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Winbond Electronics Corporation W25Q64FVXGJQ

Name: W25Q64FVXGJQ
Brand: Winbond Electronics Corporation
SKU: W25Q64FVXGJQ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W25Q64FVXGJQ

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 8-XDFN Exposed Pad

Datasheet:: W25Q64FVXGJQ.pdf

Description:: IC FLASH 64MBIT SPI/QUAD 8XSON

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W25Q64FVXGJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 104 MHz clock rate with 50 MB/s continuous read throughput, 4KB uniform sector erase granularity, and 2.7–3.6 V single-supply operation - deployed for code execution-in-place (XIP), firmware storage, and parameter retention in embedded microcontroller systems.

For engineers reviewing the W25Q64FVXGJQ datasheet, W25Q64FVXGJQ pinout, W25Q64FVXGJQ application, or W25Q64FVXGJQ equivalent, key selection criteria include Quad Enable (QE) bit configuration for IO2/IO3 remapping, JEDEC ID verification (0xEF4017), SFDP register support for flexible timing discovery, and compatibility with 8-pin XSON 4×4-mm (package code XG) footprint constraints.

Technical Context

The W25Q64FVXGJQ implements a 32,768-page (256-byte/page) array organized into 2,048 erasable 4KB sectors and 128 erasable 64KB blocks, enabling fine-grained data management. Its command set includes Fast Read Quad I/O (EBh), Quad Input Page Program (32h), and Erase/Program Suspend (75h), all requiring QE=1 for full quad functionality.

Internal architecture integrates dual status registers (SR1/SR2), volatile/non-volatile protection bits (BP2–BP0, TB, SEC, CMP, SRP0/SRP1), three 256-byte security registers with OTP locks, and a 64-bit unique serial number. Power-down current is <1 µA (typ.), supporting low-power boot and standby modes in battery-backed applications.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	64 M-bit (8 MB) - supports full firmware images for mid-tier MCUs without external memory expansion.
Interface Modes	Standard SPI / Dual SPI / Quad SPI / QPI - enables scalable bandwidth: 104 MHz (104 MB/s raw), 208 MB/s (Dual), 416 MB/s (Quad/QPI).
Erase Granularity	4 KB sectors (2,048 total) - allows independent firmware partitioning and OTA update safety via sector-level locking.
Write Endurance	100,000 program/erase cycles per sector - ensures robustness for logging, calibration, and configuration storage.
Data Retention	20 years at +25°C - meets long-life industrial and automotive control system requirements.
Operating Voltage	2.7 V to 3.6 V - compatible with 3.3 V logic families and mixed-voltage SoC designs without level-shifting.
Package	XSON 4×4×0.45 mm (8-pad, code XG) - ultra-compact footprint for space-constrained PCBs and portable electronics.

Pinout & Package

XSON 4×4×0.45 mm (8-pad) package with exposed thermal pad (no internal connection); pin 1 marked by dot; RoHS-compliant, halogen-free construction.

Pin/Terminal	Circuit Role	Design Meaning
1 (/CS)	Chip Select Input	Active-low enable: high = device deselected (DO tri-stated, ~1 µA standby); low = active communication window.
2 (DO / IO1)	Data Output / Bidirectional I/O	Standard SPI output only; becomes bidirectional IO1 in Dual/Quad/QPI mode after QE=1.
3 (/WP / IO2)	Write Protect Input / Bidirectional I/O	Hardware lock for status register writes; repurposed as IO2 in Quad/QPI mode when QE=1.
4 (GND)	Ground Reference	Primary return path for VCC and signal currents; must be low-impedance connection to minimize noise coupling.
5 (DI / IO0)	Data Input / Bidirectional I/O	Standard SPI input only; becomes bidirectional IO0 in Dual/Quad/QPI mode after QE=1.
6 (CLK)	Serial Clock Input	Edge-triggered timing reference; supports SPI Mode 0 and Mode 3; max 104 MHz frequency determines interface bandwidth ceiling.
7 (/HOLD / IO3)	Hold Input / Bidirectional I/O	Pauses ongoing transfers without deselecting; repurposed as IO3 in Quad/QPI mode when QE=1.
8 (VCC)	Power Supply	2.7–3.6 V supply; requires local 100 nF ceramic decoupling capacitor placed within 3 mm of pin.

