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Winbond Electronics Corporation W25Q64JVZEIM
- Part No.:
- W25Q64JVZEIM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64JVZEIM.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,312
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Product details
Overview
W25Q64JVZEIM from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 133 MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - used for code storage, XIP execution, and firmware parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q64JVZEIM datasheet, W25Q64JVZEIM pinout, W25Q64JVZEIM application, or W25Q64JVZEIM equivalent, this page delivers verified package mapping (8-pad WSON 8×6 mm, code ZE), confirmed Quad SPI timing (532 MHz equivalent), JEDEC ID compliance, 100K program-erase cycles per sector, and real-world use cases including boot code storage and secure firmware update staging.
Technical Context
The W25Q64JVZEIM implements a hierarchical erase architecture with 2,048 × 4KB sectors and 128 × 64KB blocks, enabling granular data management. Its command set includes Fast Read Quad I/O (EBh), Quad Input Page Program (32h), and Erase/Program Suspend (75h), all requiring non-volatile QE bit enablement in Status Register-2.
It integrates three 256-byte Security Registers, SFDP (Serial Flash Discoverable Parameters) register support, and dual-mode /HOLD or /RESET functionality - where /HOLD operates in Standard/Dual SPI, while dedicated /RESET is active only on TFBGA/SOIC-16 packages (not applicable to ZE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) organized as 32,768 × 256-byte pages |
| Interface Support | Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3) with QE bit required |
| Max Clock Frequency | 133 MHz single-ended; 266 MHz (Dual I/O), 532 MHz (Quad I/O) equivalent throughput |
| Erase Granularity | 4 KB sector, 32 KB block, 64 KB block, or full chip - enabling flexible firmware partitioning |
| Endurance & Retention | 100,000 program-erase cycles per sector; >20 years data retention at +25°C |
| Supply Voltage | 2.7 V to 3.6 V; typical power-down current <1 µA |
| Operating Temperature | –40°C to +85°C (industrial grade) |
Pinout & Package
W25Q64JVZEIM uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC, package code ZE), with exposed thermal pad (EP) on underside for enhanced thermal dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high-impedance DO during deselect; must transition high→low after power-up to accept commands |
| 2 DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; supports Fast Read modes |
| 3 /WP (IO2) | Write Protect Input / I/O2 | Active-low hardware lock for Status Register; becomes IO2 when QE=1 for Quad SPI |
| 4 GND | Ground Reference | Primary signal and power return path; connects to PCB ground plane |
| 5 DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions/addresses/data |
| 6 CLK | Serial Clock Input | Edge-triggered timing source; supports SPI Modes 0 and 3; max 133 MHz operation |
| 7 /HOLD (IO3) | Hold Input / I/O3 | Pauses ongoing SPI transfer when low; becomes IO3 in Quad SPI (QE=1); not /RESET in ZE package |
| 8 VCC | Power Supply | 2.7–3.6 V core supply; decoupling capacitor (0.1 µF) required near pin |
Key Features
| Feature | Design Value |
|---|---|
| Quad Enable (QE) Bit | Non-volatile Status Register-2 bit enabling IO2/IO3 for 4-line data transfer - essential for 532 MHz-equivalent reads |
| Erase/Program Suspend | Allows temporary halt of erase/program operations to service higher-priority reads - critical for real-time interrupt handling |
| 64-bit Unique ID | Factory-programmed read-only identifier per device - enables secure firmware binding and anti-cloning in production |
| Security Registers | Three independent 256-byte OTP-capable registers for cryptographic keys or calibration data - isolated from main array |
| Software Reset Sequence | 66h + 99h instruction pair restores power-on state without external /RESET - simplifies design on packages lacking dedicated reset pin |
Applications
| Boot Code Storage | Firmware Update Staging |
|---|---|
Use Scenario: Storing primary bootloader and application firmware image for microcontrollers with no internal flash or limited capacity. IC Role / Device Role / Timing Role: Non-volatile code repository accessed via XIP-capable Quad SPI during cold start and warm reset sequences. Use Value: Enables deterministic boot latency under 100 ms using Fast Read Quad I/O (EBh) at 133 MHz clock, reducing system initialization time. |
Use Scenario: Holding validated firmware updates prior to atomic swap with active image in dual-bank systems. IC Role / Device Role / Timing Role: Secure staging area with individual sector lock (36h/39h) preventing partial overwrite during OTA transmission. Use Value: Guarantees update integrity via 4KB sector granularity and hardware write protection - eliminating risk of bricking during power loss. |
| Parameter & Calibration Data | Secure Key Storage |
Use Scenario: Retaining runtime-tuned sensor calibration coefficients, motor PID gains, or user preferences across power cycles. IC Role / Device Role / Timing Role: Low-power, byte-addressable non-volatile storage updated infrequently but read frequently during operation. Use Value: Leverages 100K endurance and 20-year retention to outlive product lifecycle - avoiding EEPROM wear-out concerns. |
