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Winbond Electronics Corporation W25Q64FVTBIG
- Part No.:
- W25Q64FVTBIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q64FVTBIG.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,875
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Product details
Overview
W25Q64FVTBIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at 2.7–3.6V with 104MHz max clock rate, 4KB uniform sector erase, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.
For engineers reviewing the W25Q64FVTBIG datasheet, W25Q64FVTBIG pinout, W25Q64FVTBIG application, or W25Q64FVTBIG equivalent, key selection considerations include Quad Enable (QE) bit configuration for IO2/IO3 remapping, 4KB sector granularity for parameter storage, JEDEC ID (EF4017) verification, and TFBGA-24 (8×6mm, package code TB/TC) mechanical compatibility with high-density PCB layouts.
Technical Context
The W25Q64FVTBIG implements a SPI-compatible command set with mode-0 and mode-3 clock polarity support, enabling interoperability with ARM Cortex-M, RISC-V, and legacy MCU host controllers. Its dual/quad I/O operation requires non-volatile QE bit (SR2[1]) to be set, reassigning /WP and /HOLD to IO2 and IO3 - disabling hardware write protect during quad mode.
It integrates three 256-byte security registers with OTP locks, SFDP v1.6 register for discoverable timing parameters, and erase/program suspend-resume functionality for real-time system responsiveness. The 32,768 × 256-byte page architecture supports 1–256 byte page programming and 4KB/32KB/64KB erase granularities - critical for OTA firmware partitioning and runtime data logging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB), organized as 32,768 pages × 256 bytes - enables full bootloader + application image storage in single device. |
| Interface Modes | Standard SPI (4-wire), Dual SPI (2 I/O), Quad SPI (4 I/O), QPI (4 I/O + 2-cycle instruction) - selectable via QE bit and instruction set. |
| Max Clock Rate | 104 MHz (SPI), yielding 208 MB/s dual-I/O and 416 MB/s quad-I/O effective throughput - exceeds parallel x16 Flash in bandwidth-per-pin efficiency. |
| Erase Granularity | Uniform 4 KB sectors (2,048 total), 32 KB blocks (1,024), 64 KB blocks (128) - allows fine-grained firmware update without full chip erase. |
| Endurance & Retention | 100,000 program/erase cycles minimum; 20-year data retention at +85°C - validated for industrial lifecycle requirements. |
| Supply Voltage | 2.7 V to 3.6 V single supply; 4 mA active current, <1 µA power-down - compatible with battery-backed and low-power IoT designs. |
| Operating Temp | –40°C to +85°C - qualified for automotive cabin, industrial control, and outdoor edge computing environments. |
| Unique ID | 64-bit factory-programmed serial number - enables secure device authentication and firmware binding per unit. |
Pinout & Package
W25Q64FVTBIG is packaged in 24-ball TFBGA (8×6 mm, package code TB or TC), with ball pitch of 0.8 mm and 0.5 mm standoff. This compact, bottom-terminated package supports high-density routing and thermal dissipation in space-constrained applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Input: Serial clock signal; must meet tCH/tCL ≥ 4.8 ns (104 MHz); mode-0/mode-3 compatible. |
| B3 | GND | Ground reference for all I/O and core logic; requires low-impedance plane connection. |
| B4 | VCC | Power supply input (2.7–3.6 V); decoupling capacitor (100 nF) required within 3 mm. |
| C2 | /CS | Active-low chip select; must transition high→low before first instruction; tracks VCC at power-up. |
| C4 | /WP (IO2) | In standard mode: hardware write-protect input (active low); in quad mode: bidirectional IO2 data line. |
| D2 | DO (IO1) | In standard mode: unidirectional output; in dual/quad/QPI: bidirectional data line IO1. |
| D3 | DI (IO0) | In standard mode: unidirectional input; in dual/quad/QPI: bidirectional data line IO0. |
| D4 | /HOLD (IO3) | In standard mode: active-low pause control; in quad mode: bidirectional data line IO3. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to 2 clocks per command, enabling true XIP execution with minimal latency penalty vs. parallel Flash. |
| Continuous Read Mode | Supports 8/16/32/64-byte wrap bursts with only 8-clock address setup - eliminates inter-byte gaps for streaming firmware reads. |
| Erase/Program Suspend | Allows background read access during long erase (up to 100 ms) or program (up to 1.2 ms) operations - maintains system responsiveness. |
| Security Register Locks | Three 256-byte OTP-locked security registers store cryptographic keys or calibration data immune to field reprogramming. |
| SFDP v1.6 Compliance | Enables automatic host controller configuration of timing parameters (e.g., dummy cycles, drive strength) without hard-coded values. |
| JEDEC ID & Unique Serial | Returns EF4017 (Winbond W25Q64FV) via 9Fh instruction; 64-bit UID accessible via 4Bh - essential for BOM traceability and anti-cloning. |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
|
Use Scenario: Storing primary bootloader and initial firmware image for ARM Cortex-M7 or RISC-V SoCs requiring fast cold-start execution. IC Role / Device Role / Timing Role: Non-volatile boot source accessed via Quad SPI XIP mode; delivers 416 MB/s effective read bandwidth to CPU instruction bus. Use Value: Eliminates external RAM copy step; reduces boot time by >30% versus parallel Flash; supports secure boot via UID-verified signature checks. |
Use Scenario: Dedicated partition for over-the-air (OTA) firmware updates in industrial gateways and smart meters. IC Role / Device Role / Timing Role: Dual-bank update storage with atomic sector swap; uses 4KB sector erase to isolate corrupted update attempts. Use Value: Enables fail-safe rollback; guarantees update integrity via CRC-32 validation against security register-stored keys. |
