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Winbond Electronics Corporation W25Q64JWZEIQ

Part No.:
W25Q64JWZEIQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q64JWZEIQ.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,465

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Product details

Overview

W25Q64JWZEIQ from Winbond is a 1.8V, 64M-bit (8MB) serial NOR flash memory supporting Standard, Dual, and Quad SPI interfaces with up to 133MHz clock frequency, 66MB/s continuous read throughput, and 4KB uniform sector architecture - deployed for XIP code execution, firmware storage, and parameter retention in space-constrained embedded systems.

For engineers reviewing the W25Q64JWZEIQ datasheet, W25Q64JWZEIQ pinout, W25Q64JWZEIQ application, or W25Q64JWZEIQ equivalent, this page delivers verified package mapping (8-pad WSON 8×6-mm, code ZE), Quad I/O enable logic, hardware write-protect behavior, sector/block erase granularity, and JEDEC-compliant identification registers - all confirmed against Winbond's official Rev. B datasheet (Nov. 2019).

Technical Context

The W25Q64JWZEIQ implements a quad-I/O SPI interface requiring the non-volatile Quad Enable (QE) bit in Status Register-2 to be set; when enabled, /WP becomes IO2 and /HOLD becomes IO3. It supports SPI modes 0 and 3, with dual/quad instructions enabling 2×–6× faster data transfer versus standard SPI.

Its memory array comprises 32,768 pages of 256 bytes each, organized into 2,048 erasable 4KB sectors and 128 erasable 64KB blocks. Erase/program suspend/resume functionality enables concurrent background operations, while three 256-byte security registers support secure boot and key storage.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density64 M-bit (8 MB) - sufficient for full MCU firmware images and multi-region OTA update partitions.
Supply Voltage1.7 V to 1.95 V - compatible with low-power 1.8V system rails; eliminates level-shifting in modern SoC designs.
Max Clock Frequency133 MHz Quad I/O - enables 532 Mbps effective throughput (133 MHz × 4 lines), outperforming parallel NOR in bandwidth-per-pin.
Erase Granularity4 KB sectors / 32 KB & 64 KB blocks - allows fine-grained firmware patching without disturbing adjacent configuration or calibration data.
Endurance & Retention100,000 program-erase cycles / >20 years data retention - validated for industrial lifecycle requirements in field-deployed devices.
Security Features64-bit unique ID, SFDP register, three 256-byte security registers, OTP-lockable regions - supports secure boot chain and device identity binding.
Operating Temperature−40°C to +85°C - qualified for extended industrial ambient operation without derating.

Pinout & Package

W25Q64JWZEIQ uses the 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond code ZE), with exposed thermal pad. Pin functions are identical across SOIC, WSON, XSON, USON, and TFBGA variants except for dedicated /RESET availability.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable: high = high-Z outputs and standby current (<1 µA); must transition high→low before instruction acceptance.
DO (IO1)Data Output / Bidirectional I/O1Standard SPI output only; becomes bidirectional IO1 in Dual/Quad mode - used for read data and address transmission.
/WP (IO2)Write Protect Input / Bidirectional I/O2Hardware write lock for status register; repurposed as IO2 when QE=1 - requires external pull-up if unused in Quad mode.
GNDGround ReferencePrimary return path for VCC and I/O signals; thermal pad must be soldered to PCB ground plane for thermal reliability.
DI (IO0)Data Input / Bidirectional I/O0Standard SPI input only; becomes bidirectional IO0 in Dual/Quad mode - carries instructions, addresses, and program data.
CLKSerial Clock InputEdge-triggered timing reference: rising edge for input, falling edge for output - supports modes 0 and 3 for host compatibility.
/HOLD (IO3)Hold Input / Bidirectional I/O3Pauses active transfers when low; repurposed as IO3 when QE=1 - not available during Quad I/O operation unless disabled.
VCCPower Supply1.7–1.95 V core supply; decoupling capacitor (≥1 µF) required within 5 mm of pin per datasheet layout guidelines.

Key Features

Feature Design Value
Quad I/O InterfaceEnables 532 Mbps effective bandwidth via 4-line simultaneous read; requires QE bit set and host driver support for Fast Read Quad I/O (EBh).
Erase/Program SuspendAllows pausing a long erase or program operation to service urgent reads - critical for real-time systems with mixed latency requirements.
Uniform 4KB Sector ArchitecturePermits independent firmware module updates without erasing entire 64KB blocks - reduces wear on adjacent sectors and improves OTA update efficiency.
Hardware Write Protection/WP pin + BP/TB/SEC bits provide layered protection: sector-level lock, top/bottom array selection, and complement-based locking for robust firmware integrity.
Security RegistersThree independent 256-byte registers support encrypted key storage, secure boot manifests, and anti-cloning identifiers - accessible only via dedicated security instructions.

Applications

IoT Edge Node Firmware Storage Industrial PLC Boot Memory

Use Scenario: Storing signed firmware images and runtime configuration in battery-powered sensor nodes with strict power budgets.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and fast Quad SPI read for rapid boot.

Use Value: 1.8V operation and <1 µA power-down current extend battery life; 4KB sectors allow delta updates without full reflash.

Use Scenario: Holding bootloader, FPGA bitstream, and HMI assets in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Trusted boot source with hardware write-protection and security registers for firmware authenticity verification.

