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Winbond Electronics Corporation W25Q64FWZPIG

Part No.:
W25Q64FWZPIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q64FWZPIG.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,080

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Product details

Overview

W25Q64FWZPIG from Winbond is a 1.8V, 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces. It delivers 104MHz clock rate (416MHz equivalent Quad I/O), 4KB uniform sector erase, 256-byte page programming, and true execute-in-place (XIP) capability for embedded code storage in microcontroller boot applications.

For engineers reviewing the W25Q64FWZPIG datasheet, W25Q64FWZPIG pinout, W25Q64FWZPIG application, or W25Q64FWZPIG equivalent, this page provides verified pin functions, JEDEC-compliant ID support, 64-bit unique serial number, security register OTP locks, and real-world XIP timing behavior - all confirmed for the ZPIG (8-pin WSON 6×5-mm) package variant.

Technical Context

The W25Q64FWZPIG implements a quad-peripheral interface (QPI) with 2-clock instruction cycle overhead, reducing command latency versus standard SPI. Its status register includes non-volatile Quad Enable (QE), Write Protect Selection (WPS), and HOLD/RESET function control (HOLD/RST), enabling dynamic mode reconfiguration without hardware change.

It supports Erase/Program Suspend & Resume, continuous read with 8/16/32/64-byte wrap, and three 256-byte security registers with one-time-programmable (OTP) lock bits (LB1–LB3). Memory organization comprises 32,768 × 256-byte pages, 4,096 × 4KB sectors, and 256 × 64KB blocks - all accessible via deterministic address mapping per JEDEC JESD216 SFDP.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8 MB) - sufficient for full MCU firmware + configuration data in compact IoT nodes
Supply Voltage 1.65 V to 1.95 V - compatible with 1.8V logic domains; eliminates level-shifting in modern SoC designs
Max Clock Rate 104 MHz (SPI), 416 MHz equivalent (Quad I/O) - enables >50 MB/s sustained read throughput for XIP
Erase Granularity 4 KB sector / 32 KB block / 64 KB block - allows fine-grained parameter updates without disturbing adjacent firmware
Endurance & Retention 100,000 program/erase cycles; 20-year data retention - validated for industrial temperature (-40°C to +85°C)
Security Features 64-bit unique ID, 3×256-byte OTP-locked security registers, JEDEC SFDP v1.6 compliance - supports secure boot key binding
Interface Modes Standard SPI (4-wire), Dual SPI (4-wire), Quad SPI (6-wire), QPI (6-wire) - software-selectable via Status Register-2 QE bit

Pinout & Package

W25Q64FWZPIG uses an 8-pad WSON 6×5-mm package (JEDEC MO-241AC, Winbond code ZP), with exposed thermal pad (non-electrical). Pin 1 is /CS; pins are arranged in clockwise order from top-left corner under marking dot.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO during deselect; must transition high→low after power-up before first instruction
2 DO (IO1) Data Output / Quad I/O 1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad/QPI modes; requires QE=1 for Quad use
3 /WP (IO2) Write Protect Input / Quad I/O 2 Hardware write protection for status register when QE=0; becomes IO2 in Quad/QPI mode (QE=1)
4 GND Ground Reference Primary return path for VCC and I/O; connects to thermal pad for improved thermal dissipation
5 DI (IO0) Data Input / Quad I/O 0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad/QPI; used for all instruction/address loading
6 CLK Serial Clock Input Edge-triggered timing reference; supports SPI Mode 0 and Mode 3; max 104 MHz frequency
7 /HOLD or /RESET (IO3) Hold/Reset Input / Quad I/O 3 Pauses ongoing operation when low (/HOLD); resets device when pulsed (/RESET); becomes IO3 in Quad/QPI (QE=1)
8 VCC Power Supply 1.65–1.95 V supply; decoupling capacitor required within 5 mm; powers internal HV generators for erase/program

Key Features

Feature Design Value
Continuous Read Mode As few as 8 clocks to initiate address transfer - enables deterministic XIP latency critical for real-time firmware execution
Quad Peripheral Interface (QPI) 2-clock instruction encoding - cuts command overhead by 75% vs. standard SPI, boosting effective bandwidth in XIP systems
Erase/Program Suspend & Resume Allows background read access during long erase cycles - essential for responsive HMI or sensor logging during firmware update
Top/Bottom & Individual Sector Protection Configurable BP2–BP0 + TB + SEC bits - permits locking bootloader region while allowing runtime parameter updates in adjacent sectors
JEDEC SFDP v1.6 Support Read SFDP Register (5Ah) returns parametric tables - enables automatic driver initialization without hard-coded timing constants
64-bit Unique Serial Number Factory-programmed, unalterable ID - used for device authentication, license binding, and field failure traceability

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Image

Use Scenario: Storing certified firmware and calibration data in programmable logic controllers operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP execution; handles 4KB sector updates during field upgrades without system reboot.

Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year product lifecycle without refresh.

Use Scenario: Hosting boot image and safety-critical sensor fusion algorithms for camera/radar ECUs requiring ASIL-B compliance.

IC Role / Device Role / Timing Role: Secure boot source with 64-bit unique ID and OTP-locked security registers; supports fast Quad I/O reads for sub-100ms cold start.

