Winbond Electronics Corporation W25Q64FVTCJQ

Overview

W25Q64FVTCJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 32,768 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and single 2.7–3.6V supply - used for code execution-in-place (XIP), firmware storage, and boot code in microcontroller-based embedded systems.

For engineers reviewing the W25Q64FVTCJQ datasheet, W25Q64FVTCJQ pinout, W25Q64FVTCJQ application, or W25Q64FVTCJQ equivalent, key selection factors include Quad Enable (QE) bit configuration for IO2/IO3 remapping, JEDEC ID (EF4017) verification, 4KB sector granularity for parameter storage, and TFBGA-24 (8×6mm, 6×4 ball array) package compatibility with high-density PCB layouts.

Technical Context

The W25Q64FVTCJQ implements a multi-mode SPI interface with hardware-selectable operation: Standard SPI (DI/DO unidirectional), Dual SPI (IO0/IO1 bidirectional), Quad SPI (IO0–IO3 active when QE=1), and QPI (full 4-bit data bus with 2-clock instruction cycle). Its command set includes Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read (E3h), enabling up to 416MHz equivalent throughput.

Internally, it features dual status registers (SR1/SR2), programmable block protection (BP2–BP0, TB, SEC), volatile/non-volatile write-enable latching, Erase/Program Suspend & Resume, and three 256-byte security registers with OTP locks - all accessible via standardized instructions including Read SFDP (5Ah), Read Unique ID (4Bh), and JEDEC ID (9Fh).

Key Specifications

Pinout & Package

W25Q64FVTCJQ uses the TFBGA-24 package (8×6 mm, 6×4 ball array, package code TC), with 24 solder balls arranged in a compact grid. Pin functions are defined per ball position; no pins are NC in this configuration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with MX25L6433FZC-10G and S25FL164K0XMFI010, W25Q64FVTCJQ uniquely delivers QPI mode, SFDP auto-discovery, and TFBGA-24 packaging - making it optimal for space-constrained, high-performance XIP applications where instruction flexibility and layout density are critical.

Availability

W25Q64FVTCJQ is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS modules, medical edge devices, and consumer networking equipment requiring stable component supply, long-term lifecycle support, and verified TFBGA-24 (package code TC) sourcing.

Supply support for W25Q64FVTCJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series targets high-reliability embedded systems requiring robust code storage, fast XIP performance, and advanced security - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 alignment and long-term availability.

FAQ

What is the package type and ball configuration of W25Q64FVTCJQ?

W25Q64FVTCJQ uses the TFBGA-24 package with 8×6 mm body size and a 6×4 ball array (package code TC). Ball assignments include dedicated CLK (B2), GND (B3), VCC (B4), /CS (C2), /WP (C4), DO (D2), DI (D3), and /HOLD (D4); all other balls are NC. This configuration supports high-density routing and thermal performance in compact designs.

Does W25Q64FVTCJQ support Quad SPI and QPI modes, and how is QE configured?

Yes, W25Q64FVTCJQ supports both Quad SPI and QPI modes when the Quad Enable (QE) bit in Status Register-2 is set to '1'. Setting QE remaps /WP to IO2 and /HOLD to IO3. The QE bit is non-volatile and programmed via Write Status Register (01h) after Write Enable (06h); it must be verified post-write using Read Status Register-2 (35h).

What JEDEC and unique identifiers does W25Q64FVTCJQ provide?

W25Q64FVTCJQ returns JEDEC ID EF4017 on Read JEDEC ID (9Fh), Manufacturer ID EFh, and Device ID 4017h. It also provides a factory-programmed 64-bit Unique Serial Number readable via Read Unique ID Number (4Bh), enabling device-level traceability and secure firmware binding in production systems.

How does W25Q64FVTCJQ handle write protection for firmware integrity?

W25Q64FVTCJQ implements layered write protection: hardware /WP pin (active-low), software-configurable Block Protect bits (BP2–BP0), Top/Bottom protection (TB), Sector Protection (SEC), and Status Register Protect (SRP0/SRP1). When SRP1=1 and SRP0=0, the status register becomes one-time programmable, preventing further modification of protection settings - critical for locked firmware images.

Is W25Q64FVTCJQ suitable for execute-in-place (XIP) applications, and what features enable this?

Yes, W25Q64FVTCJQ is optimized for XIP via Continuous Read Mode with wrap (0Ch), Fast Read Quad I/O (EBh), and QPI mode - reducing instruction overhead to as few as 8 clocks for address setup. Combined with 104MHz clock support and 416MHz effective bandwidth, it delivers deterministic low-latency code fetches directly from flash, eliminating RAM copy requirements in resource-constrained MCUs.