

Technical Context

The W25Q64FVSSIG TR implements a multi-mode serial interface where Standard SPI uses unidirectional DI/DO, Dual SPI repurposes DI/DO as bidirectional IO0/IO1, and Quad SPI/QPI require QE=1 to enable IO2 (/WP) and IO3 (/HOLD) - disabling hardware write-protect and hold functions during Quad operation. Its command set includes Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read (E3h), all requiring 8-clock address overhead for true XIP efficiency.

Internally, it features three 256-byte Security Registers with OTP locks, a 64-bit Unique ID, volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP, SRP0/SRP1), and Erase/Program Suspend & Resume (75h/7Ah) for real-time interrupt handling during background operations - critical for automotive and industrial firmware updates.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 M-bit (8 MB), organized as 32,768 × 256-byte pages
Interface ModesStandard SPI, Dual SPI, Quad SPI, and QPI - QE bit required to enable Quad I/O
Max Clock Frequency104 MHz SPI; enables 208 MHz (Dual) or 416 MHz (Quad) effective throughput
Erase GranularityUniform 4 KB sectors (2,048 total), 32 KB blocks (1,024), 64 KB blocks (512), and full chip
Write Endurance100,000 program/erase cycles per sector, with >20-year data retention
Supply Voltage2.7 V to 3.6 V single supply; 4 mA typical active current, <1 µA power-down
Operating Temp–40°C to +85°C industrial grade; supports extended temperature firmware storage

Pinout & Package

W25Q64FVSSIG TR is packaged in an 8-pin SOIC 208-mil (package code SS), with pins arranged in standard dual-in-line layout and compatible footprint across VSOP and PDIP variants.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; high-impedance DO and standby current when high; must transition high→low after power-up before instruction acceptance
2 DO (IO1)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; becomes IO1 in Dual/Quad modes; used for Fast Read Dual/Quad I/O and QPI
3 /WP (IO2)Write Protect Input / Bidirectional I/OHardware write-protect for status registers when QE=0; becomes IO2 in Quad mode (QE=1), disabling /WP function
4 GNDGround ReferencePrimary return path for VCC and all I/O signals; requires low-impedance PCB connection
5 DI (IO0)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; becomes IO0 in Dual/Quad modes; carries instructions, addresses, and data on rising CLK edge
6 CLKSerial Clock InputEdge-triggered timing reference; supports SPI Mode 0 and Mode 3; determines max interface speed (104 MHz)
7 /HOLD (IO3)Hold Input / Bidirectional I/OPauses ongoing read/write while /CS is low; becomes IO3 in Quad mode (QE=1), disabling /HOLD function
8 VCCPower Supply2.7–3.6 V supply; decoupling capacitor (0.1 µF) required near pin for stable operation

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead to 2 clocks per byte via 4-bit parallel data transfer, enabling deterministic XIP latency
Continuous Read ModeSupports 8/16/32/64-byte wrap with only 8 clocks to latch 24-bit address - eliminates repeated instruction reissue
Erase/Program Suspend & ResumeAllows interruption of long erase/program cycles (e.g., 400 ms sector erase) to service higher-priority reads or writes
Security Register LocksThree 256-byte OTP-locked security registers protect cryptographic keys or calibration data from overwrite or readout
JEDEC SFDP SupportEnables automatic host detection of memory geometry, timing, and feature set without hard-coded driver assumptions

Applications

Boot Code StorageFirmware Over-the-Air (OTA)

Use Scenario: Storing primary bootloader and application firmware for microcontrollers in industrial gateways.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; provides deterministic 104 MHz SPI access for fast boot initialization.

Use Value: Eliminates external RAM copy step via Continuous Read Mode and Quad I/O, reducing boot time by >35% versus standard SPI flash.

Use Scenario: Secure field update of embedded firmware in connected medical devices.

IC Role / Device Role / Timing Role: Dual-bank firmware partitioning using 4KB sector granularity and Erase Suspend for atomic rollback.

Use Value: Enables safe background download and validation while maintaining live system operation - no service interruption required.

Secure Configuration StorageIndustrial HMI Display Memory

Use Scenario: Storing calibrated sensor coefficients and device-specific encryption keys in factory-programmed modules.

IC Role / Device Role / Timing Role: Protected parameter storage using OTP-locked Security Registers and hardware /WP control.

Use Value: Prevents unauthorized modification or extraction of sensitive data - meets IEC 62443-3-3 SL2 requirements.

Use Scenario: Holding GUI assets (fonts, icons, splash screens) for ARM-based human-machine interface panels.

IC Role / Device Role / Timing Role: High-bandwidth asset streaming via Fast Read Quad I/O (EBh) at 416 MHz equivalent rate.

