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Winbond Electronics Corporation W25Q64FVZEJQ
- Part No.:
- W25Q64FVZEJQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64FVZEJQ.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,038
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Product details
Overview
W25Q64FVZEJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 104 MHz clock frequency with 50 MB/s continuous read throughput. It features uniform 4KB sectors (2,048 total), 32KB/64KB blocks, 256-byte page programming, and hardware write protection via /WP and /HOLD pins. It is used for code storage, XIP execution, firmware updates, and parameter retention in microcontroller-based embedded systems.
For engineers reviewing the W25Q64FVZEJQ datasheet, W25Q64FVZEJQ pinout, W25Q64FVZEJQ application, or W25Q64FVZEJQ equivalent, key selection considerations include quad I/O timing compliance, JEDEC ID (EF4017), SFDP register support, 2.7–3.6 V single-supply operation, and compatibility with SPI mode 0/3 - all critical for boot ROM, secure firmware loading, and space-constrained industrial controllers.
Technical Context
The W25Q64FVZEJQ implements a multi-mode serial interface: Standard SPI uses unidirectional DI/DO; Dual/Quad SPI repurposes pins as bidirectional IO0–IO3 when Quad Enable (QE) bit is set in Status Register-2; QPI enables 4-bit instruction/data transfers with reduced command overhead. Its internal architecture includes a 256-byte page buffer, sector/block erase logic, and three 256-byte security registers with OTP locks.
It supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes. Erase/program suspend/resume functionality enables concurrent background operations, while JEDEC-standard manufacturer/device ID (9Fh), 64-bit unique serial number (4Bh), and SFDP (5Ah) ensure interoperability and configuration portability across toolchains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB); supports firmware images up to 8 MiB without external expansion. |
| Interface Modes | Standard/Dual/Quad SPI + QPI; enables flexible bandwidth scaling from 104 MHz (single-line) to 416 MHz equivalent (quad I/O). |
| Max Clock Frequency | 104 MHz; delivers 50 MB/s sustained read rate using Fast Read Quad I/O (6Bh) or QPI instructions. |
| Erase Granularity | Uniform 4 KB sectors (2,048), 32 KB blocks (1,024), 64 KB blocks (128); allows fine-grained firmware partitioning and OTA update safety. |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention at +85°C; suitable for long-life industrial logging and configuration storage. |
| Supply Voltage | 2.7 V to 3.6 V; compatible with 3.3 V logic domains and brown-out tolerant power rails. |
| Operating Temp | −40°C to +85°C; qualified for extended-temperature industrial and automotive cabin applications. |
| Security Features | Hardware /WP and /HOLD pins; software BP/TB/SEC bits; 64-bit unique ID; three 256-byte OTP-locked security registers. |
Pinout & Package
W25Q64FVZEJQ is packaged in an 8-pad WSON 8x6-mm (JEDEC MO-241AC, package code ZE), with exposed pad for thermal dissipation and no internal die attach pad connection. Pin 1 is marked by a dot or beveled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before accepting commands; places DO in high-Z when deasserted. |
| 2 DO (IO1) | Data Output / Quad I/O Line 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI; carries read data or status on falling CLK edge. |
| 3 /WP (IO2) | Write Protect Input / Quad I/O Line 2 | Active-low hardware lock for status register writes; disabled as /WP when QE=1 (becomes IO2 for quad data). |
| 4 GND | Ground Reference | Primary return path for VCC and I/O signals; requires low-impedance PCB plane for noise immunity during high-speed reads. |
| 5 DI (IO0) | Data Input / Quad I/O Line 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI; carries instructions, addresses, or write data on rising CLK edge. |
| 6 CLK | Serial Clock Input | Master-generated timing signal; supports SPI modes 0 and 3; determines maximum interface speed (up to 104 MHz). |
| 7 /HOLD (IO3) | Hold Input / Quad I/O Line 3 | Active-low pause control; suspends ongoing transfers without deselecting device; disabled as /HOLD when QE=1 (becomes IO3). |
| 8 VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm of pin for stable high-frequency operation. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to 2 clocks per byte vs. 8+ in standard SPI, enabling deterministic XIP latency for real-time boot code. |
| Continuous Read Mode | Supports 8/16/32/64-byte wrap; eliminates repeated address retransmission, cutting bus traffic by >40% during sequential firmware fetches. |
| Erase/Program Suspend | Allows interrupting a sector erase or page program to service a higher-priority read request, improving system responsiveness in multitask environments. |
| SFDP Register (5Ah) | Provides standardized, vendor-agnostic parameter table for automatic driver configuration - eliminates hardcoded timing constants in bootloader code. |
| 64-bit Unique Serial Number | Enables device-specific cryptographic key binding and secure firmware binding without external EEPROM or provisioning infrastructure. |
| Three 256-byte Security Registers | OTP-lockable storage for keys, certificates, or calibration data; prevents runtime overwrite while allowing one-time field programming during manufacturing. |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot ROM |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters for programmable logic controllers deployed in factory automation environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile code storage executing directly via XIP; handles boot sequence, firmware validation, and runtime parameter persistence. Use Value: 4KB sector granularity enables atomic firmware updates without erasing full image; 20-year data retention ensures reliability over equipment lifetime without maintenance. |
Use Scenario: Hosting boot code and OS kernel for head-unit microcontrollers in vehicles where fast cold-boot (<500 ms) and anti-rollback protection are mandatory. IC Role / Device Role / Timing Role: Boot ROM accessed via QPI at 104 MHz; provides authenticated, encrypted firmware load under ISO 21434-compliant secure boot flow. Use Value: 50 MB/s read throughput meets automotive boot timing budgets; 64-bit unique ID binds firmware to hardware for tamper-evident traceability. |
| Medical Device Configuration Memory | Smart Meter Firmware Vault |
|
Use Scenario: Retaining calibrated sensor offsets, user preferences, and audit logs in Class II medical instruments requiring FDA 21 CFR Part 11 compliance. IC Role / Device Role / Timing Role: Secure parameter store with hardware write-protection (/WP pin + BP bits); stores time-stamped event logs and calibration coefficients. Use Value: Three OTP-locked security registers hold cryptographic keys for log signing; 100,000-cycle endurance supports daily recalibration over 10+ years. |
Use Scenario: Storing tariff tables, firmware patches, and encryption keys in utility smart meters subject to IEC 62056 and DLMS/COSEM standards. IC Role / Device Role / Timing Role: Firmware vault with dual protection: /HOLD pin for safe field updates during power transitions; SFDP register for auto-adapting to meter MCU's SPI controller. Use Value: JEDEC ID and SFDP ensure interoperability across meter generations; top/bottom block protection isolates critical bootloader from field-updatable application code. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64 M-bit, 104 MHz max, SOIC-8 only; lacks QPI mode and SFDP register; JEDEC ID = C22017. | No QPI or SFDP support limits XIP determinism and driver portability; suitable only for legacy SPI-only designs. | Choose only if QPI/XIP and auto-configuration are unnecessary and SOIC-8 footprint is fixed. |
| S25FL164K0XMFI010 | 64 M-bit, 80 MHz max, supports Octal DTR but no QPI; includes HyperBus interface; JEDEC ID = 014017. | Higher pin count (16-pin SOIC/WSON) and different command set increase layout complexity and require driver rewrite. | Select when migrating to Cypress/Infineon ecosystem or needing HyperBus compatibility; not drop-in for W25Q64FVZEJQ. |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64FVZEJQ uniquely balances QPI-enabled XIP performance, SFDP-driven configurability, and WSON-8 packaging - making it optimal for new designs prioritizing boot speed, firmware security, and PCB area efficiency.
Availability
W25Q64FVZEJQ is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot ROM, medical device configuration memory, and smart meter firmware vault applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for W25Q64FVZEJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25Q series targets high-reliability embedded systems requiring fast, secure, and space-efficient non-volatile storage - designed specifically for code shadowing, XIP execution, and firmware update resilience in resource-constrained MCUs.
FAQ
What is the package type and footprint of W25Q64FVZEJQ?
W25Q64FVZEJQ uses an 8-pad WSON 8x6-mm package (JEDEC MO-241AC, package code ZE) with exposed thermal pad. It has a standard 0.5 mm pitch, 2.1 mm body height, and requires solder mask defined pads per Winbond's recommended layout guidelines. This compact footprint supports high-density PCB designs in space-constrained applications like wearables and IoT edge nodes.
Does W25Q64FVZEJQ support execute-in-place (XIP) operation?
Yes, W25Q64FVZEJQ supports true XIP via Continuous Read Mode with wrap lengths of 8/16/32/64 bytes and ≤8-clock instruction overhead. When configured for QPI or Fast Read Quad I/O, it delivers deterministic access latency ideal for boot code execution directly from flash - eliminating RAM copy delays and reducing system BOM cost.
How is hardware write protection implemented on W25Q64FVZEJQ?
W25Q64FVZEJQ implements hardware write protection through the active-low /WP pin, which - when asserted - prevents writes to status registers regardless of software settings. Combined with Block Protect (BP2–BP0), Top/Bottom (TB), and Sector Protect (SEC) bits, it enables selective locking of 4KB sectors or entire memory regions. The /WP function is disabled when Quad Enable (QE) is set.
What JEDEC and identification commands does W25Q64FVZEJQ respond to?
W25Q64FVZEJQ responds to standard JEDEC commands: Read JEDEC ID (9Fh) returns EF4017; Read Manufacturer/Device ID (90h) returns EF 4017; Read Unique ID (4Bh) outputs a factory-programmed 64-bit value; Read SFDP Register (5Ah) provides standardized timing and feature parameters. These enable automated driver initialization and cross-vendor compatibility verification.
Can W25Q64FVZEJQ suspend erase or program operations?
Yes, W25Q64FVZEJQ supports Erase/Program Suspend (75h) and Resume (7Ah) commands. This allows interrupting a sector erase or page program to service a high-priority read request - essential for real-time systems where deterministic response latency must be guaranteed even during background flash maintenance.
W25Q64FVZEJQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64FVZEJQ FAQ
1.How can I place an order for W25Q64FVZEJQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64FVZEJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64FVZEJQ reliable?
The price and inventory of W25Q64FVZEJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVZEJQ is usually 5 days.
3.What payment methods are accepted for W25Q64FVZEJQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVZEJQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64FVZEJQ?
W25Q64FVZEJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64FVZEJQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64FVZEJQ?
For technical support, including W25Q64FVZEJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVZEJQ requirements.
6.How does Aetrix verify that W25Q64FVZEJQ is sourced from the original manufacturer or authorized distributors?
All W25Q64FVZEJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVZEJQ meets industry standards.
7.What is the process for return or replacement of W25Q64FVZEJQ?
All W25Q64FVZEJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVZEJQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64FVZEJQ part is unused and in its original packaging.
Return procedure for W25Q64FVZEJQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q64FVZEJQ Tags
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M24C02-WMN6TP
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