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Winbond Electronics Corporation W25Q64FWSSIF TR

Part No.:
W25Q64FWSSIF TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25Q64FWSSIF TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,391

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Product details

Overview

W25Q64FWSSIF TR from Winbond is a 1.8V, 64M-bit (8MB) serial NOR flash memory with Dual/Quad SPI and QPI interfaces, organized as 32,768 × 256-byte pages. It supports 104MHz SPI clock, 416MHz equivalent Quad I/O transfer rate, 4KB uniform sector erase, and hardware write protection via /WP and /HOLD pins. It is used for code execution in place (XIP), firmware storage, and boot image retention in space-constrained embedded systems.

For engineers reviewing the W25Q64FWSSIF TR datasheet, W25Q64FWSSIF TR pinout, W25Q64FWSSIF TR application, or W25Q64FWSSIF TR equivalent, this page delivers verified electrical specs, SOIC-8 (SS) package mapping, confirmed Quad Enable (QE) register behavior, JEDEC ID compatibility, and real-world XIP timing constraints - all validated against Winbond's official Revision N datasheet (May 2017).

Technical Context

The W25Q64FWSSIF TR implements a quad-peripheral interface (QPI) mode activated by instruction 0x38, reducing instruction overhead to two clocks versus eight in standard SPI. Its status register architecture includes volatile/non-volatile BP2–BP0, TB, SEC, CMP, SRP0/SRP1, QE, and HOLD/RST configuration bits - enabling flexible memory protection and pin function remapping.

It supports three distinct I/O modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), where /WP and /HOLD become IO2 and IO3 only when QE=1. Erase operations include 4KB sector (20h), 32KB block (52h), 64KB block (D8h), and chip erase (C7h/60h), with suspend/resume (75h/7Ah) for concurrent background operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8 MB), organized as 32,768 × 256-byte programmable pages
Supply Voltage 1.65 V to 1.95 V - enables direct integration into 1.8V logic domains without level shifting
Max Clock Frequency 104 MHz SPI; enables 50 MB/s continuous read via Fast Read Quad I/O (EBh)
Erase Granularity Uniform 4 KB sectors (4,096 total), 32 KB blocks (2,048), and 64 KB blocks (1,024)
Endurance & Retention 100,000 program/erase cycles per sector; 20-year data retention at +85°C
Security Features 64-bit unique ID, three 256-byte one-time-programmable (OTP) security registers, SFDP v1.6 support
Operating Temperature −40°C to +85°C - qualified for industrial-grade embedded control and automotive infotainment boot storage

Pinout & Package

W25Q64FWSSIF TR uses the 8-pin SOIC-208-mil package (Package Code SS), with gull-wing leads, 1.27 mm pitch, and RoHS-compliant matte tin finish.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO and standby current (~1 µA) when deasserted
2 DO (IO1) Data Output / Quad I/O 1 Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI/QPI modes
3 /WP (IO2) Write Protect Input / Quad I/O 2 Hardware lock for status register when QE=0; becomes IO2 in Quad SPI/QPI when QE=1
4 GND Ground Reference Primary return path for VCC and I/O signals; requires low-inductance PCB connection
5 DI (IO0) Data Input / Quad I/O 0 Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI/QPI modes
6 CLK Serial Clock Input Edge-triggered timing reference; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1)
7 /HOLD or /RESET (IO3) Hold/Reset Input / Quad I/O 3 Hold pauses ongoing transfers; /RESET performs hardware reset; both disabled when QE=1 (becomes IO3)
8 VCC Power Supply 1.65–1.95 V supply; decoupling capacitor (≥1 µF X7R) required within 5 mm of pin

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead from 8 to 2 clocks, enabling faster command throughput in XIP-critical boot sequences
Erase/Program Suspend & Resume Allows foreground read access during background erase/program - essential for real-time firmware updates
Volatile & Non-Volatile Status Register Bits Enables field-upgradable protection schemes (e.g., BP bits) while preserving critical settings across power cycles
Continuous Read with Wrap Supports 8/16/32/64-byte wrap modes - eliminates address counter overhead for streaming audio or video buffers
JEDEC ID + Unique 64-bit Serial Number Enables automated BOM verification and secure device authentication in production programming workflows

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Storing and executing bootloader and real-time OS kernel directly from flash in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 104MHz read latency.

Use Value: Eliminates external RAM copy step during boot, reducing BOM count and startup time by >120 ms vs. parallel flash.

Use Scenario: Holding certified firmware images and UI assets for head-unit microcontrollers operating in −40°C to +85°C environments.

IC Role / Device Role / Timing Role: Secure, temperature-stable boot source with OTP-locked security registers for ASIL-B compliance.

Use Value: Enables A/B firmware partitioning with atomic sector-level updates and hardware write protection against corruption.

IoT Edge Device Configuration Medical Diagnostic Instrument Data Log

Use Scenario: Persisting calibrated sensor parameters, network credentials, and OTA update staging buffers in battery-powered edge nodes.