| Parameter & Calibration Data | Secure Device Identity |
|
Use Scenario: Persistent storage of sensor calibration coefficients, motor tuning profiles, and user preferences in medical diagnostics equipment. IC Role / Device Role / Timing Role: Low-latency, wear-leveling-aware data log using 4KB sector erase and 256-byte page program. Use Value: Achieves >100k write cycles per sector; retains data 20 years at +85°C - exceeds IEC 62304 Class C requirements. |
Use Scenario: Hardware root-of-trust anchor in automotive telematics units requiring ISO/SAE 21434 compliance. IC Role / Device Role / Timing Role: Stores device-specific 64-bit UID and encrypted provisioning keys in OTP-locked security registers. Use Value: Prevents cloning and unauthorized firmware signing; enables PKI certificate binding verified at every boot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64Mb, 104MHz, SOIC-8 only; no TFBGA option; lacks QPI mode and SFDP register. | Lower-cost replacement where quad I/O and auto-configuration are not required. | Select when board layout is fixed for SOIC-8 and host controller does not require QPI or SFDP-driven timing adaptation. |
| S25FL164K0XMFI010 | 64Mb, 80MHz max clock; supports HyperBus interface; includes on-die ECC; different JEDEC ID (014016). | Better suited for safety-critical applications needing error correction and deterministic latency. | Prefer for ASIL-B systems where ECC coverage and AEC-Q100 qualification are mandatory; avoid if QPI bandwidth is critical. |
Compared with W25Q64FVTBIG, MX25L6433FZNI-10G offers cost savings but sacrifices QPI performance and package flexibility, while S25FL164K0XMFI010 adds ECC and safety features at the expense of peak throughput - making W25Q64FVTBIG optimal for high-bandwidth, space-constrained, non-safety-critical embedded designs.
Availability
W25Q64FVTBIG is available at Aetrix Electronics and suitable for boot code storage, firmware update partitions, parameter logging, and secure identity anchoring requiring stable component supply across automotive, industrial, and medical electronics programs.
Supply support for W25Q64FVTBIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial NOR/NAND flash, PSRAM, and mobile DRAM - serving automotive, industrial, and consumer markets since 1987.
The W25Q64FV product line delivers high-speed, low-power serial flash optimized for code execution (XIP), firmware agility, and secure data storage in resource-constrained embedded systems.
FAQ
What is the JEDEC manufacturer and device ID for W25Q64FVTBIG?
The W25Q64FVTBIG returns JEDEC ID EF4017 when queried via the 9Fh instruction - confirming Winbond as manufacturer (EFh) and W25Q64FV family (4017h). This ID is used by bootloaders and flash programmers for automatic device detection and configuration matching.
Does W25Q64FVTBIG support execute-in-place (XIP) operation?
Yes, W25Q64FVTBIG supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks for address setup and 416 MB/s effective throughput, it enables direct CPU instruction fetch without RAM buffering - validated on STM32H7 and NXP i.MX RT series.
How is hardware write protection implemented on W25Q64FVTBIG?
W25Q64FVTBIG provides hardware write protection through the /WP pin (active low) in standard SPI mode, which locks status registers unless overridden by SRP bits. When Quad Enable (QE) is set, /WP becomes IO2 and hardware protection is disabled - software-based BP bits then control sector/block locking.
What package type does W25Q64FVTBIG use, and what are its key mechanical dimensions?
W25Q64FVTBIG uses a 24-ball TFBGA package (8×6 mm footprint, 0.8 mm ball pitch, 0.5 mm standoff), designated package codes TB (5×5-1 ball array) or TC (6×4 ball array). Its low-profile, bottom-termination design supports fine-pitch routing and thermal conduction to internal PCB planes.
Can W25Q64FVTBIG be used in automotive applications requiring extended temperature range?
W25Q64FVTBIG is rated for –40°C to +85°C operation and meets industrial reliability standards, but is not AEC-Q100 qualified. For automotive cabin or under-hood use, Winbond's AEC-Q100-qualified W25Q64JW variant is recommended - W25Q64FVTBIG remains suitable for non-safety-critical infotainment or gateway modules within temperature-spec limits.
W25Q64FVTBIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q64FVTBIG FAQ
1.How can I place an order for W25Q64FVTBIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64FVTBIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64FVTBIG reliable?
The price and inventory of W25Q64FVTBIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVTBIG is usually 5 days.
3.What payment methods are accepted for W25Q64FVTBIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVTBIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64FVTBIG?
W25Q64FVTBIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64FVTBIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64FVTBIG?
For technical support, including W25Q64FVTBIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVTBIG requirements.
6.How does Aetrix verify that W25Q64FVTBIG is sourced from the original manufacturer or authorized distributors?
All W25Q64FVTBIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVTBIG meets industry standards.
7.What is the process for return or replacement of W25Q64FVTBIG?
All W25Q64FVTBIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVTBIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64FVTBIG part is unused and in its original packaging.
Return procedure for W25Q64FVTBIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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