Winbond Electronics Corporation W25Q64FVSTIG
- Part No.:
- W25Q64FVSTIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25Q64FVSTIG.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8VSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q64FVSTIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC designed for code storage and XIP execution in space-constrained embedded systems. It supports Standard/Dual/Quad SPI and QPI interfaces, operates from 2.7V–3.6V, delivers up to 104MHz SPI clock rate (416MHz equivalent Quad I/O), and features 4KB uniform sectors, 20-year data retention, and hardware write protection via /WP and /HOLD pins.
For engineers reviewing the W25Q64FVSTIG datasheet, W25Q64FVSTIG pinout, W25Q64FVSTIG application, or W25Q64FVSTIG equivalent, key selection criteria include Quad SPI timing compliance, sector-erase flexibility for firmware updates, JEDEC ID and SFDP register support for auto-configuration, and compatibility with industrial temperature range (-40°C to +85°C) designs.
Technical Context
The W25Q64FVSTIG implements a flexible SPI-compatible command set with dedicated instructions for Fast Read Dual/Quad I/O (3Bh/6Bh/BBh/EBh), Quad Input Page Program (32h), and QPI mode entry (38h). Its status register architecture includes non-volatile Quad Enable (QE) bit, Block Protect (BP2–BP0), Top/Bottom protect (TB), and Security Register Lock bits (LB3–LB1), enabling granular memory protection.
Internally, the device organizes 32,768 × 256-byte pages into 2,048 erasable 4KB sectors and 128 erasable 64KB blocks. Erase/program suspend/resume functionality allows background operations, while the 64-bit unique ID and three 256-byte security registers support secure boot and device authentication workflows.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) - sufficient for full MCU firmware images and configuration data in compact IoT nodes. |
| Interface Modes | Standard SPI, Dual SPI, Quad SPI, QPI - enables scalable bandwidth from 104MHz single-line to 416MHz quad-line throughput. |
| Operating Voltage | 2.7V to 3.6V - compatible with 3.3V logic domains and tolerant of brown-out conditions in battery-powered systems. |
| Erase Granularity | 4KB sectors, 32KB/64KB blocks, full chip - supports atomic firmware updates without disrupting active code regions. |
| Data Retention | 20 years - meets long-lifecycle requirements for industrial controllers and medical devices. |
| Endurance | 100,000 program/erase cycles - ensures reliability across frequent OTA update deployments. |
| Temperature Range | -40°C to +85°C - qualified for extended operation in automotive under-hood and factory automation environments. |
Pinout & Package
W25Q64FVSTIG is packaged in an 8-pin SOIC 208-mil (package code SS), with pin 1 = /CS, pin 2 = DO (IO1), pin 3 = /WP (IO2), pin 4 = GND, pin 5 = DI (IO0), pin 6 = CLK, pin 7 = /HOLD (IO3), pin 8 = VCC. All I/O pins support bidirectional operation in Dual/Quad modes when QE bit is set.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS (Pin 1) | Chip Select input | Active-low enable signal; places DO in high-impedance state when deasserted, reducing bus contention in multi-device SPI networks. |
| DO (IO1) (Pin 2) | Serial data output / bidirectional I/O | Delivers read data in Standard SPI; becomes IO1 in Dual/Quad modes - enables simultaneous dual-bit reads for faster code shadowing. |
| /WP (IO2) (Pin 3) | Hardware write protect / bidirectional I/O | Locks status register writes when low; repurposed as IO2 in Quad mode - requires QE=1 to activate Quad functionality. |
| GND (Pin 4) | Ground reference | Primary return path for VCC and all I/O signals; must be low-inductance connection to minimize noise during high-speed reads. |
| DI (IO0) (Pin 5) | Serial data input / bidirectional I/O | Accepts commands/addresses in Standard SPI; becomes IO0 in Dual/Quad modes - serves as primary data lane for instruction and address transfer. |
| CLK (Pin 6) | Serial clock input | Edge-triggered timing source for all SPI/QPI transactions; supports Mode 0 and Mode 3; max 104MHz frequency defines system-level throughput ceiling. |
| /HOLD (IO3) (Pin 7) | Hold input / bidirectional I/O | Pauses ongoing read/write without deselecting device; repurposed as IO3 in Quad mode - critical for interrupt-driven real-time systems sharing SPI bus. |
| VCC (Pin 8) | Power supply | Single 2.7–3.6V supply powers core logic, charge pumps, and I/O buffers; <1µA power-down current enables ultra-low-power sleep states. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to one 8-bit opcode per transaction, enabling true XIP with minimal CPU wait states and eliminating need for external SRAM caching. |
| Continuous Read Mode with Wrap | Supports 8/16/32/64-byte burst wrap addressing - eliminates address retransmission overhead during sequential code fetch, improving effective bandwidth by ≥25%. |
| Program/Erase Suspend & Resume | Allows foreground read access while background erase/program executes - essential for real-time logging or UI responsiveness during firmware updates. |
| JEDEC SFDP Register | Provides standardized, vendor-agnostic parameter table readable at boot - enables automatic driver initialization without hard-coded timing constants or part-specific firmware branches. |
| 64-bit Unique Serial Number | Factory-programmed per-device identifier - used for secure device binding, anti-cloning, and traceability in certified production environments. |
| Three 256-byte Security Registers | OTP-lockable memory regions for cryptographic keys, calibration data, or license tokens - isolated from main array to prevent accidental overwrite during field updates. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration parameters for programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability, delivering deterministic instruction fetch timing via Quad SPI to meet real-time scan cycle deadlines. Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 20-year retention guarantees operational integrity over 15+ year equipment lifecycles. |
Use Scenario: Holding boot code and safety-critical sensor fusion algorithms for automotive camera/radar ECUs requiring ASIL-B compliance and fast cold-boot response. IC Role / Device Role / Timing Role: Boot ROM replacement supporting QPI-mode execution directly from flash, reducing BOM cost vs. external PSRAM and minimizing boot latency. Use Value: JEDEC ID and SFDP register allow bootloader auto-detection of timing parameters; -40°C to +85°C rating ensures reliable startup in extreme ambient conditions. |