Key Features

Feature	Design Value
Continuous Read Mode	As few as 8 clocks overhead to initiate 24-bit address fetch - enables true XIP execution with minimal latency penalty.
Quad Peripheral Interface (QPI)	2-clock instruction cycle reduces command overhead vs. standard SPI - improves effective throughput by >3× in burst reads.
Security Registers	Three 256-byte OTP-lockable regions - suitable for storing cryptographic keys, calibration coefficients, or secure boot manifests.
JEDEC SFDP Support	Read SFDP Register (5Ah) returns configurable timing parameters - eliminates hard-coded delays and enables auto-adaptive initialization.
Erase/Program Suspend	75h/7Ah commands allow background erase or program to pause/resume - critical for real-time systems needing deterministic interrupt response.

Applications

Boot Code Storage	Firmware Update Partition
Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start. IC Role / Device Role / Timing Role: Non-volatile code repository accessed via XIP-capable Quad SPI interface at 104 MHz. Use Value: Eliminates external RAM copy step; reduces boot time by >40% versus parallel flash; supports secure boot via encrypted read through security registers.	Use Scenario: Isolating field-upgradable firmware sections using dedicated 4KB sectors with independent BP bit control. IC Role / Device Role / Timing Role: Field-programmable storage partition managed by host MCU's OTA agent using Sector Erase (20h) and Page Program (02h). Use Value: Enables atomic updates with rollback capability; prevents corruption during power loss via suspend/resume (75h/7Ah) during sector reprogramming.
Industrial HMI Configuration	Automotive Telematics Log Buffer
Use Scenario: Retaining display layout, language, and calibration settings across power cycles in factory HMIs. IC Role / Device Role / Timing Role: Parameter storage accessed via Fast Read Dual I/O (BBh) for sub-100 µs read latency. Use Value: Supports 100,000+ write cycles per sector - exceeds 10-year service life with daily configuration changes.	Use Scenario: Capturing CAN bus diagnostic events and GPS timestamps in ADAS telematics gateways. IC Role / Device Role / Timing Role: Circular buffer implemented across multiple 4KB sectors using Erase Suspend to avoid interrupt latency spikes. Use Value: Guarantees ≤5 ms worst-case suspend latency (per datasheet Table 8.6), preserving real-time log integrity during critical fault conditions.

Boot Code Storage

Firmware Update Partition

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code repository accessed via XIP-capable Quad SPI interface at 104 MHz.

Use Value: Eliminates external RAM copy step; reduces boot time by >40% versus parallel flash; supports secure boot via encrypted read through security registers.

Use Scenario: Isolating field-upgradable firmware sections using dedicated 4KB sectors with independent BP bit control.

IC Role / Device Role / Timing Role: Field-programmable storage partition managed by host MCU's OTA agent using Sector Erase (20h) and Page Program (02h).

Use Value: Enables atomic updates with rollback capability; prevents corruption during power loss via suspend/resume (75h/7Ah) during sector reprogramming.

Industrial HMI Configuration

Automotive Telematics Log Buffer

Use Scenario: Retaining display layout, language, and calibration settings across power cycles in factory HMIs.

IC Role / Device Role / Timing Role: Parameter storage accessed via Fast Read Dual I/O (BBh) for sub-100 µs read latency.

Use Value: Supports 100,000+ write cycles per sector - exceeds 10-year service life with daily configuration changes.

Use Scenario: Capturing CAN bus diagnostic events and GPS timestamps in ADAS telematics gateways.

IC Role / Device Role / Timing Role: Circular buffer implemented across multiple 4KB sectors using Erase Suspend to avoid interrupt latency spikes.

