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Winbond Electronics Corporation W25Q64JWXGIM TR
- Part No.:
- W25Q64JWXGIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-XDFN Exposed Pad
- Datasheet:
-
W25Q64JWXGIM TR.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,958
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Product details
Overview
W25Q64JWXGIM TR from Winbond is a 1.8V, 64M-bit serial NOR flash memory with Dual/Quad SPI, QPI, and Double Transfer Rate (DTR) support, organized as 32,768 × 256-byte pages. It delivers up to 133 MHz Quad I/O clocking, 66 MB/s continuous read throughput, and supports execute-in-place (XIP) operation. Used for code storage, firmware boot images, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q64JWXGIM TR datasheet, W25Q64JWXGIM TR pinout, W25Q64JWXGIM TR application, or W25Q64JWXGIM TR equivalent, key selection factors include its 1.7–1.95 V supply range, 4 KB uniform sector erase granularity, JEDEC-compliant SFDP register, 64-bit unique ID, and hardware write protection via /WP and /HOLD pins - all critical for secure, low-power, high-reliability firmware storage.
Technical Context
The W25Q64JWXGIM TR implements a quad I/O SPI interface with non-volatile Quad Enable (QE) bit in Status Register-2, enabling IO0–IO3 bidirectional operation only when QE=1. Its DTR mode doubles data rate per clock edge for Fast Read Quad I/O (EDh) and DTR Burst Read (0Eh), achieving effective 532 MHz bandwidth at 133 MHz CLK.
It integrates volatile/non-volatile status register bits for flexible protection (BP2–BP0, TB, SEC, CMP, SRP), erase/program suspend/resume capability, and four 256-byte OTP-lockable security registers. The device supports both software reset (66h+99h) and hardware reset - though /RESET is not available on 8-pin packages like XG (4×4-mm XSON); /HOLD serves dual function there.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB), organized as 32,768 × 256-byte pages |
| Supply Voltage | 1.7–1.95 V - enables direct integration with 1.8 V logic domains without level shifting |
| Max Clock Frequency | 133 MHz Quad I/O - enables 66 MB/s sustained read throughput for fast boot and XIP |
| Erase Granularity | Uniform 4 KB sectors (1,024 total), plus 32 KB and 64 KB blocks - supports fine-grained firmware updates |
| Endurance & Retention | 100,000 program/erase cycles; >20 years data retention at 25°C - suitable for field-upgradable systems |
| Interface Modes | Standard/Dual/Quad SPI, QPI, and DTR - selectable via instruction set; QE bit controls IO2/IO3 mapping |
| Security Features | 64-bit unique ID, SFDP register, 3×256-byte security registers with OTP locks, top/bottom/complement protection |
Pinout & Package
W25Q64JWXGIM TR uses an 8-pad XSON 4×4-mm package (Package Code XG), with exposed pad for thermal dissipation and no lead finish restrictions. Pin functions are identical across SOIC, USON, WSON, and XSON 8-pin variants per datasheet Figure 1b and Section 3.3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high-impedance DO and standby current (≤1 µA) when deasserted |
| 2 DO (IO1) | Data Output / Bidirectional I/O1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI/QPI after QE=1 |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O2 | Hardware lock for status register when QE=0; becomes IO2 in Quad mode (QE=1) |
| 4 GND | Ground Reference | Primary return path; connects to exposed pad in XSON for thermal and EMI control |
| 5 DI (IO0) | Data Input / Bidirectional I/O0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI/QPI after QE=1 |
| 6 CLK | Serial Clock Input | Edge-triggered timing source; supports Mode 0 and Mode 3; max 133 MHz in Quad I/O |
| 7 /HOLD (IO3) | Hold or Reset Input / Bidirectional I/O3 | Pauses ongoing transfers when low; becomes IO3 in Quad mode (QE=1); no dedicated /RESET in XG |
| 8 VCC | Power Supply | 1.7–1.95 V core supply; decoupling capacitor required per datasheet layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| DTR Read Support | Enables double-data-rate reads (e.g., EDh, 0Eh), doubling effective bandwidth without increasing CLK frequency |
| Quad Peripheral Interface (QPI) | Reduces instruction overhead: 2-clock instruction load vs. 8-clock SPI, accelerating command execution and XIP latency |
| Erase/Program Suspend & Resume | Allows background operations (e.g., reading while erasing a sector), improving real-time system responsiveness |
| Volatile & Non-Volatile Status Bits | Enables runtime configuration (e.g., DRV0/DRV1 drive strength) and persistent protection (BP2–BP0, SRP) |
| JEDEC SFDP Register | Provides standardized, discoverable parameters (timing, density, erase types) for automated flash initialization |
| 64-Bit Unique Serial Number | Enables device-level traceability and cryptographic key binding in secure boot and firmware validation |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers operating in -40°C to +85°C environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface for deterministic boot timing. Use Value: 4 KB sector erase enables incremental firmware patching without full reflash; 100K endurance ensures 10+ years of field updates. |
Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs requiring AEC-Q100 compliance and secure boot. IC Role / Device Role / Timing Role: Secure firmware repository with 64-bit unique ID and OTP-locked security registers for cryptographic verification. Use Value: SFDP register enables auto-negotiated initialization; DTR read mode reduces boot time by ~30% vs. standard Quad SPI. |
| Medical IoT Sensor Node | Consumer Smart Home Hub |
|
