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Winbond Electronics Corporation W25Q64JVXGJQ

Part No.:
W25Q64JVXGJQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-XDFN Exposed Pad
Datasheet:
AetrixW25Q64JVXGJQ.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,080

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Product details

Overview

W25Q64JVXGJQ from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 133MHz clock rate, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - used for code execution (XIP), firmware storage, and parameter retention in space-constrained embedded systems.

For engineers reviewing the W25Q64JVXGJQ datasheet, W25Q64JVXGJQ pinout, W25Q64JVXGJQ application, or W25Q64JVXGJQ equivalent, this page delivers verified package mapping (XSON 4×4-mm, code XG), confirmed Quad SPI timing (532MHz equivalent), JEDEC ID support, 64-bit unique serial number, and real-world use cases in boot code storage, OTA firmware updates, and secure configuration storage.

Technical Context

The W25Q64JVXGJQ implements a hierarchical erase architecture with 2,048 × 4KB sectors and 128 × 64KB blocks, enabling granular data management. Its command set includes Fast Read Quad I/O (EBh), Quad Input Page Program (32h), and Erase/Program Suspend (75h), all requiring non-volatile QE bit enablement in Status Register-2.

It integrates three 256-byte Security Registers, SFDP register for discoverable parameters, and volatile/non-volatile status bits including Block Protect (BP2–BP0), Top/Bottom protect (TB), and Output Driver Strength (DRV1/DRV0), all accessible via standardized SPI instructions (01h, 31h, 11h).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density64 M-bit (8 MB) - supports full firmware images for mid-tier microcontrollers without external memory expansion.
Interface SupportStandard/Dual/Quad SPI - enables scalable bandwidth: 133 MHz single, 266 MHz dual, 532 MHz quad-equivalent read rates.
Erase Granularity4 KB sectors / 32 KB & 64 KB blocks - allows independent firmware partitioning and robust OTA update rollback.
Write Endurance100,000 program-erase cycles per sector - ensures reliable field-updatable storage over 10+ years of operation.
Data Retention20+ years at +25°C - guarantees long-term integrity of calibration data, device IDs, and security keys.
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V logic domains and brown-out tolerant power rails.
Power-Down Current<1 µA (typ.) - minimizes standby power in battery-powered IoT edge nodes and wearables.

Pinout & Package

W25Q64JVXGJQ uses the XSON 4×4×0.45-mm 8-pad package (package code XG), optimized for high-density PCB layouts with thermal pad exposure. Pin functions are shared across SPI modes, with IO0–IO3 dynamically assigned based on Quad Enable (QE) bit state.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable signal; places DO/IO pins in high-impedance when deasserted to isolate bus contention.
DI (IO0)Serial Data Input / Quad I/O 0Primary input for Standard/Dual SPI; becomes bidirectional IO0 in Quad mode when QE=1.
DO (IO1)Serial Data Output / Quad I/O 1Primary output for Standard/Dual SPI; becomes bidirectional IO1 in Quad mode when QE=1.
/WP (IO2)Write Protect Input / Quad I/O 2Hardware lock for status register; repurposed as IO2 in Quad mode only when QE=1.
/HOLD (IO3)Hold or Reset Input / Quad I/O 3Pauses ongoing transfers; becomes IO3 in Quad mode only when QE=1 (no dedicated /RESET in XSON).
CLKSerial Clock InputSynchronizes all SPI transactions; supports Mode 0 and Mode 3 clock polarity/idle states.
GNDGround ReferenceSignal and power return path; requires low-inductance connection to minimize noise during fast reads.
VCCPower Supply2.7–3.6 V supply; decoupling capacitor (≥100 nF) required within 3 mm of pad per layout guidelines.

Key Features

Feature Design Value
Quad SPI with QE bit controlEnables 532 MHz equivalent throughput only when Status Register-2 QE=1 - prevents accidental mode corruption.
Erase/Program Suspend & ResumeAllows interruption of long erase/program operations to service higher-priority reads - critical for real-time response in HMI and motor control.
64-bit Unique Serial NumberFactory-programmed per-device ID - enables secure device binding, anti-cloning, and traceability in certified industrial deployments.
Three 256-byte Security RegistersOTP-capable storage for cryptographic keys, calibration offsets, or license tokens - isolated from main array and protected by LB1–LB3 bits.
JEDEC-compliant SFDP RegisterSelf-describing flash parameters (timing, voltage, erase sizes) readable via 5Ah command - simplifies automated toolchain integration.
Top/Bottom & Complement ProtectionConfigurable hardware lock for upper/lower memory regions or mirrored protection - prevents accidental overwrite of bootloader or factory settings.

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and initial firmware image executed directly from flash (XIP) on ARM Cortex-M or RISC-V SoCs.

IC Role / Device Role / Timing Role: Non-volatile instruction store with Quad SPI random-access latency ≤8 µs (Fast Read Quad I/O), enabling deterministic startup under 100 ms.

Use Value: Eliminates external RAM copy step; reduces BOM cost and power by 15–20% versus parallel NOR solutions.

Use Scenario: Holding dual firmware partitions (active + candidate) for atomic over-the-air (OTA) updates in smart meters and gateways.

IC Role / Device Role / Timing Role: Atomic sector swap target with 4KB granularity - allows safe rollback if update fails mid-write.

Use Value: Guarantees zero-downtime field upgrades and meets IEC 62443-3-3 secure update requirements.

