Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q64JWZPIQ

Part No.:
W25Q64JWZPIQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q64JWZPIQ.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,862

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q64JWZPIQ from Winbond is a 1.7V–1.95V, 64M-bit (8MB) serial NOR flash memory with Dual/Quad SPI interface, organized into 32,768 × 256-byte pages and supporting 4KB/32KB/64KB erase granularity. It delivers up to 133MHz Quad I/O clocking (532MB/s equivalent bandwidth), <1µA power-down current, and operates across –40°C to +85°C - deployed in boot code storage and XIP firmware execution for microcontrollers in space-constrained IoT edge nodes.

For engineers reviewing the W25Q64JWZPIQ datasheet, W25Q64JWZPIQ pinout, W25Q64JWZPIQ application, or W25Q64JWZPIQ equivalent, this page provides verified pin functions, JEDEC-compliant ID support, SFDP register access, 64-bit unique serial number, and hardware write-protect (/WP) and hold (/HOLD) signal behavior specific to the ZPIQ (8-pad WSON 6×5-mm) package.

Technical Context

The W25Q64JWZPIQ implements a standard SPI bus (Mode 0/3) with optional Dual/Quad I/O operation enabled via non-volatile QE bit in Status Register-2. Its command set includes Fast Read Quad I/O (EBh), Quad Input Page Program (32h), and Erase/Program Suspend (75h/7Ah), enabling deterministic latency control during concurrent firmware updates and real-time data logging.

Internal architecture features a 256-byte page buffer, uniform 4KB sector layout (2,048 sectors), and three 256-byte security registers with OTP lock capability. Hardware reset (/RESET) is not available on the ZPIQ package; /HOLD pin doubles as IO3 in Quad mode, disabling hold functionality when QE=1.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 M-bit (8 MB), organized as 32,768 pages × 256 bytes - enables full MCU boot image storage with room for parameter tables.
Supply Voltage1.7 V to 1.95 V - compatible with low-power 1.8V system rails; no level-shifting required for modern SoCs.
Max Clock Frequency133 MHz Quad I/O - achieves 532 MB/s effective throughput for fast code shadowing or XIP execution.
Erase Granularity4 KB sector / 32 KB block / 64 KB block - supports fine-grained firmware patching without disturbing adjacent application code.
Endurance & Retention100,000 program/erase cycles; >20-year data retention - suitable for field-upgradable embedded firmware with infrequent writes.
Security Features64-bit unique ID, SFDP register, three 256-byte security registers, OTP-lockable blocks - meets secure boot and device identity requirements.
Power Consumption<1 µA typical in power-down - critical for battery-powered sensors and always-on edge devices.

Pinout & Package

W25Q64JWZPIQ uses an 8-pad WSON 6×5-mm package (JEDEC MO-252, package code ZP), with exposed thermal pad. Pin 1 is marked by dot; pins are arranged counterclockwise from top-left corner.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; must transition high→low before instruction acceptance; high-impedance DO during deselect.
2 DO (IO1)Data Output / Quad I/O 1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad modes; used for read data and status.
3 /WP (IO2)Write Protect Input / Quad I/O 2Hardware write lock for status register; becomes IO2 when QE=1; active-low, requires external pull-up if unused.
4 GNDGround ReferencePrimary return path for all I/O and core logic; connects to thermal pad for thermal dissipation.
5 DI (IO0)Data Input / Quad I/O 0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad modes; carries instructions, addresses, and write data.
6 CLKSerial Clock InputEdge-triggered timing reference; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1).
7 /HOLD (IO3)Hold Input / Quad I/O 3Pauses ongoing transfers when low (active-low); disabled and repurposed as IO3 in Quad mode (QE=1).
8 VCCPower Supply1.7–1.95 V supply; decoupling capacitor (100 nF) required within 5 mm of pin for stable operation.

Key Features

FeatureDesign Value
Dual/Quad SPI InterfaceEnables scalable bandwidth: 2× (Dual) or 4× (Quad) over standard SPI - reduces firmware load time and supports XIP without external RAM buffering.
Erase/Program SuspendAllows interruption of long erase/program cycles to service high-priority reads - essential for real-time systems requiring deterministic response.
Hardware Write Protection/WP pin + status register BP bits provide layered protection against accidental writes - critical for bootloader and calibration data integrity.
JEDEC ComplianceSupports Manufacturer/Device ID (90h/9Fh), Unique ID (4Bh), and SFDP (5Ah) - ensures interoperability with standardized flash programming tools and OS drivers.
Security RegistersThree 256-byte OTP-capable registers store cryptographic keys or device-specific secrets - isolated from main array and lockable per sector.

Applications

Secure Boot StorageFirmware Over-the-Air (OTA)

Use Scenario: Storing signed bootloader images and public key certificates in immutable sectors.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with hardware write-protection and unique ID binding.

Use Value: Prevents unauthorized firmware injection using /WP pin + BP bits and 64-bit UID for certificate chain binding.

Use Scenario: Receiving and validating delta firmware updates in battery-powered gateways.

IC Role / Device Role / Timing Role: Dual-bank update storage with suspend/resume for atomic swap during live operation.

Use Value: Erase/Program Suspend (75h/7Ah) allows background validation while servicing network traffic - zero downtime OTA.

Industrial HMI Code ExecutionMedical Sensor Data Logging

Use Scenario: Executing GUI application code directly from flash (XIP) on ARM Cortex-M7 MCU.

IC Role / Device Role / Timing Role: High-speed Quad SPI XIP memory with 133MHz clock and low-latency read commands.

