Winbond Electronics Corporation W25Q64JVTBJQ

Overview

W25Q64JVTBJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 133 MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.

For engineers reviewing the W25Q64JVTBJQ datasheet, W25Q64JVTBJQ pinout, W25Q64JVTBJQ application, or W25Q64JVTBJQ equivalent, key selection criteria include Quad SPI enable (QE bit), 2.7–3.6V supply compatibility, 100K program-erase cycles per sector, -40°C to +105°C extended temperature operation, and TFBGA 8x6-mm (6x4 ball array) package mapping.

Technical Context

The W25Q64JVTBJQ implements a SPI-compatible command set with three operational modes: Standard (DI/DO), Dual I/O (IO0/IO1), and Quad I/O (IO0–IO3), where Quad mode requires non-volatile QE bit setting in Status Register-2. It features dual-bank erase/program suspend-resume capability and supports JEDEC-standard SFDP for discoverable parameters.

Its memory array comprises 32,768 pages of 256 bytes each, organized into 2,048 erasable 4KB sectors and 128 erasable 64KB blocks. The device integrates three 256-byte security registers, 64-bit unique ID, and volatile/non-volatile status register bits including BP2–BP0, TB, SEC, CMP, SRP/SRL, and DRV0/DRV1 for output driver strength control.

Key Specifications

Pinout & Package

W25Q64JVTBJQ is packaged in a 24-ball TFBGA 8x6-mm with 6x4 ball array (Package Code TC), pin-compatible with Winbond's W25Q64JV family TFBGA variants. Pin functions align with JEDEC-standard SPI interface layout optimized for high-density PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64JVTBJQ delivers superior thermal robustness, integrated hardware reset, and broader package flexibility - making it the preferred choice for new designs requiring field reliability, fast XIP boot, and seamless SPI controller integration.

Availability

W25Q64JVTBJQ is available at Aetrix Electronics and suitable for industrial control panels, automotive telematics modules, and medical imaging subsystems requiring stable component supply across multi-year production cycles.

Supply support for W25Q64JVTBJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series targets embedded systems needing high-speed, low-power, and secure code/data storage - designed specifically for boot ROM replacement, firmware update resilience, and XIP-capable microcontroller platforms.

FAQ

What is the package type and ball count for W25Q64JVTBJQ?

W25Q64JVTBJQ uses a 24-ball TFBGA package with 8 mm × 6 mm footprint and 6×4 ball array (Package Code TC). This variant includes the dedicated /RESET pin and supports full Quad SPI functionality with IO0–IO3. The ball layout matches Winbond's standardized TFBGA pinout for drop-in compatibility across W25Q64JV family members.

Does W25Q64JVTBJQ support Quad SPI mode out of the box?

No - W25Q64JVTBJQ requires the non-volatile Quad Enable (QE) bit in Status Register-2 to be set before Quad SPI instructions (e.g., EBh) function. By default, QE=0; users must issue Write Status Register-2 (31h) with value 02h to enable IO2 (/WP) and IO3 (/HOLD) as Quad I/O lines. Failure to set QE results in unrecognized commands or fallback to Standard/Dual mode.

How does the /HOLD pin behave in Quad SPI mode on W25Q64JVTBJQ?

In Quad SPI mode (QE=1), the /HOLD pin on W25Q64JVTBJQ is reassigned as IO3 and loses its hold functionality. The hold feature remains available only in Standard and Dual SPI modes. Designers must ensure that /HOLD is not asserted during Quad operations - doing so will corrupt data transfers since the pin serves as an active data line (IO3) rather than a control signal.

What is the minimum erase unit size supported by W25Q64JVTBJQ?

W25Q64JVTBJQ supports 4 KB sector erase as its smallest erase granularity. The memory array contains 2,048 uniform 4 KB sectors, enabling precise firmware partitioning - for example, isolating bootloader, application, and parameter regions with independent protection. Sector erase time is typically 300 ms, while 64 KB block erase takes ~1.5 s and chip erase ~60 s.

Can W25Q64JVTBJQ be used in automotive applications requiring AEC-Q100 qualification?

W25Q64JVTBJQ itself is not AEC-Q100 qualified; however, Winbond offers the automotive-grade W25Q64JW variant (same density and pinout) rated for -40°C to +105°C and qualified to AEC-Q100 Grade 3. For automotive designs requiring formal qualification, W25Q64JW is the compliant alternative - W25Q64JVTBJQ is intended for industrial and commercial applications meeting extended temperature but not automotive reliability standards.