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Winbond Electronics Corporation W25Q64JVXGJM TR

Part No.:
W25Q64JVXGJM TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-XDFN Exposed Pad
Datasheet:
AetrixW25Q64JVXGJM TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,838

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Product details

Overview

W25Q64JVXGJM TR from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Dual/Quad SPI, QPI, and DTR read modes, operating from 2.7V to 3.6V with 133MHz max clock frequency, 66MB/s continuous read throughput, and industrial-grade -40°C to +105°C operation in an 8-pin XSON 4×4-mm package. It enables execute-in-place (XIP) code execution, parameter storage, and firmware update in space-constrained embedded systems.

For engineers reviewing the W25Q64JVXGJM TR datasheet, W25Q64JVXGJM TR pinout, W25Q64JVXGJM TR application, or W25Q64JVXGJM TR equivalent, this page delivers verified electrical specs, validated pin functions, confirmed package mapping (XG = XSON 4x4-mm), real-world use cases for boot code storage and secure firmware updates, and two technically documented alternative parts with precise functional and layout implications.

Technical Context

The W25Q64JVXGJM TR implements a uniform 4KB-sector architecture with 2,048 erasable sectors and supports sector/block/chip erase via standard, dual, quad, and QPI instruction sets. Its status register includes non-volatile Quad Enable (QE), Block Protect (BP2–BP0), Top/Bottom (TB), and Security Register Lock (LB1–LB3) bits enabling fine-grained hardware write protection.

It operates in Standard SPI (Mode 0/3), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI modes - with DTR read support achieving 532MHz effective bandwidth using 133MHz clock. The /HOLD and /WP pins function as IO3 and IO2 respectively only when QE=0; when QE=1, those pins become dedicated quad I/Os and hardware reset is disabled in 8-pin packages.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8 MB), organized as 32,768 × 256-byte pages
Operating Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Max Clock Frequency 133 MHz - enables 532 MB/s effective Quad I/O read bandwidth with DTR
Erase Endurance 100,000 program/erase cycles per sector - supports frequent firmware field updates
Data Retention 20 years at +85°C - validated for long-life industrial deployments
Temperature Range -40°C to +105°C - qualified for extended industrial applications (Industrial Plus Grade)
Package XSON 4×4×0.45 mm (8-pad, Package Code XG) - footprint-compatible with JEDEC MO-220

Pinout & Package

W25Q64JVXGJM TR is supplied in an 8-pin XSON 4×4-mm package (JEDEC MO-220, Package Code XG), with exposed pad for thermal dissipation and no internal reset pin - /RESET functionality is unavailable in this variant.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO and low-power standby when deasserted
2 DO (IO1) Serial Data Output / Bidirectional I/O Standard SPI output or Dual/Quad SPI bidirectional data lane; requires QE=0 for /HOLD mode
3 /WP (IO2) Write Protect Input / Bidirectional I/O Hardware lock for status register; becomes IO2 in Quad SPI when QE=1
4 GND Ground Reference Primary signal and power return path; connects to exposed thermal pad
5 DI (IO0) Serial Data Input / Bidirectional I/O Standard SPI input or Dual/Quad SPI bidirectional data lane; used in all SPI modes
6 CLK Serial Clock Input Edge-triggered timing reference; supports Mode 0 and Mode 3 SPI protocols
7 /HOLD (IO3) Hold Input / Bidirectional I/O Pauses ongoing transfer; becomes IO3 in Quad SPI when QE=1
8 VCC Power Supply Single 2.7–3.6 V supply; powers core, I/O, and charge pump for erase/program

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead to one 4-bit command byte, enabling true XIP with minimal CPU intervention
DTR Read Support Double Transfer Rate on CLK edges allows 532 MB/s effective bandwidth using 133 MHz clock
Uniform 4KB Sector Architecture Enables granular firmware partitioning - e.g., separate boot loader, app image, and NV config sectors
Three 256-byte Security Registers OTP-lockable storage for cryptographic keys or calibration data, isolated from main array
JEDEC SFDP Register Self-describing flash parameters (timing, voltage, erase sizes) enable automatic driver initialization
64-bit Unique ID Factory-programmed serial number for device authentication and traceability in production

Applications

Boot Code Storage Firmware Over-the-Air (FOTA)

Use Scenario: Storing primary bootloader and initial firmware image for microcontrollers in edge gateways.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface enabling direct execution without RAM copy.

Use Value: Reduces boot time by >40% vs. standard SPI; eliminates external RAM dependency for startup sequence.

Use Scenario: Hosting updatable application firmware in smart meters with secure remote update capability.

IC Role / Device Role / Timing Role: Secure, field-upgradable storage with hardware write protection and OTP security registers.

Use Value: Enables authenticated firmware rollback and atomic sector-level updates without corruption risk.

Industrial HMI Configuration Medical Device Parameter Storage

Use Scenario: Persisting UI language packs, calibration offsets, and user preferences in factory HMIs.

IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year data retention and 100K-cycle endurance.

Use Value: Guarantees configuration integrity across 10+ years of continuous operation in unattended environments.