Use Scenario: Retaining device-specific calibration coefficients and usage logs in battery-powered wearable diagnostics equipment. IC Role / Device Role / Timing Role: Low-power parameter storage with <0.1 µA deep power-down current and fast wake-up via /CS toggle. Use Value: 1.8 V operation eliminates need for voltage translators; hardware /WP pin prevents accidental register corruption during brown-out. |
Use Scenario: Hosting OTA update payloads and UI assets in voice-controlled home automation hubs with constrained PCB area. IC Role / Device Role / Timing Role: High-density code/data storage using XSON 4×4-mm footprint (30% smaller than SOIC). Use Value: 66 MB/s read speed accelerates UI asset loading; uniform 4 KB sectors simplify delta-update management in resource-limited MCU environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZUI-10G | 3.3 V supply (vs. 1.8 V); no DTR or QPI; max 104 MHz clock; lacks SFDP and unique ID | Requires level-shifting in 1.8 V systems; unsuitable for XIP-critical or secure-boot designs | Select only if legacy 3.3 V infrastructure exists and DTR/QPI/SFDP are unnecessary |
| S25FL164K0XMFI010 | 1.8 V compatible; includes HyperBus interface (not SPI); 133 MHz DDR mode; no /HOLD pin in 8-pin variant | Demands HyperBus controller; incompatible pinout and command set; higher cost | Choose only when migrating to Cypress/Infineon ecosystem with HyperBus-enabled SoCs |
Compared with W25Q64JWXGIM TR, MX25L6433FZUI-10G lacks voltage compatibility and advanced features needed for modern low-power XIP, while S25FL164K0XMFI010 requires architectural changes due to HyperBus dependency - making W25Q64JWXGIM TR the optimal balance of SPI compatibility, feature richness, and 1.8 V integration.
Availability
W25Q64JWXGIM TR is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and medical IoT sensors requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W25Q64JWXGIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25Q64JW family targets high-performance, low-voltage embedded systems requiring reliable code storage, secure firmware updates, and seamless SPI-to-XIP migration - with W25Q64JWXGIM TR optimized for compact 1.8 V designs.
FAQ
What is the package type and footprint of W25Q64JWXGIM TR?
W25Q64JWXGIM TR uses an 8-pad XSON 4×4-mm package (Package Code XG) with exposed thermal pad. It has identical pinout to SOIC, USON, and WSON variants per Winbond datasheet Section 3.2–3.3, enabling drop-in replacement across form factors where board space permits. The XSON footprint measures 4.0 mm × 4.0 mm × 0.45 mm height.
Does W25Q64JWXGIM TR support hardware reset via a dedicated /RESET pin?
No - W25Q64JWXGIM TR does not include a dedicated /RESET pin. In its XSON 4×4-mm package, Pin 7 functions as /HOLD (or /RESET) only when QE=0 and configured via Status Register; it becomes IO3 in Quad mode (QE=1). Dedicated /RESET is available only on TFBGA and 16-pin SOIC packages, not on XG.
How is Quad SPI mode enabled on W25Q64JWXGIM TR?
Quad SPI mode on W25Q64JWXGIM TR is enabled by setting the non-volatile Quad Enable (QE) bit in Status Register-2 (bit 1) using Write Status Register-2 (31h) instruction. Once QE=1, pins /WP and /HOLD become IO2 and IO3 respectively, enabling full 4-line bidirectional communication for instructions like Fast Read Quad I/O (EBh) and DTR Fast Read Quad I/O (EDh).
What is the purpose of the SFDP register in W25Q64JWXGIM TR?
The SFDP (Serial Flash Discoverable Parameters) register in W25Q64JWXGIM TR provides JEDEC-standardized, read-only metadata about device capabilities - including density, timing parameters, erase block sizes, and supported instructions. This enables host MCUs to auto-configure drivers without hard-coded assumptions, improving portability and reducing bring-up time.
Can W25Q64JWXGIM TR be used for execute-in-place (XIP) applications?
Yes - W25Q64JWXGIM TR supports true XIP via Quad SPI and QPI modes, delivering up to 66 MB/s continuous read throughput and low-latency random access. Its DTR capability further improves effective bandwidth, while uniform 4 KB sectors and erase/program suspend allow concurrent code execution and background firmware updates.
W25Q64JWXGIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON (4x4)
W25Q64JWXGIM TR FAQ
1.How can I place an order for W25Q64JWXGIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64JWXGIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64JWXGIM TR reliable?
The price and inventory of W25Q64JWXGIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JWXGIM TR is usually 5 days.
3.What payment methods are accepted for W25Q64JWXGIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JWXGIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64JWXGIM TR?
W25Q64JWXGIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64JWXGIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64JWXGIM TR?
For technical support, including W25Q64JWXGIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JWXGIM TR requirements.
6.How does Aetrix verify that W25Q64JWXGIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q64JWXGIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JWXGIM TR meets industry standards.
7.What is the process for return or replacement of W25Q64JWXGIM TR?
All W25Q64JWXGIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JWXGIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64JWXGIM TR part is unused and in its original packaging.
Return procedure for W25Q64JWXGIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q64JWXGIM TR Tags
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M24C02-WMN6TP
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AT21CS01-STUM10-T
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