Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q64FVXGJQ TR

Part No.:
W25Q64FVXGJQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-XDFN Exposed Pad
Datasheet:
AetrixW25Q64FVXGJQ TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,547

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q64FVXGJQ TR from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 104 MHz clock rate with 50 MB/s continuous read throughput, organized into 32,768 × 256-byte pages and 2,048 uniform 4KB sectors - deployed for code storage and XIP execution in microcontroller boot loaders and embedded firmware.

For engineers reviewing the W25Q64FVXGJQ TR datasheet, W25Q64FVXGJQ TR pinout, W25Q64FVXGJQ TR application, or W25Q64FVXGJQ TR equivalent, key selection considerations include Quad Enable (QE) bit configuration for IO2/IO3 remapping, 4KB sector granularity for parameter storage, JEDEC ID (EF4017) verification, and compatibility with 2.7–3.6 V supply and -40°C to +85°C industrial temperature range.

Technical Context

The W25Q64FVXGJQ TR implements a SPI-compatible command set with hardware- and software-based write protection, including Block Protect (BP2–BP0), Top/Bottom (TB), Sector Protect (SEC), and Complement Protect (CMP) bits in Status Register-1, plus Quad Enable (QE) in Status Register-2 to reassign /WP and /HOLD as IO2 and IO3. It supports Erase/Program Suspend & Resume for real-time task interruption.

Its architecture enables true Execute-in-Place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes; QPI mode reduces instruction cycle count by consolidating address/data transfers into 2-clock cycles, achieving 416 MHz effective bandwidth using Quad I/O instructions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8,388,608 bytes), enabling full firmware image storage for mid-tier MCUs.
Interface Modes Standard SPI, Dual SPI, Quad SPI, and QPI - selectable via QE bit and instruction set.
Max Clock Frequency 104 MHz (SPI), enabling 208 MHz dual-data-rate or 416 MHz quad-data-rate effective throughput.
Erase Granularity Uniform 4KB sectors (2,048 total), 32KB blocks (1,024), and 64KB blocks (512) - supports fine-grained firmware updates.
Write Endurance 100,000 program/erase cycles per sector - suitable for field-upgradable parameter tables.
Data Retention 20 years at +85°C - validated for long-life industrial deployments without refresh.
Supply Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic systems and tolerant of brown-out conditions.
Operating Temp -40°C to +85°C - qualified for automotive body control and industrial HMI applications.

Pinout & Package

W25Q64FVXGJQ TR uses an 8-pad XSON 4×4×0.45 mm package (package code XG), with gull-wing leads and bottom thermal pad. Pin 1 is marked by a dot; pin 1 function is /CS, pin 2 is DO (IO1), pin 3 is /WP (IO2), pin 4 is GND, pin 5 is DI (IO0), pin 6 is CLK, pin 7 is /HOLD (IO3), and pin 8 is VCC.

Pin/Terminal Circuit Role Design Meaning
/CS (Pin 1) Chip Select Input Active-low enable signal; high-Z output and standby current (<1 µA) when high.
DO / IO1 (Pin 2) Serial Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional data lane in Dual/Quad SPI/QPI modes.
/WP / IO2 (Pin 3) Write Protect Input / Bidirectional I/O Hardware lock for status register writes; repurposed as IO2 when QE=1 in Quad mode.
GND (Pin 4) Ground Reference Primary return path for VCC and all I/O signals; requires low-impedance PCB plane connection.
DI / IO0 (Pin 5) Serial Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional data lane in Dual/Quad SPI/QPI modes.
CLK (Pin 6) Serial Clock Input Edge-triggered timing reference; supports SPI modes 0 and 3; max 104 MHz frequency.
/HOLD / IO3 (Pin 7) Hold Input / Bidirectional I/O Pauses ongoing read/write while selected; repurposed as IO3 when QE=1 in Quad mode.
VCC (Pin 8) Power Supply 2.7–3.6 V single supply; decoupling capacitor (100 nF) required within 5 mm of pin.

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead to 2 clocks per transfer, enabling deterministic XIP latency and eliminating opcode byte gaps.
Continuous Read Mode Supports 8/16/32/64-byte wrap with only 8 clocks to initiate address fetch - critical for real-time code execution.
Security Registers Three 256-byte OTP-lockable registers for keys, calibration data, or secure boot assets - inaccessible after lock.
Erase/Program Suspend Halts active erase or program operation on command (75h), allowing immediate status reads or interrupt service - no data loss.
JEDEC SFDP Support Read SFDP register (5Ah) to auto-detect device parameters (size, timing, erase types) - simplifies driver portability across flash families.
64-bit Unique ID Factory-programmed serial number per die - enables device authentication, traceability, and anti-cloning in production firmware.

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Storing bootloader, OS kernel, and application binaries in programmable logic controllers with field update capability.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support and 4KB sector erase for incremental firmware patches.

Use Value: Enables zero-downtime over-the-air updates by erasing only modified sectors while preserving runtime configuration in adjacent 4KB blocks.

Use Scenario: Holding boot code and UI assets for head-unit systems requiring fast startup and secure firmware validation.

IC Role / Device Role / Timing Role: Boot ROM replacement with QPI-mode fast read and 64-bit unique ID for cryptographic binding to ECUs.

Use Value: Achieves <150 ms cold boot time via Continuous Read Mode and supports secure boot chain using OTP-locked security registers.