Secure Configuration Storage Audio/Data Logging Buffer

Use Scenario: Storing calibrated sensor offsets, MAC addresses, and TLS root certificates in medical diagnostics and industrial PLCs.

IC Role / Device Role / Timing Role: Tamper-resistant parameter vault using Security Registers and individual sector locks (36h/39h commands).

Use Value: Prevents unauthorized reconfiguration and satisfies FDA 21 CFR Part 11 and ISO 13485 audit trails.

Use Scenario: Cyclic logging of vibration, temperature, or audio snippets in predictive maintenance edge sensors.

IC Role / Device Role / Timing Role: High-endurance 4KB sector buffer supporting 100K+ write cycles - outperforms EEPROM in burst-write scenarios.

Use Value: Extends field lifetime beyond 10 years without wear-leveling firmware overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G64 M-bit, 104 MHz max clock, no Quad I/O suspend/resume, no 64-bit UID, 1.65–2.0 V VCC rangeLimited to lower-speed industrial controllers; lacks security registers and SFDP supportSelect only if operating below 2.3 V or legacy SPI-only designs require pin compatibility with Macronix footprint.
S25FL164K0XMFI01064 M-bit, 80 MHz max clock, HyperBus interface option, no /HOLD pin in 8-pin SOIC, different security model (OTP lock bits only)Better suited for Cypress PSoC ecosystems; requires HyperFlash controller or SPI-to-HyperBus bridgeChoose when migrating from Cypress platforms or needing deterministic 12 ns read latency - not drop-in compatible.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64JVXGJQ delivers superior bandwidth (133 MHz vs. ≤104 MHz), integrated security features (64-bit UID + 3×256B registers), and flexible suspend/resume - making it optimal for secure, high-throughput embedded firmware storage where XSON packaging and JEDEC compliance are required.

Availability

W25Q64JVXGJQ is available at Aetrix Electronics and suitable for boot code storage, OTA firmware updates, and secure configuration storage requiring stable component supply, long-lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W25Q64JVXGJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage devices for embedded and automotive markets.

The W25Q series targets high-reliability, space-constrained applications demanding fast XIP execution, secure firmware storage, and industrial-grade endurance - with W25Q64JVXGJQ specifically engineered for compact consumer, industrial, and networking endpoints.

FAQ

What is the package type and footprint of W25Q64JVXGJQ?

W25Q64JVXGJQ uses the XSON 4×4×0.45-mm 8-pad package (Winbond package code XG), with exposed thermal pad. It shares pinout compatibility with other 8-pin variants like SOIC-208 and WSON-6x5, but requires specific land pattern per IPC-7351B standard for solder paste volume and reflow profile control. The W25Q64JVXGJQ footprint does not include a dedicated /RESET pin - that function is only available in TFBGA or SOIC-16 packages.

Does W25Q64JVXGJQ support Quad SPI mode out of the box?

No - W25Q64JVXGJQ requires explicit configuration of the Quad Enable (QE) bit in Status Register-2 (SR2) via Write Status Register-2 (31h) command before Quad SPI instructions (e.g., EBh) become functional. Until QE=1, /WP and /HOLD remain hardware protection pins. This prevents unintended mode switching and ensures backward compatibility with legacy SPI controllers.

How many program-erase cycles does W25Q64JVXGJQ guarantee per sector?

W25Q64JVXGJQ guarantees a minimum of 100,000 program-erase cycles per 4KB sector, validated per JEDEC JESD22-A117 standard. This endurance rating applies uniformly across all 2,048 sectors and is maintained across the full operating temperature range (−40°C to +85°C). Wear leveling must be implemented in firmware for applications exceeding this limit.

Can W25Q64JVXGJQ be used for secure key storage?

Yes - W25Q64JVXGJQ includes three dedicated 256-byte Security Registers (SR1–SR3) with One-Time-Programmable (OTP) lock bits (LB1–LB3). Once locked, these registers cannot be erased or rewritten. They are electrically isolated from the main array and accessed via distinct commands (42h/44h/48h), making them suitable for storing cryptographic keys, calibration secrets, or device-specific credentials.

What is the purpose of the /HOLD pin on W25Q64JVXGJQ?

The /HOLD pin on W25Q64JVXGJQ pauses ongoing SPI transfers while /CS remains asserted - allowing the host MCU to temporarily suspend flash access without aborting the operation. When /HOLD is pulled low, DO goes high-Z and DI/CLK inputs are ignored. In Quad SPI mode (QE=1), this pin becomes IO3 and /HOLD functionality is disabled, as confirmed in the W25Q64JVXGJQ datasheet Section 4.4.

W25Q64JVXGJQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-XDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XSON (4x4)

W25Q64JVXGJQ FAQ

1.How can I place an order for W25Q64JVXGJQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64JVXGJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64JVXGJQ reliable?

The price and inventory of W25Q64JVXGJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JVXGJQ is usually 5 days.

3.What payment methods are accepted for W25Q64JVXGJQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JVXGJQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64JVXGJQ?

W25Q64JVXGJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64JVXGJQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64JVXGJQ?

For technical support, including W25Q64JVXGJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JVXGJQ requirements.

6.How does Aetrix verify that W25Q64JVXGJQ is sourced from the original manufacturer or authorized distributors?

All W25Q64JVXGJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JVXGJQ meets industry standards.

7.What is the process for return or replacement of W25Q64JVXGJQ?

All W25Q64JVXGJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JVXGJQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64JVXGJQ part is unused and in its original packaging.

Return procedure for W25Q64JVXGJQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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