Use Scenario: Isolating AES keys, TLS certificates, or device identity tokens from main firmware image. IC Role / Device Role / Timing Role: Dedicated security domain using three 256-byte OTP-capable registers with lock bits (LB1–LB3). Use Value: Prevents key extraction via physical probing or firmware dump - as registers reside in electrically isolated memory region. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64 M-bit, 104 MHz max clock, no Quad I/O suspend/resume, no Security Registers | Lacks Erase/Program Suspend and 64-bit UID - unsuitable for real-time update staging or secure key binding | Lower-cost option where XIP performance and security features are non-critical |
| S25FL164K0XMFI011 | 64 M-bit, 80 MHz max clock, HyperBus interface optional, no WSON 8×6-mm package | Requires different layout (16-pin SOIC or BGA); lacks JEDEC SFDP register - complicates auto-configuration in Linux MTD | Preferred for legacy designs already using Cypress toolchain and needing pin-compatible upgrade path |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI011, W25Q64JVZEIM delivers superior XIP throughput (532 MHz equiv.), integrated security primitives, and industry-standard WSON 8×6-mm footprint - making it optimal for new industrial controllers and connected edge devices requiring field-upgradable firmware with cryptographic integrity.
Availability
W25Q64JVZEIM is available at Aetrix Electronics and suitable for boot code storage, firmware update staging, and secure key storage requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for W25Q64JVZEIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25Q series targets embedded systems requiring high-speed, low-power, and secure non-volatile storage - designed specifically for code shadowing, XIP execution, and firmware integrity in industrial, automotive, and IoT applications.
FAQ
What is the package type and footprint of W25Q64JVZEIM?
W25Q64JVZEIM uses an 8-pad WSON package measuring 8 mm × 6 mm (JEDEC MO-241AC, code ZE) with an exposed thermal pad. It is pin-compatible with other W25Q64JV variants in WSON 8×6-mm format but differs from SOIC, TFBGA, and WLCSP versions in land pattern and thermal characteristics.
Does W25Q64JVZEIM support hardware reset via /RESET pin?
No. The W25Q64JVZEIM package does not include a dedicated /RESET pin. Hardware reset is only available on SOIC-16 (SF) and TFBGA (TB/TC) packages. For W25Q64JVZEIM, system-level reset must be implemented via software sequence (66h + 99h) or power-cycle recovery.
How is Quad SPI mode enabled on W25Q64JVZEIM?
Quad SPI mode on W25Q64JVZEIM requires setting the Quad Enable (QE) bit in Status Register-2 (SR2) to '1' using Write Status Register-2 (31h) instruction. Once enabled, /WP becomes IO2 and /HOLD becomes IO3, allowing four-line data transfer for instructions like Fast Read Quad I/O (EBh).
What is the purpose of the three Security Registers in W25Q64JVZEIM?
W25Q64JVZEIM includes three independent 256-byte Security Registers (SR1–SR3) for storing sensitive data such as encryption keys or calibration secrets. They support one-time-programmable (OTP) locking via LB1–LB3 bits and are physically isolated from the main memory array to prevent unauthorized access.
Can W25Q64JVZEIM be used for Execute-in-Place (XIP) applications?
Yes. W25Q64JVZEIM supports XIP via Fast Read Quad I/O (EBh) and Quad Input Page Program (32h) instructions, delivering up to 532 MHz equivalent bandwidth. Its uniform 4KB sector architecture and Erase/Program Suspend capability ensure deterministic latency during real-time code execution from flash.
W25Q64JVZEIM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64JVZEIM FAQ
1.How can I place an order for W25Q64JVZEIM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64JVZEIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64JVZEIM reliable?
The price and inventory of W25Q64JVZEIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JVZEIM is usually 5 days.
3.What payment methods are accepted for W25Q64JVZEIM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JVZEIM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64JVZEIM?
W25Q64JVZEIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64JVZEIM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64JVZEIM?
For technical support, including W25Q64JVZEIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JVZEIM requirements.
6.How does Aetrix verify that W25Q64JVZEIM is sourced from the original manufacturer or authorized distributors?
All W25Q64JVZEIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JVZEIM meets industry standards.
7.What is the process for return or replacement of W25Q64JVZEIM?
All W25Q64JVZEIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JVZEIM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64JVZEIM part is unused and in its original packaging.
Return procedure for W25Q64JVZEIM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q64JVZEIM Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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