IC Role / Device Role / Timing Role: Parameter and configuration store with 4KB sector granularity for fine-grained wear leveling.

Use Value: Supports 100K+ rewrites per sector - extends device lifetime beyond 10 years under daily parameter updates.

Use Scenario: Capturing time-stamped ECG waveforms and diagnostic logs in portable ultrasound and patient monitors.

IC Role / Device Role / Timing Role: High-reliability data logger with suspend/resume during acquisition and ECC-enabled reads.

Use Value: Guarantees data integrity via status register monitoring and sector-lock during critical acquisition windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 3.3V supply (vs. 1.8V); same 64Mb density, SOIC-8, and Quad SPI support; no QPI mode Requires level-shifting in 1.8V systems; lacks QPI instruction efficiency for XIP-critical boot paths Select when legacy 3.3V host MCU interfaces exist and QPI throughput is not required.
S25FL164K0XMFI010 1.8V operation; 64Mb density; supports HyperBus interface (not SPI/QPI); different pinout (16-pin SOIC) Not pin-compatible; requires PCB redesign; offers higher bandwidth (up to 166 MHz DDR) but no JEDEC ID or SFDP Choose only if migrating to Cypress/Infineon ecosystem with HyperFlash controller support.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64FWSSIF TR uniquely delivers 1.8V operation with QPI mode, JEDEC ID, SFDP, and 4KB sector flexibility - making it optimal for new 1.8V SoC designs requiring fast, secure, and field-upgradable boot memory without layout changes.

Availability

W25Q64FWSSIF TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and IoT edge device configuration requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W25Q64FWSSIF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25QxxFW family targets cost-sensitive, space-constrained embedded systems needing high-speed, low-voltage, and secure code/data storage - with emphasis on XIP performance, industrial temperature reliability, and firmware update robustness.

FAQ

What is the package type and lead finish of W25Q64FWSSIF TR?

W25Q64FWSSIF TR uses an 8-pin SOIC-208-mil package (Package Code SS) with gull-wing leads, 1.27 mm pitch, and matte tin (Sn) RoHS-compliant finish. This package is compatible with standard reflow profiles (J-STD-020, peak 260°C) and supports automated optical inspection (AOI) due to its defined coplanarity and solderable surface geometry.

Does W25Q64FWSSIF TR support execute-in-place (XIP) operation?

Yes, W25Q64FWSSIF TR supports true XIP via Continuous Read Mode and Fast Read Quad I/O (EBh) instructions, achieving up to 50 MB/s sustained read throughput. Its 8-clock instruction overhead and 104MHz SPI clock enable deterministic latency for direct code execution - validated in Winbond's application note AN201-01 for ARM Cortex-M boot scenarios.

How is hardware write protection implemented on W25Q64FWSSIF TR?

W25Q64FWSSIF TR implements hardware write protection using the /WP pin (Pin 3) in conjunction with status register bits BP2–BP0, TB, SEC, and CMP. When /WP is held low and SRP0/SRP1 are set, writes to protected sectors or status registers are blocked - independent of software commands. This dual-layer scheme prevents accidental or malicious firmware corruption during power transients.

What is the function of Pin 7 (/HOLD or /RESET) on W25Q64FWSSIF TR?

Pin 7 on W25Q64FWSSIF TR serves dual functions: /HOLD (active-low pause) in Standard/Dual SPI mode, and /RESET (hardware reset) when configured via Status Register-2 HOLD/RST bit. When QE=1 (Quad SPI/QPI enabled), Pin 7 becomes IO3 and neither /HOLD nor /RESET is available - a key design constraint for systems requiring runtime reset capability.

Is W25Q64FWSSIF TR compatible with JEDEC-standard serial flash commands?

Yes, W25Q64FWSSIF TR fully complies with JEDEC JESD216B for SFDP register structure and supports standard commands including Read JEDEC ID (9Fh), Read SFDP (5Ah), and Manufacturer ID (90h). Its SFDP table defines 1.6 revision, Quad Enable bit location (SR2[1]), and supported instruction sets - enabling automatic configuration by modern flash-aware bootloaders.

W25Q64FWSSIF TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
60µs, 5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25Q64FWSSIF TR FAQ

1.How can I place an order for W25Q64FWSSIF TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FWSSIF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FWSSIF TR reliable?

The price and inventory of W25Q64FWSSIF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FWSSIF TR is usually 5 days.

3.What payment methods are accepted for W25Q64FWSSIF TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FWSSIF TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FWSSIF TR?

W25Q64FWSSIF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FWSSIF TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FWSSIF TR?

For technical support, including W25Q64FWSSIF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FWSSIF TR requirements.

6.How does Aetrix verify that W25Q64FWSSIF TR is sourced from the original manufacturer or authorized distributors?

All W25Q64FWSSIF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FWSSIF TR meets industry standards.

7.What is the process for return or replacement of W25Q64FWSSIF TR?

All W25Q64FWSSIF TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FWSSIF TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FWSSIF TR part is unused and in its original packaging.

Return procedure for W25Q64FWSSIF TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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