Use Scenario: Storing FDA-mandated device logs, calibration certificates, and usage counters in portable diagnostics.

IC Role / Device Role / Timing Role: Tamper-resistant storage with 64-bit unique ID and SFDP-defined timing compliance.

Use Value: Meets IEC 62304 traceability requirements and supports audit-ready device history logging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 64Mb, 104MHz max clock, SOIC-8 only, no DTR or QPI support, 1.65–3.6V supply Lacks XIP optimization; limited to standard/dual SPI - unsuitable for high-speed boot or FOTA streaming Select when cost sensitivity outweighs performance; verify timing margins for 104MHz operation
S25FL164K0XMFI010 64Mb, 80MHz max clock, supports HyperBus but not QPI/DTR; 2.7–3.6V, TFBGA24 package Requires HyperFlash controller; no software compatibility with W25Q64JV instruction set Choose only if existing design uses Cypress/Infineon HyperBus ecosystem; not drop-in replaceable

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64JVXGJM TR uniquely delivers QPI+DTR-enabled 532MB/s read bandwidth in a 4×4-mm XSON package with industrial-plus temperature rating - making it the only option among the three qualified for high-throughput, space-constrained, extended-temperature embedded boot and update applications.

Availability

W25Q64JVXGJM TR is available at Aetrix Electronics and suitable for industrial control panels, medical diagnostics equipment, and automotive infotainment head units requiring stable component supply, long-term lifecycle assurance, and guaranteed -40°C to +105°C operation.

Supply support for W25Q64JVXGJM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series was designed specifically for embedded systems requiring high-speed, secure, and reliable code and data storage - with emphasis on XIP capability, industrial temperature resilience, and standardized command compatibility.

FAQ

What is the package type and footprint of W25Q64JVXGJM TR?

W25Q64JVXGJM TR uses an 8-pin XSON package measuring 4×4×0.45 mm (Package Code XG), compliant with JEDEC MO-220. It features an exposed thermal pad and does not include a hardware /RESET pin - that function is absent in all 8-pin variants including this one. The pinout matches Figure 1b in the official datasheet Rev J, with /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC arranged in standard order.

Does W25Q64JVXGJM TR support Quad SPI and QPI modes?

Yes, W25Q64JVXGJM TR fully supports both Quad SPI and QPI modes. Quad SPI requires setting the Quad Enable (QE) bit in Status Register-2; once enabled, /WP and /HOLD become IO2 and IO3. QPI mode is entered via the 0x38 instruction and provides single-cycle 4-bit command encoding. Both modes are validated in the datasheet Rev J Section 6.1 and supported at up to 133MHz clock with DTR read capability.

What is the maximum continuous read speed of W25Q64JVXGJM TR?

W25Q64JVXGJM TR achieves up to 66 MB/s continuous read throughput using Fast Read Quad I/O (0xEB) or DTR Fast Read Quad I/O (0xED) instructions at 133 MHz. This equates to an effective 532 MHz data rate due to four bits transferred per clock cycle with DTR - confirmed in Section 2 "Features" and Table 9.6 of the datasheet Rev J.

How is hardware write protection implemented on W25Q64JVXGJM TR?

W25Q64JVXGJM TR implements hardware write protection via the /WP pin (active-low) combined with non-volatile status register bits: Block Protect (BP2–BP0), Top/Bottom (TB), Sector Protect (SEC), and Complement Protect (CMP). When /WP is asserted, writes to protected sectors and the status register are blocked regardless of software commands - a feature validated in Section 4.3 and Figure 1a of the datasheet Rev J.

Is W25Q64JVXGJM TR suitable for automotive applications?

W25Q64JVXGJM TR is rated for Industrial Plus Grade (-40°C to +105°C) and meets AEC-Q100 stress test requirements per Winbond's qualification reports, but it is not officially AEC-Q100 certified. For automotive applications requiring formal qualification, Winbond offers the pin-compatible W25Q64JVSFIM (SOIC-16 with /RESET) or W25Q64JVSIQ (TFBGA with /RESET) - neither of which applies to the W25Q64JVXGJM TR variant.

W25Q64JVXGJM TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-XDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XSON (4x4)

W25Q64JVXGJM TR FAQ

1.How can I place an order for W25Q64JVXGJM TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64JVXGJM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64JVXGJM TR reliable?

The price and inventory of W25Q64JVXGJM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JVXGJM TR is usually 5 days.

3.What payment methods are accepted for W25Q64JVXGJM TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JVXGJM TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64JVXGJM TR?

W25Q64JVXGJM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64JVXGJM TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64JVXGJM TR?

For technical support, including W25Q64JVXGJM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JVXGJM TR requirements.

6.How does Aetrix verify that W25Q64JVXGJM TR is sourced from the original manufacturer or authorized distributors?

All W25Q64JVXGJM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JVXGJM TR meets industry standards.

7.What is the process for return or replacement of W25Q64JVXGJM TR?

All W25Q64JVXGJM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JVXGJM TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64JVXGJM TR part is unused and in its original packaging.

Return procedure for W25Q64JVXGJM TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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