Medical Device Configuration Storage IoT Edge Gateway Firmware Image

Use Scenario: Retaining calibrated sensor offsets, user preferences, and regulatory audit logs in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Parameter EEPROM replacement with hardware write-protection (/WP pin + BP bits) and 20-year data retention.

Use Value: Guarantees clinical data integrity across device lifecycle without battery-backed SRAM or wear-leveling firmware overhead.

Use Scenario: Hosting dual firmware images (active + backup) and TLS certificate stores in cellular-connected edge gateways.

IC Role / Device Role / Timing Role: High-reliability code and crypto asset store with Erase/Program Suspend for concurrent OTA download and system operation.

Use Value: Allows background firmware download while maintaining real-time sensor polling - suspend/resume avoids watchdog timeouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 64 M-bit, 104 MHz max clock, but lacks QPI mode and SFDP register; uses different status register layout. No QPI acceleration or auto-discovery - requires fixed driver configuration and manual timing tuning. Choose when legacy SPI-only interface suffices and QPI/XIP is not required.
S25FL164K0XMFI010 64 M-bit, supports Octal DTR mode (up to 200 MHz), includes built-in ECC and sector lockdown, but higher VCC min (2.7–3.6 V same). Offers enhanced reliability for safety-critical firmware; ECC corrects single-bit errors during read; sector lockdown prevents accidental erase. Prefer for ASIL-B systems where error correction and hardware-enforced write locking are mandated.

Compared with MX25L6433FZNI-10G, W25Q64FVXGJQ TR delivers faster XIP performance via QPI and simplifies driver development with SFDP; versus S25FL164K0XMFI010, it trades ECC and sector lockdown for lower cost and broader ecosystem tooling support.

Availability

W25Q64FVXGJQ TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, medical device configuration storage, and IoT edge gateway firmware image applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W25Q64FVXGJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, serial flash, and mobile RAM solutions since 1987, serving industrial, automotive, and consumer markets globally.

The W25Q series targets embedded systems requiring high-speed, low-power, and secure code/data storage - designed specifically for MCU boot, firmware update, and XIP execution in space-constrained designs.

FAQ

What is the JEDEC manufacturer and device ID for W25Q64FVXGJQ TR?

The W25Q64FVXGJQ TR returns JEDEC ID EF4017 upon issuing the Read JEDEC ID (9Fh) command. This 3-byte identifier confirms Winbond as the manufacturer (EFh) and the W25Q64FV device family (4017h), enabling automated flash detection in bootloader initialization routines.

Does W25Q64FVXGJQ TR support Execute-in-Place (XIP) operation?

Yes, W25Q64FVXGJQ TR supports true XIP via Continuous Read Mode with ≤8-clock instruction overhead and configurable wrap lengths (8/16/32/64 bytes). When combined with QPI mode, it eliminates opcode gaps and delivers deterministic latency for direct code execution from flash without RAM copy.

How is Quad SPI mode enabled on W25Q64FVXGJQ TR?

Quad SPI mode on W25Q64FVXGJQ TR is enabled by setting the Quad Enable (QE) bit in Status Register-2 using the Write Status Register (01h) instruction. Once QE=1, pins /WP and /HOLD become IO2 and IO3, enabling four-lane data transfers with instructions like Fast Read Quad I/O (EBh).

What package type does W25Q64FVXGJQ TR use, and what are its key mechanical features?

W25Q64FVXGJQ TR uses the XSON 4×4×0.45 mm package (code XG) with 8 gull-wing leads and an exposed thermal pad. It features a 0.5 mm lead pitch, mold compound compliant with IPC/JEDEC J-STD-020 moisture sensitivity level 3, and is optimized for high-density PCB layouts with minimal footprint.

Can W25Q64FVXGJQ TR be used with standard SPI controllers that do not support Dual/Quad modes?

Yes, W25Q64FVXGJQ TR is fully backward-compatible with standard SPI controllers. It operates in Standard SPI mode (CLK, /CS, DI, DO, /WP, /HOLD) at up to 104 MHz without requiring QE bit setup or pin remapping - all Quad/Dual functionality is optional and disabled by default.

W25Q64FVXGJQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-XDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XSON (4x4)

W25Q64FVXGJQ TR FAQ

1.How can I place an order for W25Q64FVXGJQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVXGJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVXGJQ TR reliable?

The price and inventory of W25Q64FVXGJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVXGJQ TR is usually 5 days.

3.What payment methods are accepted for W25Q64FVXGJQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVXGJQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVXGJQ TR?

W25Q64FVXGJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVXGJQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVXGJQ TR?

For technical support, including W25Q64FVXGJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVXGJQ TR requirements.

6.How does Aetrix verify that W25Q64FVXGJQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q64FVXGJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVXGJQ TR meets industry standards.

7.What is the process for return or replacement of W25Q64FVXGJQ TR?

All W25Q64FVXGJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVXGJQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVXGJQ TR part is unused and in its original packaging.

Return procedure for W25Q64FVXGJQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q64FVXGJQ TR Tags

  • W25Q64FVXGJQ TR
  • W25Q64FVXGJQ TR PDF
  • W25Q64FVXGJQ TR Datasheet
  • W25Q64FVXGJQ TR Specifications
  • W25Q64FVXGJQ TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q64FVXGJQ TR
  • Buy W25Q64FVXGJQ TR
  • W25Q64FVXGJQ TR Price
  • W25Q64FVXGJQ TR Distributor
  • W25Q64FVXGJQ TR Supplier
  • W25Q64FVXGJQ TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER