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Winbond Electronics Corporation W25Q64FVZEJQ TR

Part No.:
W25Q64FVZEJQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q64FVZEJQ TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,887

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Product details

Overview

W25Q64FVZEJQ TR from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 104 MHz clock rate with 50 MB/s continuous read throughput, 4KB uniform sector erase granularity, and integrated hardware write protection - deployed for code storage and XIP execution in microcontroller boot loaders and embedded firmware.

For engineers reviewing the W25Q64FVZEJQ TR datasheet, W25Q64FVZEJQ TR pinout, W25Q64FVZEJQ TR application, or W25Q64FVZEJQ TR equivalent, key selection considerations include Quad Enable (QE) bit configuration for IO2/IO3 remapping, /WP and /HOLD pin availability in Quad mode, 2.7–3.6 V supply compatibility, and TFBGA-24 (8×6 mm, 6×4 ball array) package mechanical fit.

Technical Context

The W25Q64FVZEJQ TR implements a SPI-compatible command set with dual- and quad-I/O modes enabled via non-volatile QE bit in Status Register-2; when QE=1, /WP and /HOLD pins become IO2 and IO3, disabling their hardware protection functions. It supports standard SPI Mode 0 and Mode 3 timing, with instruction overhead reduced to as few as 8 clocks for address setup in Continuous Read mode.

Internal architecture includes 32,768 × 256-byte programmable pages, 2,048 erasable 4KB sectors, and 128 erasable 64KB blocks; erase/program suspend/resume capability enables concurrent background operations, while three 256-byte security registers support OTP locking and secure parameter storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 M-bit (8 MB), organized as 32,768 pages × 256 bytes - enables full firmware image storage for mid-tier MCUs.
Interface SupportStandard SPI, Dual SPI, Quad SPI, and QPI - selectable via QE bit; QPI reduces instruction overhead for high-throughput XIP.
Max Clock Frequency104 MHz (SPI), 208 MHz equiv. (Dual I/O), 416 MHz equiv. (Quad I/O) - delivers 50 MB/s sustained read bandwidth.
Erase GranularityUniform 4KB sectors, plus 32KB and 64KB blocks - allows fine-grained firmware update partitioning without full chip erase.
Write Endurance100,000 program/erase cycles per sector - supports field firmware updates over product lifetime.
Data Retention20 years at +25°C - ensures long-term reliability for industrial and automotive applications.
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V logic systems and low-power embedded designs.
Operating Temp−40°C to +85°C - qualified for extended industrial temperature range operation.

Pinout & Package

W25Q64FVZEJQ TR uses an 24-ball TFBGA package (8×6 mm, 6×4 ball array, package code TC), with no exposed pad. Pin functions are defined per ball position; all NC balls must remain unconnected.

Pin/TerminalCircuit RoleDesign Meaning
B2CLKSerial clock input; timing reference for all SPI/QPI transfers; requires clean, low-jitter source for reliable high-speed reads.
B3GNDDigital ground reference; must be connected to system ground plane with low-inductance path to minimize noise coupling.
B4VCCCore power supply (2.7–3.6 V); requires local 1 µF ceramic decoupling capacitor placed within 5 mm of ball.
C2/CSChip select input; active-low enable; must transition high→low before each new instruction sequence.
C4/WP (IO2)Hardware write protect input (standard mode); becomes IO2 in Quad/QPI mode when QE=1 - disables hardware lock during quad operation.
D2DO (IO1)Data output (standard mode); becomes bidirectional IO1 in Dual/Quad/QPI - used for data transfer in multi-line protocols.
D3DI (IO0)Data input (standard mode); becomes bidirectional IO0 in Dual/Quad/QPI - carries instructions, addresses, and data on rising CLK edge.
D4/HOLD (IO3)Hold input (standard mode); becomes IO3 in Quad/QPI mode when QE=1 - suspends ongoing transfers without deselecting device.

Key Features

FeatureDesign Value
Continuous Read ModeEnables true XIP with ≤8-clock instruction overhead per 24-bit address - eliminates external RAM buffering for boot code execution.
Quad Peripheral Interface (QPI)Reduces command latency by encoding multiple instructions per cycle - improves effective throughput beyond raw clock rate limits.
Erase/Program Suspend & ResumeAllows foreground read access during background erase/program - critical for real-time systems requiring uninterrupted data access.
64-bit Unique Serial NumberFactory-programmed per-device ID - enables secure device authentication and firmware binding in IoT deployments.
Security Registers (3 × 256 B)OTP-lockable storage for keys, calibration data, or credentials - isolated from main array to prevent accidental overwrite.
SFDP Register SupportJEDEC-standard parameter table accessible via 5Ah command - enables automatic driver configuration without hard-coded timing values.

Applications

Boot Code StorageFirmware Over-the-Air (OTA)

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M and RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface - directly executes startup routines without RAM copy.

Use Value: Reduces boot time by >40% vs. parallel flash; eliminates external SRAM dependency for initial code fetch.

Use Scenario: Securely storing delta firmware patches in smart meters and industrial gateways with limited update bandwidth.

IC Role / Device Role / Timing Role: Dual-bank capable flash enabling atomic firmware swap - maintains operational continuity during update.

Use Value: Supports A/B partitioning with 4KB sector granularity, allowing verified patch application without runtime interruption.

Secure Parameter StorageAudio/Video Buffering

Use Scenario: Holding calibrated sensor offsets, cryptographic keys, and device-specific certificates in medical diagnostic equipment.

IC Role / Device Role / Timing Role: Isolated security register bank with OTP lock bits - prevents runtime modification of sensitive data.

Use Value: Meets IEC 62304 Class C software safety requirements via hardware-enforced write protection.

Use Scenario: Streaming compressed audio frames from MCU to DAC in voice-controlled home appliances.

IC Role / Device Role / Timing Role: High-bandwidth serial flash acting as intermediate buffer - supplies 50 MB/s burst reads to sustain 24-bit/96 kHz playback.

Use Value: Eliminates need for external PSRAM; reduces BOM cost and PCB area while maintaining glitch-free audio output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L6433FZNI-10G64 M-bit, 104 MHz max, SOIC-8 and TFBGA-24 packages; lacks QPI mode and SFDP register.No QPI instruction set or auto-configurable timing - requires fixed driver implementation and manual timing tuning.Choose when QPI and SFDP are unnecessary and legacy SPI-only compatibility is prioritized.
S25FL164K0XMFI01064 M-bit, 80 MHz max, TFBGA-24; supports Octal DTR mode but not QPI; includes 4KB sector + 64KB block erase.Lower max clock limits throughput to ~40 MB/s; Octal DTR requires more complex controller support than QPI.Prefer when migrating from Cypress/Fujitsu platforms with existing Octal DTR drivers and timing constraints.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64FVZEJQ TR delivers higher sustained read bandwidth via QPI, automated configuration via SFDP, and broader erase flexibility - making it optimal for new designs requiring XIP efficiency and firmware agility.

Availability

W25Q64FVZEJQ TR is available at Aetrix Electronics and suitable for industrial control systems, automotive infotainment modules, and IoT edge gateways requiring stable component supply across multi-year production cycles.

Supply support for W25Q64FVZEJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage devices for embedded systems.

The W25Q series targets high-performance, space-constrained applications requiring fast code execution, secure parameter storage, and flexible erase architecture - optimized for MCU boot, OTA updates, and real-time data logging.

FAQ

What is the package type and footprint of the W25Q64FVZEJQ TR?

The W25Q64FVZEJQ TR uses a 24-ball TFBGA package measuring 8 mm × 6 mm with a 6×4 ball array (package code TC). It has no thermal pad, requires 0.5 mm pitch routing, and follows JEDEC MO-276AA mechanical specifications - compatible with standard reflow profiles for lead-free assembly.

Does the W25Q64FVZEJQ TR support execute-in-place (XIP) operation?

Yes, the W25Q64FVZEJQ TR supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks for address setup and 416 MHz equivalent throughput, it enables direct code execution from flash without RAM loading - validated for ARM Cortex-M4/M7 and RISC-V cores.

How does the Quad Enable (QE) bit affect pin functionality on the W25Q64FVZEJQ TR?

When the QE bit in Status Register-2 is set to 1, the /WP and /HOLD pins on the W25Q64FVZEJQ TR become IO2 and IO3 respectively, enabling full Quad SPI and QPI operation. This remapping disables hardware write protection and hold functions - design must implement software-based equivalents if those features are required.

What erase options are available on the W25Q64FVZEJQ TR?

The W25Q64FVZEJQ TR supports four erase granularities: 4KB sector erase (2,048 sectors), 32KB block erase (512 blocks), 64KB block erase (128 blocks), and full chip erase. All erase operations are internally timed and verified, with suspend/resume capability to allow concurrent read access during background erase.

Is the W25Q64FVZEJQ TR compatible with standard SPI controllers?

Yes, the W25Q64FVZEJQ TR is fully backward-compatible with standard SPI controllers using Mode 0 (CPOL=0, CPHA=0) or Mode 3 (CPOL=1, CPHA=1). It uses DI/DO pins exclusively in standard mode and requires no hardware changes to operate at up to 104 MHz - only firmware initialization to configure QE and status registers.

W25Q64FVZEJQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q64FVZEJQ TR FAQ

1.How can I place an order for W25Q64FVZEJQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVZEJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVZEJQ TR reliable?

The price and inventory of W25Q64FVZEJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVZEJQ TR is usually 5 days.

3.What payment methods are accepted for W25Q64FVZEJQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVZEJQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVZEJQ TR?

W25Q64FVZEJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVZEJQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVZEJQ TR?

For technical support, including W25Q64FVZEJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVZEJQ TR requirements.

6.How does Aetrix verify that W25Q64FVZEJQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q64FVZEJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVZEJQ TR meets industry standards.

7.What is the process for return or replacement of W25Q64FVZEJQ TR?

All W25Q64FVZEJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVZEJQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVZEJQ TR part is unused and in its original packaging.

Return procedure for W25Q64FVZEJQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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