Use Value: Delivers >50 MB/s sustained read throughput - sufficient for real-time 720p image decompression without frame stutter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L6433FZNI-10G64 M-bit, 104 MHz max clock, supports DTR mode but lacks QPI; JEDEC ID 204017hNo QPI instruction set - limits XIP efficiency in high-performance MCU boot pathsPrefer W25Q64FVSSIG TR when QPI or SFDP auto-configuration is required.
S25FL164K0XMFI01064 M-bit, 80 MHz max clock, HyperBus interface option; JEDEC ID 014017hLower max frequency and no Quad I/O - reduces continuous read bandwidth by ~25%Choose W25Q64FVSSIG TR for designs needing >100 MHz SPI clocks and full Quad I/O compatibility.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64FVSSIG TR uniquely combines QPI mode, 104 MHz clock, SFDP register, and Erase Suspend - making it optimal for real-time firmware update and XIP-critical embedded boot systems.

Availability

W25Q64FVSSIG TR is available at Aetrix Electronics and suitable for industrial control systems, automotive infotainment head units, and IoT edge gateway designs requiring stable component supply, long-lifecycle support, and verified flash endurance.

Supply support for W25Q64FVSSIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q64FV series belongs to Winbond's SpiFlash family, designed specifically for high-reliability code storage, XIP execution, and secure firmware update in resource-constrained embedded systems.

FAQ

What is the JEDEC manufacturer and device ID for W25Q64FVSSIG TR?

The W25Q64FVSSIG TR reports JEDEC ID EF4017h (manufacturer ID EFh = Winbond, memory type 40h, capacity 17h = 64 M-bit) via Read JEDEC ID (9Fh) instruction. This ID is used by host bootloaders for automatic flash detection and driver initialization, and is consistent across all W25Q64FV package variants including W25Q64FVSSIG TR.

Does W25Q64FVSSIG TR support execute-in-place (XIP) operation?

Yes, W25Q64FVSSIG TR supports true XIP via Continuous Read Mode with 8-clock address overhead and Fast Read Quad I/O (EBh) or QPI instructions. When configured with QE=1 and proper timing setup, it delivers deterministic latency for direct CPU instruction fetch - validated for Cortex-M4/M7 and RISC-V cores in production industrial controllers using W25Q64FVSSIG TR.

How does the /WP pin behave when Quad SPI mode is enabled on W25Q64FVSSIG TR?

When the Quad Enable (QE) bit in Status Register-2 is set to 1, the /WP pin on W25Q64FVSSIG TR is remapped as IO2 and loses its hardware write-protect function. Hardware protection of status registers then requires SRP0/SRP1 bits and VCC-based lock-down - a critical design consideration for secure boot implementations using W25Q64FVSSIG TR.

What package type does W25Q64FVSSIG TR use, and is it compatible with other W25Q64FV variants?

W25Q64FVSSIG TR uses the 8-pin SOIC 208-mil package (package code SS). It shares identical pinout, electrical characteristics, and command set with other W25Q64FV variants in SOIC, VSOP, PDIP, and WSON packages - enabling drop-in replacement across form factors without PCB redesign, provided thermal and layout constraints are met for W25Q64FVSSIG TR.

Can W25Q64FVSSIG TR be used in automotive applications requiring AEC-Q100 qualification?

No, W25Q64FVSSIG TR is rated for industrial temperature (–40°C to +85°C) and is not AEC-Q100 qualified. For automotive applications, Winbond offers the AEC-Q100 Grade 3 W25Q64JWxxIQ variant. Designers requiring automotive-grade reliability must select that part instead of W25Q64FVSSIG TR, as W25Q64FVSSIG TR lacks stress test documentation, failure rate reporting, and automotive-specific screening per W25Q64FVSSIG TR datasheet.

W25Q64FVSSIG TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25Q64FVSSIG TR FAQ

1.How can I place an order for W25Q64FVSSIG TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVSSIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVSSIG TR reliable?

The price and inventory of W25Q64FVSSIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVSSIG TR is usually 5 days.

3.What payment methods are accepted for W25Q64FVSSIG TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVSSIG TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVSSIG TR?

W25Q64FVSSIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVSSIG TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVSSIG TR?

For technical support, including W25Q64FVSSIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVSSIG TR requirements.

6.How does Aetrix verify that W25Q64FVSSIG TR is sourced from the original manufacturer or authorized distributors?

All W25Q64FVSSIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVSSIG TR meets industry standards.

7.What is the process for return or replacement of W25Q64FVSSIG TR?

All W25Q64FVSSIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVSSIG TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVSSIG TR part is unused and in its original packaging.

Return procedure for W25Q64FVSSIG TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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