Use Value: −40°C to +85°C rating ensures reliability; OTP-lockable security registers prevent unauthorized firmware modification.

Automotive ADAS Camera Module Medical Diagnostic Handheld

Use Scenario: Storing calibration data, lens correction profiles, and firmware patches in automotive vision systems requiring AEC-Q100 alignment.

IC Role / Device Role / Timing Role: Parameter storage with sector-level lock granularity to isolate safety-critical calibration from user-updatable features.

Use Value: Individual sector lock (36h/39h) prevents accidental overwrite of camera-specific tuning parameters during field updates.

Use Scenario: Hosting regulatory-compliant boot firmware and patient data encryption keys in portable diagnostic tools with stringent data integrity requirements.

IC Role / Device Role / Timing Role: Secure code and key repository leveraging 64-bit unique ID and three 256-byte security registers.

Use Value: Unique ID binds firmware to hardware; security registers store AES keys inaccessible via standard SPI commands.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G3.3V supply (vs. 1.8V); same 64M-bit density, Quad SPI, 104MHz max clock; no integrated security registers.Requires level-shifting in 1.8V systems; lacks 64-bit UID and security register bank - unsuitable for secure boot.Select only if legacy 3.3V design constraints exist and security features are unnecessary.
S25FL164K0XMFI0101.8V supply; 64M-bit; supports HyperBus interface (not SPI); 133MHz DDR clock; no /HOLD pin in 8-pin variant.HyperBus offers higher bandwidth but demands different controller IP and PCB layout; incompatible with standard SPI hosts.Choose only when migrating to Cypress/Infineon platforms with HyperFlash controller support.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64JWZEIQ uniquely combines 1.8V operation, Quad SPI compatibility, hardware write protection, and on-die security registers - making it optimal for new 1.8V embedded designs requiring firmware integrity and field-upgrade flexibility.

Availability

W25Q64JWZEIQ is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial PLC boot memory, and automotive ADAS camera module applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for W25Q64JWZEIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM - serving industrial, communications, and consumer markets since 1987.

The W25Q series targets embedded systems needing high-speed, low-voltage, secure code storage - designed specifically for XIP execution, OTA firmware updates, and parameter retention in resource-constrained environments.

FAQ

What is the package type and footprint for W25Q64JWZEIQ?

W25Q64JWZEIQ uses the 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond code ZE), with an exposed thermal pad. Its footprint matches standard WSON-8 layouts; pin 1 is marked by a dot or beveled corner. The package is RoHS-compliant and halogen-free, and requires reflow per J-STD-020 profile with peak temperature ≤260°C.

Does W25Q64JWZEIQ support hardware reset via /RESET pin?

No - W25Q64JWZEIQ does not include a dedicated /RESET pin. That function is only available on SOIC-16 and TFBGA packages (e.g., W25Q64JWxxTB). W25Q64JWZEIQ relies solely on software reset (66h + 99h instructions) or power-cycle recovery. The /HOLD pin remains functional in Standard/Dual SPI but becomes IO3 in Quad mode.

How is Quad SPI mode enabled on W25Q64JWZEIQ?

Quad SPI mode on W25Q64JWZEIQ is enabled by setting the non-volatile Quad Enable (QE) bit in Status Register-2 using the Write Status Register-2 (31h) instruction. Once QE=1, /WP and /HOLD pins become IO2 and IO3 respectively, and Fast Read Quad I/O (EBh) becomes active. The change persists across power cycles unless cleared.

What erase block sizes does W25Q64JWZEIQ support?

W25Q64JWZEIQ supports four erase granularities: 4KB sectors (2,048 total), 32KB blocks (1,024 total), 64KB blocks (128 total), and full chip erase. Sector erase is ideal for parameter updates; 64KB block erase suits firmware image replacement. All erase operations are internally timed and require polling BUSY bit (SR1[0]) for completion.

Can W25Q64JWZEIQ be used for secure boot applications?

Yes - W25Q64JWZEIQ supports secure boot via its 64-bit unique ID (readable via 4Bh), three 256-byte security registers (accessible only via 42h/44h/48h instructions), and OTP-lockable regions. These features enable cryptographic key binding, firmware signature verification, and tamper-resistant storage - provided the host MCU implements corresponding secure boot firmware.

W25Q64JWZEIQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q64JWZEIQ FAQ

1.How can I place an order for W25Q64JWZEIQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64JWZEIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64JWZEIQ reliable?

The price and inventory of W25Q64JWZEIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JWZEIQ is usually 5 days.

3.What payment methods are accepted for W25Q64JWZEIQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JWZEIQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64JWZEIQ?

W25Q64JWZEIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64JWZEIQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64JWZEIQ?

For technical support, including W25Q64JWZEIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JWZEIQ requirements.

6.How does Aetrix verify that W25Q64JWZEIQ is sourced from the original manufacturer or authorized distributors?

All W25Q64JWZEIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JWZEIQ meets industry standards.

7.What is the process for return or replacement of W25Q64JWZEIQ?

All W25Q64JWZEIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JWZEIQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64JWZEIQ part is unused and in its original packaging.

Return procedure for W25Q64JWZEIQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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