Use Value: JEDEC SFDP auto-configuration and QPI mode reduce boot time variance across temperature and voltage corners.

Medical Wearable Configuration Smart Home Edge Node OTA

Use Scenario: Storing patient-specific calibration profiles and regulatory-compliant audit logs in battery-powered wearable monitors.

IC Role / Device Role / Timing Role: Parameter storage with hardware /WP pin protection and individual sector lock (36h/39h) for HIPAA-aligned data partitioning.

Use Value: 1µA power-down current extends battery life; 4KB sectors allow encrypted log rotation without erasing firmware.

Use Scenario: Enabling seamless over-the-air firmware updates in constrained Wi-Fi/BLE edge gateways with limited RAM.

IC Role / Device Role / Timing Role: Dual-bank storage (using sector erase suspend/resume) to maintain active firmware while writing new version.

Use Value: Erase/program suspend allows concurrent sensor data logging during OTA - no dropped samples or service interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 64Mb, 1.65–2.0V, 104MHz, SOIC8/WSON8; lacks QPI mode and SFDP v1.6; security registers not OTP-locked Lower-cost replacement where QPI/XIP performance and advanced security are not required Select when legacy SPI-only interface suffices and BOM cost sensitivity outweighs future-proofing needs
S25FL164K0XMFI010 64Mb, 2.7–3.6V, 80MHz max, SOIC8/WSON8; supports HyperBus but no QPI; includes ECC and configurable latency Preferred for 3.3V systems needing built-in error correction and deterministic read latency Choose only for 3.3V designs requiring ECC; incompatible voltage domain prevents drop-in replacement for W25Q64FWZPIG

Compared with MX25L6433FZNI-10G, W25Q64FWZPIG adds QPI mode and OTP security locks - critical for secure boot acceleration. Against S25FL164K0XMFI010, it offers 1.8V operation and higher bandwidth but no on-die ECC - making it optimal for cost- and power-sensitive 1.8V XIP applications.

Availability

W25Q64FWZPIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, and medical wearable configuration management requiring stable component supply across multi-year production cycles.

Supply support for W25Q64FWZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25QxxFW family targets high-performance, low-voltage embedded systems requiring reliable XIP-capable code storage with advanced security and flexible erase architecture.

FAQ

What is the package type and footprint compatibility of W25Q64FWZPIG?

W25Q64FWZPIG uses an 8-pad WSON 6×5-mm package (JEDEC MO-241AC, Winbond code ZP) with a 0.5-mm pitch and exposed thermal pad. It shares footprint compatibility with other Winbond WSON-8 variants like W25Q32FWZPIG and W25Q128JWZPIG, enabling scalable memory design across density points without PCB revision.

Does W25Q64FWZPIG support execute-in-place (XIP) operation, and what interface modes enable it?

Yes, W25Q64FWZPIG supports true XIP operation via Continuous Read Mode and Quad SPI/QPI interfaces. Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and QPI instructions deliver the low-latency, high-bandwidth access required for direct CPU execution. Standard SPI Fast Read (0Bh) also supports basic XIP but with lower throughput.

How is hardware write protection implemented on W25Q64FWZPIG, and can it coexist with Quad SPI mode?

Hardware write protection on W25Q64FWZPIG uses the /WP pin to lock status register writes when QE=0. When QE=1 (enabling Quad SPI/QPI), /WP becomes IO2 and hardware protection is disabled; instead, non-volatile Block Protect (BP2–BP0), Top/Bottom (TB), and Complement (CMP) bits provide software-configurable array protection - preserving security without sacrificing interface speed.

What is the role of the /HOLD pin on W25Q64FWZPIG, and how does it behave in QPI mode?

The /HOLD pin on W25Q64FWZPIG pauses ongoing SPI transfers while /CS remains low, placing DO in high-impedance and ignoring DI/CLK edges - useful for bus arbitration. In QPI mode (QE=1), /HOLD becomes IO3 and loses its hold function; hold behavior must then be managed via software commands or external logic.

Is W25Q64FWZPIG compatible with JEDEC-standard SFDP, and how is it accessed?

Yes, W25Q64FWZPIG fully complies with JEDEC JESD216B SFDP v1.6. The SFDP register is read using instruction 5Ah, returning structured parameter tables that describe erase timings, voltage ranges, and Quad Enable requirements - enabling automatic, vendor-agnostic driver initialization in RTOS and bare-metal firmware.

W25Q64FWZPIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x5)

W25Q64FWZPIG FAQ

1.How can I place an order for W25Q64FWZPIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FWZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FWZPIG reliable?

The price and inventory of W25Q64FWZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FWZPIG is usually 5 days.

3.What payment methods are accepted for W25Q64FWZPIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FWZPIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FWZPIG?

W25Q64FWZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FWZPIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FWZPIG?

For technical support, including W25Q64FWZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FWZPIG requirements.

6.How does Aetrix verify that W25Q64FWZPIG is sourced from the original manufacturer or authorized distributors?

All W25Q64FWZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FWZPIG meets industry standards.

7.What is the process for return or replacement of W25Q64FWZPIG?

All W25Q64FWZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FWZPIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FWZPIG part is unused and in its original packaging.

Return procedure for W25Q64FWZPIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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