Winbond Electronics Corporation W25Q64JVZEJM
- Part No.:
- W25Q64JVZEJM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64JVZEJM.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q64JVZEJM from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Dual/Quad SPI, QPI, and DTR read modes for high-speed code execution and data storage in space-constrained embedded systems. It operates from 2.7V to 3.6V, delivers up to 133MHz SPI clock rate (532MHz equivalent Quad I/O), features 4KB uniform sectors, 100K program-erase cycles per sector, and 20+ year data retention.
For engineers reviewing the W25Q64JVZEJM datasheet, W25Q64JVZEJM pinout, W25Q64JVZEJM application, or W25Q64JVZEJM equivalent, this device is selected for XIP-capable boot memory, firmware storage with hardware write protection, and industrial-grade parameter logging where low-power standby (<1µA), JEDEC-compliant ID, SFDP register support, and 64-bit unique serial number are required.
Technical Context
The W25Q64JVZEJM implements a flexible SPI-compatible interface with configurable I/O modes: Standard (4-wire), Dual (2 I/O lines), Quad (4 I/O lines), and QPI (4-wire full-duplex). Its architecture supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes.
It integrates volatile and non-volatile status/configuration registers including Quad Enable (QE), Block Protect (BP2–BP0), Top/Bottom protect (TB), Security Register Locks (LB1–LB3), and Output Driver Strength (DRV1/DRV0), enabling fine-grained memory protection and timing optimization across industrial temperature ranges (−40°C to +105°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB), organized as 32,768 × 256-byte pages |
| Operating Voltage | 2.7 V to 3.6 V - compatible with standard 3.3V logic rails and tolerant of supply variation |
| Max Clock Frequency | 133 MHz SPI; enables 266 MB/s dual-I/O and 532 MB/s quad-I/O effective throughput |
| Erase Granularity | Uniform 4 KB sectors (2,048 total), 32 KB blocks (256), 64 KB blocks (128) - supports mixed code/data partitioning |
| Endurance & Retention | 100,000 program/erase cycles per sector; >20 years data retention at +85°C |
| Temperature Range | −40°C to +105°C - qualified for Industrial Plus grade applications requiring extended thermal stability |
| Power-Down Current | 1 µA typical - enables ultra-low-power sleep states in battery-backed or energy-harvesting systems |
| Security Features | 64-bit unique ID, three 256-byte OTP-lockable security registers, SFDP v1.6 register, and JEDEC manufacturer/device ID |
Pinout & Package
W25Q64JVZEJM is supplied in an 8-pad WSON 8x6-mm package (JEDEC MO-241AC, package code ZE), with exposed pad for thermal dissipation and no internal /RESET pin - /HOLD (IO3) shares pin 7 functionality in Standard/Dual SPI mode only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before accepting instructions |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Unidirectional output in Standard SPI; bidirectional IO1 in Dual/Quad SPI/QPI |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware sector lock when low; becomes IO2 in Quad mode (QE=1) |
| 4 GND | Ground Reference | Primary return path; connects to exposed pad for thermal and EMI performance |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Unidirectional input in Standard SPI; bidirectional IO0 in Dual/Quad SPI/QPI |
| 6 CLK | Serial Clock Input | Edge-triggered timing source; supports SPI Modes 0 and 3; max 133 MHz |
| 7 /HOLD (IO3) | Hold Input / Bidirectional I/O | Pauses ongoing transfer while /CS active; becomes IO3 in Quad mode (QE=1) |
| 8 VCC | Power Supply | 2.7–3.6 V core and I/O supply; decoupling capacitor required near pin |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead via 4-wire full-duplex protocol - eliminates repeated opcode transmission during burst reads |
| DTR (Double Transfer Rate) Read | Enables data sampling on both clock edges in Fast Read DTR modes (0Dh, BDh, EDh) - doubles effective bandwidth without increasing clock frequency |
| Erase/Program Suspend & Resume | Allows background erase or program to be paused for higher-priority operations (e.g., real-time interrupt handling), then resumed without data loss |
| Volatile & Non-Volatile Status Registers | Enables runtime configuration (e.g., driver strength, hold/reset function mapping) while preserving critical settings like QE and BP bits across power cycles |
| Individual Sector Lock via Security Registers | Three 256-byte OTP-lockable registers allow secure storage of keys or calibration data - locked permanently after programming |
| Continuous Read with Wrap | Supports seamless sequential access across page boundaries using 8/16/32/64-byte wrap - essential for deterministic XIP execution latency |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating continuously in harsh factory environments. IC Role / Device Role / Timing Role: Primary boot memory mapped for XIP execution; provides fast random access to interrupt vectors and deterministic latency for cyclic control tasks. Use Value: 4KB sector granularity enables independent update of control logic vs. safety-critical parameters; 100K endurance ensures >10-year field life under frequent OTA updates. |
Use Scenario: Hosting boot code and sensor fusion algorithms for automotive camera/radar ECUs requiring ASIL-B compliant startup behavior. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with verified integrity via SFDP register and unique ID - used during cold boot before DRAM initialization. Use Value: Hardware /WP and TB/BP bits prevent accidental overwrite of bootloader region; −40°C to +105°C rating meets AEC-Q100 Grade 2 requirements. |
| Medical Imaging Data Buffer | Smart Energy Meter Firmware Vault |
|