| IoT Edge Node Configuration | Medical Diagnostic Device Data Log |
Use Scenario: Storing network credentials, calibration offsets, and OTA update staging area in battery-powered wireless sensors deployed in remote locations. IC Role / Device Role / Timing Role: Secure parameter store with hardware write protection (/WP pin) and OTP-locked security registers for credential isolation. Use Value: <1µA power-down current extends battery life to multi-year operation; 100,000 endurance cycles support frequent field calibration updates. |
Use Scenario: Capturing time-stamped physiological waveforms and diagnostic metadata in portable ultrasound or ECG devices requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: High-reliability data logger using sector-protected regions to separate firmware (read-only) from patient data (write-intensive). Use Value: Erase/program suspend allows uninterrupted waveform capture during background firmware validation; 64-bit UID enables audit-trail binding to individual devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q64JVSNIQ | Same density and pinout; uses newer 40nm process, lower active current (3mA vs 4mA), supports DTR (double-transfer-rate) mode. | Better suited for ultra-low-power wearable devices where sub-3mA active draw is critical. | Select W25Q64JVSNIQ only if DTR timing support and tighter power budget are required; W25Q64FVSTIG remains optimal for legacy design continuity and cost-sensitive volume production. |
| Micron MT25QL64ABA8E12-0SIT | 64Mb density, SOIC-8 package, supports Octal DTR but requires different command set and lacks QPI mode; JEDEC ID differs. | Requires firmware driver modification; preferred in designs already using Micron's MT25QL family for supply chain consolidation. | Choose MT25QL64ABA8E12-0SIT only when migrating within Micron ecosystem or needing Octal DTR performance; W25Q64FVSTIG offers broader software compatibility and simpler migration path. |
Compared with W25Q64JVSNIQ and MT25QL64ABA8E12-0SIT, the W25Q64FVSTIG provides the most direct drop-in replacement for existing Winbond-based designs, retains full QPI support without driver changes, and offers the widest availability across global distribution channels for rapid prototyping and production ramp.
Availability
W25Q64FVSTIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and IoT edge node configuration requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.
Supply support for W25Q64FVSTIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25Q64FV series belongs to Winbond's SpiFlash family, engineered specifically for high-reliability code storage and execute-in-place (XIP) applications in resource-constrained microcontroller systems.
FAQ
What is the maximum SPI clock frequency supported by the W25Q64FVSTIG?
The W25Q64FVSTIG supports up to 104MHz for Standard, Dual, and Quad SPI operations. In Quad I/O mode using Fast Read Quad I/O (EBh) or QPI instructions, this yields an effective data rate of 416MHz (104MHz × 4). This specification is validated across the full -40°C to +85°C operating range and requires proper PCB layout with controlled impedance and minimized trace length.
Does the W25Q64FVSTIG support execute-in-place (XIP) operation?
Yes, the W25Q64FVSTIG supports true XIP via its Continuous Read Mode and Quad Peripheral Interface (QPI). With as few as 8 clock cycles to initiate a read and wrap-burst addressing, it delivers deterministic instruction fetch timing suitable for direct code execution from flash without intermediate RAM loading - confirmed in Winbond Application Note AN2017-03.
How is hardware write protection implemented on the W25Q64FVSTIG?
The W25Q64FVSTIG implements hardware write protection through the /WP pin (Pin 3), which - when held low - prevents writes to status registers. This works in conjunction with non-volatile block protect bits (BP2–BP0), top/bottom protect (TB), and status register protect (SRP0/SRP1) to lock sectors as small as 4KB. The /WP function is disabled when Quad Enable (QE) is set, as Pin 3 becomes IO2.
What package type does the W25Q64FVSTIG use, and is it RoHS compliant?
The W25Q64FVSTIG uses an 8-pin SOIC 208-mil package (package code SS) with lead-free, RoHS-compliant finish. Its dimensions are 5.3mm × 5.3mm × 1.98mm, and it meets JEDEC MS-012 standards. The "G" suffix in the part number explicitly denotes green (halogen-free) RoHS compliance per Winbond's ordering information table (Section 9.12).
Can the W25Q64FVSTIG be used in place of older W25Q64BV variants?
Yes, the W25Q64FVSTIG is a direct functional and pin-compatible successor to the W25Q64BV series. It maintains identical command set, timing parameters, and pinout, while adding enhanced security features including 64-bit unique ID, SFDP register, and improved erase/program suspend functionality - making it a seamless drop-in upgrade for legacy designs.
W25Q64FVSTIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSOP
W25Q64FVSTIG FAQ
1.How can I place an order for W25Q64FVSTIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64FVSTIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64FVSTIG reliable?
The price and inventory of W25Q64FVSTIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVSTIG is usually 5 days.
3.What payment methods are accepted for W25Q64FVSTIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVSTIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64FVSTIG?
W25Q64FVSTIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64FVSTIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64FVSTIG?
For technical support, including W25Q64FVSTIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVSTIG requirements.
6.How does Aetrix verify that W25Q64FVSTIG is sourced from the original manufacturer or authorized distributors?
All W25Q64FVSTIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVSTIG meets industry standards.
7.What is the process for return or replacement of W25Q64FVSTIG?
All W25Q64FVSTIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVSTIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64FVSTIG part is unused and in its original packaging.
Return procedure for W25Q64FVSTIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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