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Winbond Electronics Corporation W25Q64JWTBIQ TR

Part No.:
W25Q64JWTBIQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q64JWTBIQ TR.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,407

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Product details

Overview

W25Q64JWTBIQ TR from Winbond is a 64M-bit (8MB) 1.8V serial NOR flash memory supporting Standard, Dual, and Quad SPI interfaces with up to 133MHz clock frequency, 66MB/s continuous read throughput, and industrial-grade -40°C to +105°C operation. It features uniform 4KB sectors, 32KB/64KB blocks, erase/program suspend/resume, and hardware write protection via /WP pin - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.

For engineers reviewing the W25Q64JWTBIQ TR datasheet, W25Q64JWTBIQ TR pinout, W25Q64JWTBIQ TR application, or W25Q64JWTBIQ TR equivalent, key selection criteria include Quad SPI enable (QE bit), /HOLD vs /RESET pin availability per package, 1.7–1.95V supply compliance, sector-level lock granularity, and JEDEC SFDP register support for auto-configuration.

Technical Context

The W25Q64JWTBIQ TR implements a SPI-compatible command set with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where Quad mode requires non-volatile QE bit setting in Status Register-2. Its architecture includes a 256-byte page buffer, 2,048 erasable 4KB sectors, and dedicated security registers (3 × 256 bytes).

It supports hardware reset only on TFBGA and SOIC-16 packages - not on the WSON 8x6-mm (ZE) package used by W25Q64JWTBIQ TR - and uses /HOLD as IO3 in Quad mode. Write protection combines volatile/non-volatile status bits (BP2–BP0, TB, SEC, CMP) with dedicated /WP pin control and OTP-lockable security registers.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 M-bit (8 MB), organized as 32,768 × 256-byte pages
Supply Voltage1.7 V to 1.95 V - enables low-power operation in battery-backed and energy-constrained systems
Max Clock Frequency133 MHz Quad I/O - delivers 532 Mbps effective bandwidth for fast boot code loading
Erase Granularity4 KB sectors, 32 KB blocks, 64 KB blocks - allows fine-grained firmware partitioning and OTA update safety
Data Retention20+ years - ensures long-term reliability in unattended industrial deployments
Endurance100,000 program/erase cycles - supports frequent field firmware updates without premature wear-out
Operating Temp-40°C to +105°C - qualified for extended industrial and automotive under-hood applications
Security Features64-bit unique ID, SFDP register, 3×256-byte security registers, OTP-lockable protection bits

Pinout & Package

W25Q64JWTBIQ TR uses the 8-pad WSON 8x6-mm package (Package Code ZE), with exposed thermal pad. Pin functions are identical across SOIC/WSON/XSON/USON variants except for /RESET pin absence - this variant does not include a dedicated /RESET pin.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; high-impedance DO/IOs when deasserted; required edge transition before instruction acceptance
DO (IO1)Serial Data Output / Quad I/O 1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad mode; falls on CLK edge
/WP (IO2)Write Protect Input / Quad I/O 2Active-low hardware lock for status register; becomes IO2 when QE=1 in Quad mode
GNDGround ReferencePrimary return path for all I/O and core logic; must be low-impedance for timing integrity
DI (IO0)Serial Data Input / Quad I/O 0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad mode; rises on CLK edge
CLKSerial Clock InputMaster-generated timing reference; supports Mode 0 and Mode 3; max 133 MHz in Quad I/O
/HOLD (IO3)Hold Input / Quad I/O 3Pauses active transfers when low; becomes IO3 in Quad mode; not available as /HOLD when QE=1
VCCPower Supply1.7–1.95 V core supply; decoupling capacitor required near pin for stable read/write margins

Key Features

FeatureDesign Value
Dual/Quad SPI Read AccelerationEnables 66 MB/s continuous reads via Fast Read Quad I/O (EBh), reducing boot time by >4× vs Standard SPI
Erase/Program Suspend & ResumeAllows background execution of time-critical tasks while flash operations pause - critical for real-time OS integration
Uniform 4KB Sector ArchitecturePermits independent locking and erasing of firmware configuration sections without affecting adjacent application code
Hardware + Software Write ProtectionCombines /WP pin control with BP/TB/SEC/CMP bits to prevent accidental corruption during power transients or SW faults
JEDEC SFDP Register SupportEnables automatic driver initialization via standardized parameter table - eliminates hard-coded timing constants in BSPs
64-bit Unique Serial NumberProvides device-level traceability for secure provisioning, anti-cloning, and field failure root-cause analysis

Applications

Boot Code StorageFirmware Update Partition

Use Scenario: Storing primary bootloader and initial application image executed directly from flash (XIP) on Cortex-M7 or RISC-V SoCs.

IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic Quad SPI access latency and 133 MHz clock tolerance.

Use Value: Eliminates external RAM copy step during boot, reducing BOM cost and startup time by up to 300 ms.

Use Scenario: Isolating field-upgradable firmware images in dedicated 64KB blocks with atomic erase/write capability.

IC Role / Device Role / Timing Role: Secure, wear-leveled update storage with sector-level lock enforcement and suspend/resume for safe interruption.

Use Value: Enables fail-safe dual-bank OTA updates without risk of bricking due to power loss mid-write.