Use Value: Fast Read Quad I/O (EBh) delivers ~532 MB/s effective bandwidth - eliminates need for external SDRAM in cost-sensitive HMIs.

Use Scenario: Logging calibrated sensor readings with timestamped metadata in cyclic buffers.

IC Role / Device Role / Timing Role: Parameter + data storage with 4KB sector granularity and 100K-cycle endurance.

Use Value: Uniform 4KB sectors allow independent erasure of oldest log segment without corrupting configuration or calibration data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L6433FZNI-10G3.3V supply (vs. 1.8V); same 64M-bit density, Quad SPI, 133MHz max clock; no /HOLD pin in 8-pin SOIC variant.Requires level-shifting in 1.8V systems; lacks /HOLD for multi-device arbitration; identical SFDP and security register support.Select when legacy 3.3V infrastructure exists and power efficiency is secondary to toolchain compatibility.
S25FL164K0XMFI0111.8V supply; 64M-bit; supports Octal DTR mode (up to 200MHz); different status register map and QE bit location.Higher bandwidth potential but requires Cypress-compatible controller; no 64-bit UID; security registers limited to 128 bytes.Choose for future-proofing with Octal-ready host controllers where sustained >500MB/s throughput justifies firmware rework.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI011, the W25Q64JWZPIQ uniquely combines 1.8V ultra-low-power operation (<1µA), integrated /HOLD for SPI bus sharing, and factory-programmed 64-bit UID - making it optimal for compact, battery-aware, and security-critical edge nodes.

Availability

W25Q64JWZPIQ is available at Aetrix Electronics and suitable for industrial HMI, medical sensor logging, secure boot storage, and firmware OTA applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W25Q64JWZPIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM - serving automotive, industrial, and consumer markets since 1987.

The W25Q series targets embedded systems needing high-reliability, low-voltage, and feature-rich serial flash - designed specifically for code execution (XIP), secure firmware storage, and real-time data logging in resource-constrained environments.

FAQ

What is the operating voltage range for the W25Q64JWZPIQ?

The W25Q64JWZPIQ operates from 1.7 V to 1.95 V, optimized for 1.8 V system rails. This narrow range eliminates need for external voltage regulation in modern low-power MCUs and SoCs. Operation outside this window risks data corruption or failure to execute commands. The W25Q64JWZPIQ includes internal voltage monitoring that forces reset if VCC drops below threshold during write/erase cycles.

Does the W25Q64JWZPIQ support hardware reset via /RESET pin?

No, the W25Q64JWZPIQ does not include a dedicated /RESET pin. That function is only available on TFBGA and SOIC-16 packages (e.g., W25Q64JWxxTB or W25Q64JWxxSS variants). The ZPIQ package uses 8-pad WSON 6×5-mm and relies solely on software reset (66h + 99h instructions). System-level reset must be handled externally or via SPI command sequence.

How is Quad SPI mode enabled on the W25Q64JWZPIQ?

Quad SPI mode is enabled by setting the Quad Enable (QE) bit in Status Register-2 (SR2) to '1' using the Write Status Register-2 (31h) instruction. Once QE=1, pins /WP and /HOLD become IO2 and IO3 respectively. The W25Q64JWZPIQ retains QE state across power cycles unless cleared - ensuring persistent Quad mode without reconfiguration at boot.

What package type does the W25Q64JWZPIQ use, and what are its thermal characteristics?

The W25Q64JWZPIQ uses an 8-pad WSON 6×5-mm package (JEDEC MO-252, code ZP) with exposed thermal pad. Its θJA is 120°C/W (typ.) under standard JEDEC PCB conditions. For continuous 133MHz operation, a 25 mm² copper pour under the thermal pad and two 100-nF ceramic decoupling capacitors near VCC/GND are recommended to maintain junction temperature below 105°C.

Can the W25Q64JWZPIQ be used for secure key storage?

Yes, the W25Q64JWZPIQ includes three 256-byte security registers with One-Time-Programmable (OTP) lock capability, accessible via dedicated instructions (42h/44h/48h). These registers are electrically isolated from main memory and can be permanently locked after programming. Combined with the factory-programmed 64-bit unique ID, they support secure key binding and anti-cloning in certified bootloader implementations.

W25Q64JWZPIQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x5)

W25Q64JWZPIQ FAQ

1.How can I place an order for W25Q64JWZPIQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64JWZPIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64JWZPIQ reliable?

The price and inventory of W25Q64JWZPIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64JWZPIQ is usually 5 days.

3.What payment methods are accepted for W25Q64JWZPIQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64JWZPIQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64JWZPIQ?

W25Q64JWZPIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64JWZPIQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64JWZPIQ?

For technical support, including W25Q64JWZPIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64JWZPIQ requirements.

6.How does Aetrix verify that W25Q64JWZPIQ is sourced from the original manufacturer or authorized distributors?

All W25Q64JWZPIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64JWZPIQ meets industry standards.

7.What is the process for return or replacement of W25Q64JWZPIQ?

All W25Q64JWZPIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64JWZPIQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64JWZPIQ part is unused and in its original packaging.

Return procedure for W25Q64JWZPIQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q64JWZPIQ Tags

  • W25Q64JWZPIQ
  • W25Q64JWZPIQ PDF
  • W25Q64JWZPIQ Datasheet
  • W25Q64JWZPIQ Specifications
  • W25Q64JWZPIQ Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q64JWZPIQ
  • Buy W25Q64JWZPIQ
  • W25Q64JWZPIQ Price
  • W25Q64JWZPIQ Distributor
  • W25Q64JWZPIQ Supplier
  • W25Q64JWZPIQ Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER