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Winbond Electronics Corporation W25Q64FWBYIG TR

Part No.:
W25Q64FWBYIG TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-UFBGA, WLCSP
Datasheet:
AetrixW25Q64FWBYIG TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 16WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,584

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Product details

Overview

W25Q64FWBYIG TR from Winbond is a 1.8V, 64M-bit (8MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces. It features uniform 4KB sectors, 104MHz max clock frequency, 50MB/s continuous read throughput, and operates from -40°C to +85°C. It enables execute-in-place (XIP) code execution in resource-constrained embedded systems such as IoT edge nodes and MCU boot storage.

For engineers reviewing the W25Q64FWBYIG TR datasheet, W25Q64FWBYIG TR pinout, W25Q64FWBYIG TR application, or W25Q64FWBYIG TR equivalent, key selection considerations include Quad Enable (QE) bit configuration, /WP and /HOLD dual-function behavior in Quad mode, sector-level write protection granularity, and 1.65–1.95V supply compatibility with low-power microcontrollers.

Technical Context

The W25Q64FWBYIG TR implements a flexible SPI command architecture with three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI/QPI (IO0–IO3). Its internal block diagram includes a 256-byte page buffer, SFDP register for discoverable parameters, and three 256-byte security registers with OTP locks.

Functional operation depends on volatile/non-volatile status register bits-including Quad Enable (QE) in Status Register-2, Block Protect (BP2–BP0), Top/Bottom (TB), and Security Register Lock (LB3–LB1)-which govern interface mode, memory protection scope, and hardware pin reassignment (/WP → IO2, /HOLD → IO3 when QE=1).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density64M-bit (8MB) organized as 32,768 × 256-byte pages
Supply Voltage1.65V to 1.95V - compatible with 1.8V logic families and ultra-low-power MCUs
Max Clock Frequency104MHz - enables 416MB/s effective Quad I/O throughput (104MHz × 4)
Erase Granularity4KB sector / 32KB block / 64KB block / full chip - supports fine-grained firmware update partitioning
Write Endurance100,000 program/erase cycles per sector - suitable for field-upgradable firmware storage
Data Retention20 years at +25°C - ensures long-term reliability in industrial deployments
Interface ModesStandard SPI, Dual SPI, Quad SPI, QPI - selectable via instruction set and QE bit; QPI reduces instruction overhead to 2 clocks
Security Features64-bit unique ID, SFDP register, 3×256B security registers with OTP locks - enables secure boot and device authentication

Pinout & Package

W25Q64FWBYIG TR uses an 8-pin WSON 6×5-mm package (Package Code ZP), with exposed pad for thermal dissipation and space-constrained PCB layouts.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable; high-impedance DO/IO pins when deasserted; required high-to-low transition after power-up before instruction acceptance
DO (IO1)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; bidirectional I/O1 in Dual/Quad modes; high-impedance during /HOLD assertion
/WP (IO2)Write Protect Input / Bidirectional I/OHardware write lock for status register when QE=0; becomes IO2 in Quad mode (QE=1); active-low
GNDGround ReferencePrimary return path for VCC and all I/O signals; must be low-impedance for stable timing and noise immunity
DI (IO0)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; bidirectional I/O0 in Dual/Quad modes; used for instruction/address/data loading on CLK rising edge
CLKSerial Clock InputMaster-generated timing signal; supports SPI Mode 0 and Mode 3; determines maximum data rate and setup/hold margins
/HOLD or /RESET (IO3)Hold/Reset Input / Bidirectional I/OPauses ongoing SPI transfer when asserted low (QE=0); becomes IO3 in Quad mode (QE=1); configurable via Status Register
VCCPower Supply1.65–1.95V core supply; decoupling capacitor required near pin to suppress switching noise and ensure stable erase/program operation

Key Features

Feature Design Value
Continuous Read ModeAs few as 8 clocks to address memory with wrap support (8/16/32/64-byte), enabling true XIP without external buffering
Quad Peripheral Interface (QPI)Reduces instruction overhead from 8 clocks to 2 clocks per command, improving system-level throughput in high-frequency MCU applications
Erase/Program Suspend & ResumeAllows background operations (e.g., reading while erasing a sector), critical for real-time firmware update without interrupt latency
Individual Sector/Block LockEnables per-sector hardware write protection via 36h/39h instructions - isolates bootloader region from application updates
JEDEC-compliant SFDP RegisterProvides standardized, read-only parameter table (5Ah) for automatic driver initialization across toolchains and OS bootloaders
1.8V Low-Power Operation4mA active current and <1µA power-down current - extends battery life in always-on sensor nodes and wearable devices

Applications

MCU Boot Memory Firmware Storage

Use Scenario: Storing boot code for ARM Cortex-M4/M7 or RISC-V SoCs requiring fast, reliable startup without external RAM copy.

IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed directly via Quad SPI XIP; delivers 50MB/s sustained read for deterministic boot timing.

Use Value: Eliminates boot ROM dependency and reduces BOM count by enabling direct execution from flash, cutting boot time by >40% vs. parallel NOR.

Use Scenario: Holding field-upgradable firmware images in industrial gateways with dual-bank OTA capability.

IC Role / Device Role / Timing Role: Dual-image storage partitioned across 4KB sectors; supports atomic swap using sector erase and page program with suspend/resume.