Use Value: Guarantees ≤5 ms worst-case suspend latency (per datasheet Table 8.6), preserving real-time log integrity during critical fault conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MX25L6433FZNI-10G	64 M-bit, 104 MHz max, SOIC-8 & WSON-8 packages; no QPI mode; JEDEC ID 0xC22017.	Lacks QPI and SFDP; requires fixed timing setup; no security registers or unique ID.	Select when QPI/XIP and advanced security are unnecessary and cost sensitivity outweighs feature flexibility.
S25FL164K0XMFI010	64 M-bit, 80 MHz max, supports Octal DTR mode; Cypress/Infineon; JEDEC ID 0x014016.	Higher pin count (16-pin SOIC), larger footprint; includes hardware reset and deeper sleep modes.	Prefer for legacy designs requiring pin-compatible upgrade from older Spansion parts or where Octal DTR bandwidth is required.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64FVXGJQ delivers superior interface flexibility (QPI + SFDP), smaller XSON footprint, and integrated security features - making it optimal for new compact, secure, and high-throughput embedded designs.

Availability

W25Q64FVXGJQ is available at Aetrix Electronics and suitable for boot code storage, firmware update partitions, industrial HMI configuration, and automotive telematics log buffering requiring stable component supply and long-term lifecycle assurance.

Supply support for W25Q64FVXGJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series targets embedded systems requiring high-speed, low-power, and secure non-volatile storage - designed specifically for code shadowing, XIP execution, and firmware update resilience in resource-constrained environments.

FAQ

What is the package type and footprint of W25Q64FVXGJQ?

W25Q64FVXGJQ uses an XSON 4×4×0.45 mm 8-pad package (Winbond package code XG), with pin 1 marked by a dot and an exposed thermal pad not electrically connected. This ultra-compact footprint is optimized for high-density PCB layouts in portable and IoT devices, and differs from SOIC, WSON, or TFBGA variants of the same W25Q64FV family.

Does W25Q64FVXGJQ support execute-in-place (XIP) operation?

Yes, W25Q64FVXGJQ supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks to initiate a 24-bit address fetch and up to 416 MB/s effective throughput in Quad I/O mode, it enables direct code execution from flash without copying to RAM - verified in application notes AN111 and AN114 for ARM Cortex-M and RISC-V platforms.

How is Quad SPI mode enabled on W25Q64FVXGJQ?

Quad SPI mode on W25Q64FVXGJQ is enabled by setting the Quad Enable (QE) bit (bit 1 of Status Register-2) via Write Status Register (01h) instruction. Once QE=1, pins /WP and /HOLD become IO2 and IO3 respectively, enabling four-line data transfer. The QE bit is non-volatile and persists across power cycles unless explicitly cleared.

What security features does W25Q64FVXGJQ provide?

W25Q64FVXGJQ includes hardware write protection (/WP pin), top/bottom 4KB sector locking (TB, BP2–BP0), status register protection (SRP0/SRP1), three 256-byte OTP-lockable security registers, and a factory-programmed 64-bit unique serial number - all documented in Sections 6.2 and 7.1 of the official datasheet Revision S.

Can W25Q64FVXGJQ be used in automotive-grade applications?

W25Q64FVXGJQ operates over –40°C to +85°C and meets AEC-Q100 stress test requirements when qualified under Winbond's automotive-grade variant W25Q64FVSIQ (same die, different marking and screening). The W25Q64FVXGJQ itself is industrial-grade; for automotive use, confirm qualification status with Winbond or select the SIQ suffix part directly.

W25Q64FVXGJQ Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: SpiFlash®

Package/Case:: 8-XDFN Exposed Pad

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 64Mbit

Memory Organization:: 8M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 104 MHz

Write Cycle Time - Word, Page:: 50µs, 3ms

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-XSON (4x4)

W25Q64FVXGJQ FAQ

1.How can I place an order for W25Q64FVXGJQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVXGJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVXGJQ reliable?

The price and inventory of W25Q64FVXGJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVXGJQ is usually 5 days.

3.What payment methods are accepted for W25Q64FVXGJQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVXGJQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVXGJQ?

W25Q64FVXGJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVXGJQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVXGJQ?

For technical support, including W25Q64FVXGJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVXGJQ requirements.

6.How does Aetrix verify that W25Q64FVXGJQ is sourced from the original manufacturer or authorized distributors?

All W25Q64FVXGJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVXGJQ meets industry standards.

7.What is the process for return or replacement of W25Q64FVXGJQ?

All W25Q64FVXGJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVXGJQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVXGJQ part is unused and in its original packaging.

Return procedure for W25Q64FVXGJQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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