Winbond Electronics Corporation W25Q64FVTCIG

Overview

W25Q64FVTCIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 32,768 × 256-byte pages with uniform 4KB sector erase, 32KB/64KB block erase, and chip erase capabilities. It operates from 2.7V to 3.6V, draws 4mA active current and <1µA in power-down mode, and is used for code storage, XIP execution, firmware updates, and parameter retention in microcontroller-based embedded systems.

For engineers reviewing the W25Q64FVTCIG datasheet, W25Q64FVTCIG pinout, W25Q64FVTCIG application, or W25Q64FVTCIG equivalent, key selection criteria include Quad SPI timing compliance (104MHz CLK, 416MHz effective), JEDEC ID verification (EF4017), SFDP register support, 64-bit unique ID availability, and hardware write protection via /WP and /HOLD pins in standard SPI mode.

Technical Context

The W25Q64FVTCIG implements a multi-mode SPI interface with configurable I/O width: Standard SPI uses unidirectional DI/DO; Dual SPI repurposes DI/DO as bidirectional IO0/IO1; Quad SPI and QPI require QE bit set to enable IO2 (/WP) and IO3 (/HOLD), enabling 4-line data transfer. Its command set includes Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read Quad I/O (E3h), all requiring 8-clock address overhead for true XIP capability.

Internally, it features three 256-byte security registers with OTP locks, volatile/non-volatile status register bits (including BP2–BP0, TB, SEC, CMP, SRP0/SRP1), and Erase/Program Suspend & Resume (75h/7Ah). The device supports JEDEC JESD216-compliant SFDP (5Ah) for automatic configuration discovery and operates across –40°C to +85°C with >100,000 program/erase cycles and >20-year data retention.

Key Specifications

Pinout & Package

W25Q64FVTCIG is packaged in an 8-pin SOIC 208-mil (package code SS), with pin 1 = /CS, pin 2 = DO (IO1), pin 3 = /WP (IO2), pin 4 = GND, pin 5 = DI (IO0), pin 6 = CLK, pin 7 = /HOLD (IO3), pin 8 = VCC. In standard SPI mode, /WP and /HOLD serve hardware protection functions; when Quad SPI or QPI is enabled (QE=1), pins 3 and 7 become IO2 and IO3 respectively.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with W25Q64FVTCIG, MX25L6433FZNI-10G omits QPI and SFDP-reducing host driver complexity but limiting auto-configuration and instruction efficiency-while S25FL164K0XMFI010 trades speed and package compactness for HyperBus compatibility and dual-supply flexibility, making it suitable for legacy Cypress-based designs rather than new high-throughput embedded platforms.

Availability

W25Q64FVTCIG is available at Aetrix Electronics and suitable for industrial control firmware storage, automotive infotainment backup, and IoT edge device OTA updates requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for W25Q64FVTCIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25Q series targets high-performance embedded systems requiring fast, reliable, and secure non-volatile storage with flexible interface options-designed specifically for code execution, firmware updates, and parameter retention in space- and power-constrained environments.

FAQ

What is the JEDEC manufacturer and device ID for W25Q64FVTCIG?

The W25Q64FVTCIG returns JEDEC ID EF4017 when queried using the Read JEDEC ID command (9Fh). This 3-byte value identifies Winbond (EFh) and the specific 64M-bit W25Q64FV family (4017h), enabling automated device detection and driver initialization in host firmware. The ID is verified across all W25Q64FV variants, including W25Q64FVTCIG.

Does W25Q64FVTCIG support execute-in-place (XIP) operation?

Yes, W25Q64FVTCIG supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks of instruction overhead to address memory and 416 MHz effective throughput in Quad I/O mode, it enables direct CPU instruction fetch without copying to RAM. This capability is confirmed in the datasheet's General Description and Functional Descriptions sections for W25Q64FVTCIG.

How is hardware write protection implemented on W25Q64FVTCIG?

W25Q64FVTCIG implements hardware write protection using the /WP pin (Pin 3) in Standard SPI mode, which-when held low-prevents writes to status registers. This function is active only when the Quad Enable (QE) bit is cleared (QE=0); when QE=1 for Quad SPI/QPI, /WP becomes IO2 and hardware protection relies on software-configured BP2–BP0, TB, and SRP bits instead.

What package type does W25Q64FVTCIG use, and what are its dimensions?

W25Q64FVTCIG uses an 8-pin SOIC 208-mil package (package code SS), measuring 5.33 mm × 5.33 mm × 1.98 mm (L × W × H) with 1.27 mm lead pitch. This standard footprint ensures drop-in compatibility with existing PCB layouts designed for industry-standard SOIC-8 serial flash devices, including pin-to-pin alignment with /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC.

Can W25Q64FVTCIG be used in automotive applications?

W25Q64FVTCIG is rated for –40°C to +85°C operation and meets industrial reliability standards (≥100,000 P/E cycles, >20-year retention), but it is not AEC-Q100 qualified. For automotive infotainment or body control modules requiring automotive-grade certification, Winbond offers the AEC-Q100 qualified W25Q64JW variant; W25Q64FVTCIG is suitable for under-hood-adjacent or cabin-located non-safety-critical subsystems where extended temperature range suffices.