Use Value: Enables zero-downtime firmware updates with verified rollback - critical for unattended remote infrastructure.

Secure Device Identity Parameter & Configuration Storage

Use Scenario: Providing cryptographically bound identity for TLS certificate provisioning in smart metering endpoints.

IC Role / Device Role / Timing Role: Source of immutable 64-bit unique ID and OTP-locked security registers holding root keys and attestation certificates.

Use Value: Meets IEC 62443-3-3 SL2 requirements for hardware-rooted device identity without external secure element.

Use Scenario: Retaining calibration data, network credentials, and user preferences across power cycles in medical handhelds.

IC Role / Device Role / Timing Role: Non-volatile parameter store with individual sector locking (36h/39h) to prevent accidental overwrite of critical settings.

Use Value: Guarantees data integrity over 20-year lifetime and 100k+ write cycles - exceeds IEC 60601-1 endurance requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G3.3V supply only; no QPI mode; 80MHz max clock; lacks SFDP register and security registersSuitable for legacy 3.3V designs without XIP or secure boot needsSelect only if voltage compatibility and QPI/XIP are not required; verify /WP and /HOLD pin behavior differs
S25FL164K0XMFI0101.8V supply; 80MHz max clock; HyperBus interface option; includes ECC but no OTP security registersBetter for high-reliability automotive (AEC-Q100 Grade 2) where ECC corrects bit errors in safety-critical codePrefer when functional safety compliance (ISO 26262 ASIL-B) is mandatory; avoid if QPI throughput or 64-bit UID is essential

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64FWBYIG TR uniquely combines 104MHz Quad SPI, QPI mode, SFDP, and OTP-secured 64-bit UID in a 1.8V WSON package - making it optimal for cost-sensitive, secure, high-throughput embedded boot and firmware storage.

Availability

W25Q64FWBYIG TR is available at Aetrix Electronics and suitable for MCU boot memory, firmware storage, secure device identity, and parameter/configuration storage requiring stable component supply across industrial, medical, and IoT production programs.

Supply support for W25Q64FWBYIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, serial flash, and mobile DRAM solutions since 1987.

The W25Q series was designed specifically for embedded systems needing high-speed, low-voltage, secure serial NOR flash - targeting code execution, firmware updates, and trusted identity in space- and power-constrained environments.

FAQ

What is the operating voltage range for the W25Q64FWBYIG TR?

The W25Q64FWBYIG TR operates from 1.65V to 1.95V. This narrow 1.8V nominal range ensures compatibility with modern ultra-low-power microcontrollers and eliminates level-shifting requirements in battery-powered designs. Operation outside this range may cause unreliable read/write behavior or permanent damage, as confirmed in Section 9.2 of the datasheet.

Does the W25Q64FWBYIG TR support execute-in-place (XIP) functionality?

Yes, the W25Q64FWBYIG TR supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks to address memory and up to 50MB/s sustained read throughput, it enables direct code execution from flash without copying to RAM - validated in Section 1 and Figure 3 of the datasheet.

How does the /WP and /HOLD pin behavior change in Quad SPI mode?

When the Quad Enable (QE) bit in Status Register-2 is set to 1, the /WP pin becomes IO2 and /HOLD becomes IO3 - disabling their hardware protection functions. This reassignment is mandatory for Quad SPI operation and is documented in Sections 4.3, 4.4, and 6.1.3 of the datasheet. Hardware write protection remains available only in Standard/Dual SPI mode (QE=0).

What package type is used by the W25Q64FWBYIG TR?

The W25Q64FWBYIG TR uses an 8-pin WSON 6×5-mm package with exposed thermal pad (Package Code ZP), as specified in Section 10.3 of the datasheet. This compact, lead-free, RoHS-compliant package supports reflow soldering and provides superior thermal performance versus SOIC for high-density PCB layouts.

Can the W25Q64FWBYIG TR be used for secure boot applications?

Yes, the W25Q64FWBYIG TR supports secure boot via its 64-bit unique ID, three 256-byte security registers with OTP locks (LB1–LB3), and JEDEC SFDP register. These features allow binding cryptographic keys to hardware identity and storing signed firmware manifests - capabilities explicitly cited in Section 2 (Features) and Section 7.1.9 of the datasheet.

W25Q64FWBYIG TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-UFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-WLCSP (2.47x3.12)

W25Q64FWBYIG TR FAQ

1.How can I place an order for W25Q64FWBYIG TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FWBYIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FWBYIG TR reliable?

The price and inventory of W25Q64FWBYIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FWBYIG TR is usually 5 days.

3.What payment methods are accepted for W25Q64FWBYIG TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FWBYIG TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FWBYIG TR?

W25Q64FWBYIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FWBYIG TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FWBYIG TR?

For technical support, including W25Q64FWBYIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FWBYIG TR requirements.

6.How does Aetrix verify that W25Q64FWBYIG TR is sourced from the original manufacturer or authorized distributors?

All W25Q64FWBYIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FWBYIG TR meets industry standards.

7.What is the process for return or replacement of W25Q64FWBYIG TR?

All W25Q64FWBYIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FWBYIG TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FWBYIG TR part is unused and in its original packaging.

Return procedure for W25Q64FWBYIG TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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