Industrial HMI ConfigurationAutomotive Telematics Log Buffer

Use Scenario: Persisting UI theme settings, calibration data, and user preferences in factory-floor HMIs operating at +105°C.

IC Role / Device Role / Timing Role: Parameter storage with 4KB sector granularity and hardware /WP pin lock against ESD-induced writes.

Use Value: Guarantees data integrity over 20-year product lifecycle despite repeated thermal cycling and voltage ripple.

Use Scenario: Capturing CAN bus diagnostic logs and GPS metadata in telematics control units with intermittent power.

IC Role / Device Role / Timing Role: Low-voltage (1.7V) logging buffer with <1 µA power-down current and fast 4KB sector erase.

Use Value: Extends backup capacitor hold-up time by >40% vs 3.3V flash, enabling full log retention during ignition-off transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L6433FZNI-10G3.3V supply, 104MHz max Quad SPI, no /HOLD pin in 8-pin SOIC, lacks SFDP registerRequires level-shifting in 1.8V systems; no auto-configuration support; lower temperature grade (–40°C to +85°C)Select only if legacy 3.3V design constraints prohibit voltage translation and SFDP is unused.
S25FL164K0XMFI0111.8V supply, 80MHz Quad SPI, 128KB sector minimum erase, no /WP pin in 8-pin WSONCoarser erase granularity limits firmware partitioning flexibility; missing hardware write protect pin increases software dependency.Prefer for cost-sensitive designs where 128KB erase alignment is acceptable and /WP is not required for safety-critical lock.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI011, the W25Q64JWTBIQ TR uniquely combines 1.8V operation, 133MHz Quad SPI, 4KB sector erase, integrated /WP pin, and SFDP - making it optimal for new industrial and automotive designs requiring both performance and configurability.

Availability

W25Q64JWTBIQ TR is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive telematics firmware partitions, and medical device configuration persistence requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W25Q64JWTBIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND flash, SRAM, and mobile DRAM.

The W25Q series targets high-reliability embedded systems needing fast, secure, low-voltage serial flash for code execution, firmware storage, and parameter retention - with emphasis on industrial, automotive, and networking applications.

FAQ

What is the package type and footprint of W25Q64JWTBIQ TR?

W25Q64JWTBIQ TR uses the 8-pad WSON 8x6-mm package (JEDEC MO-255, Package Code ZE) with an exposed thermal pad. It shares pinout compatibility with other WSON variants (ZP, XG, UU) but differs from TFBGA and SOIC packages by omitting the dedicated /RESET pin. Footprint dimensions are 8.0 mm × 6.0 mm × 0.75 mm height, with 0.8 mm pad pitch.

Does W25Q64JWTBIQ TR support hardware reset (/RESET pin)?

No, W25Q64JWTBIQ TR does not support hardware reset. The /RESET pin is only available on SOIC-16 and TFBGA packages per Winbond documentation. This WSON 8x6-mm variant relies solely on software reset (66h + 99h instructions). Designers must implement robust power sequencing and software-initiated recovery instead of hardware assertion.

How is Quad SPI mode enabled on W25Q64JWTBIQ TR?

Quad SPI mode on W25Q64JWTBIQ TR is enabled by setting the non-volatile Quad Enable (QE) bit in Status Register-2 using the Write Status Register-2 (31h) instruction. Once QE=1, pins /WP and /HOLD become IO2 and IO3 respectively. The change persists across power cycles unless explicitly cleared, and is verified via Read Status Register-2 (35h).

What is the minimum supply voltage required for reliable operation of W25Q64JWTBIQ TR?

W25Q64JWTBIQ TR requires a minimum supply voltage of 1.7 V for guaranteed specification compliance across its full operating temperature range (–40°C to +105°C). Operation below 1.7 V may result in undefined behavior, failed writes, or incomplete erase cycles - especially during power-up sequences where internal regulators require stable VCC before accepting commands.

Can W25Q64JWTBIQ TR be used for Execute-in-Place (XIP) applications?

Yes, W25Q64JWTBIQ TR supports Execute-in-Place (XIP) via Dual and Quad SPI interfaces. Its 133 MHz Quad I/O clock and Fast Read Quad I/O (EBh) instruction deliver up to 66 MB/s sustained read throughput, enabling direct code execution from flash on compatible microcontrollers - eliminating need for RAM shadowing in resource-constrained embedded systems.

W25Q64JWTBIQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI, DTR
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
6 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25Q64JWTBIQ TR FAQ

1.How can I place an order for W25Q64JWTBIQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64JWTBIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64JWTBIQ TR reliable?

The price and inventory of W25Q64JWTBIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JWTBIQ TR is usually 5 days.

3.What payment methods are accepted for W25Q64JWTBIQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JWTBIQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64JWTBIQ TR?

W25Q64JWTBIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64JWTBIQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64JWTBIQ TR?

For technical support, including W25Q64JWTBIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JWTBIQ TR requirements.

6.How does Aetrix verify that W25Q64JWTBIQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q64JWTBIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JWTBIQ TR meets industry standards.

7.What is the process for return or replacement of W25Q64JWTBIQ TR?

All W25Q64JWTBIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JWTBIQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64JWTBIQ TR part is unused and in its original packaging.

Return procedure for W25Q64JWTBIQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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