Use Scenario: Temporary storage of compressed DICOM image frames during acquisition in portable ultrasound devices with limited PCB area. IC Role / Device Role / Timing Role: High-bandwidth data buffer accessed via Quad I/O bursts; leverages 532 MHz equivalent throughput to minimize frame latency. Use Value: DTR Fast Read Quad I/O (EDh) achieves sustained 66 MB/s - sufficient for real-time streaming of 1080p grayscale video at 30 fps. |
Use Scenario: Secure storage of tariff tables, cryptographic keys, and firmware signatures in utility-grade smart meters deployed outdoors for 15+ years. IC Role / Device Role / Timing Role: Tamper-resistant firmware vault using OTP-locked security registers and JEDEC-compliant device ID for remote attestation. Use Value: 64-bit unique ID enables per-device key binding; 20+ year data retention guarantees meter calibration validity over full service lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64Mb, 104MHz max clock, no DTR support, lacks SFDP register and unique ID | Suitable for cost-sensitive consumer designs without XIP or security needs | Lower BOM cost but requires software-managed configuration; not drop-in for DTR or SFDP-dependent firmware |
| S25FL164K0XMFI010 | 64Mb, 80MHz max clock, HyperBus interface option, includes ECC, no QPI/DTR | Better suited for high-integrity applications needing built-in error correction | Requires HyperBus controller or SPI-to-HyperBus bridge; larger footprint (16-pin SOIC); no DTR acceleration path |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64JVZEJM uniquely combines DTR read acceleration, QPI protocol efficiency, SFDP discoverability, and industrial-plus temperature range - making it optimal for next-generation embedded systems demanding both speed and configurability without interface translation.
Availability
W25Q64JVZEJM is available at Aetrix Electronics and suitable for industrial automation, automotive telematics, and medical diagnostics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for W25Q64JVZEJM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.
The W25Q series was designed specifically for high-performance, low-power embedded systems requiring reliable code storage, XIP capability, and robust security - targeting applications where parallel flash footprint and power consumption are unacceptable.
FAQ
What is the package type and pin count of W25Q64JVZEJM?
W25Q64JVZEJM uses an 8-pad WSON package measuring 8 mm × 6 mm (package code ZE), with no /RESET pin. Pin functions include /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD (IO3), and VCC. This compact footprint supports high-density PCB layouts while maintaining full Dual/Quad SPI and QPI functionality.
Does W25Q64JVZEJM support hardware reset functionality?
No, W25Q64JVZEJM does not include a dedicated hardware /RESET pin. The /HOLD pin (pin 7) can serve as /RESET only in specific configurations of other packages (e.g., TFBGA or 16-pin SOIC), but in the ZE package, pin 7 is strictly /HOLD (IO3) in Standard/Dual mode and IO3 in Quad mode - no hardware reset capability is implemented.
How does W25Q64JVZEJM enable execute-in-place (XIP) operation?
W25Q64JVZEJM enables true XIP through Continuous Read Mode with ≤8-clock instruction overhead and configurable wrap lengths (8/16/32/64 bytes), combined with high-speed Quad I/O and QPI interfaces. This allows microcontrollers to fetch and execute code directly from flash without copying to RAM - reducing latency and system memory requirements.
What security features are implemented in W25Q64JVZEJM?
W25Q64JVZEJM includes hardware write protection (/WP pin), top/bottom/complement sector locking (TB, BP, SEC, CMP bits), three 256-byte OTP-lockable security registers, a 64-bit unique serial number, JEDEC-standard manufacturer/device ID, and an SFDP v1.6 register - collectively enabling secure boot, firmware authentication, and tamper-resistant parameter storage.
Is W25Q64JVZEJM compatible with standard SPI controllers?
Yes, W25Q64JVZEJM is fully backward-compatible with standard SPI controllers using Mode 0 or Mode 3. It supports all standard SPI instructions (e.g., Read Data 03h, Page Program 02h) on pins /CS, CLK, DI, and DO. Dual/Quad SPI, QPI, and DTR modes are optional enhancements activated via status register configuration and extended instructions.
W25Q64JVZEJM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64JVZEJM FAQ
1.How can I place an order for W25Q64JVZEJM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64JVZEJM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64JVZEJM reliable?
The price and inventory of W25Q64JVZEJM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JVZEJM is usually 5 days.
3.What payment methods are accepted for W25Q64JVZEJM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JVZEJM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64JVZEJM?
W25Q64JVZEJM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64JVZEJM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64JVZEJM?
For technical support, including W25Q64JVZEJM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JVZEJM requirements.
6.How does Aetrix verify that W25Q64JVZEJM is sourced from the original manufacturer or authorized distributors?
All W25Q64JVZEJM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JVZEJM meets industry standards.
7.What is the process for return or replacement of W25Q64JVZEJM?
All W25Q64JVZEJM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JVZEJM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64JVZEJM part is unused and in its original packaging.
Return procedure for W25Q64JVZEJM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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