Winbond Electronics Corporation W25Q80JVZPIQ
- Part No.:
- W25Q80JVZPIQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q80JVZPIQ.pdf
- Description:
- IC FLASH 8MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q80JVZPIQ from Winbond is an 8 M-bit (1 MB) serial NOR flash memory with Dual/Quad SPI interface, organized as 4,096 × 256-byte pages, supporting 4 KB sector, 32 KB block, 64 KB block and full-chip erase, and operating from 2.7 V to 3.6 V at -40°C to +85°C. It enables XIP (execute-in-place) code execution and data storage in space-constrained embedded systems.
For engineers reviewing the W25Q80JVZPIQ datasheet, W25Q80JVZPIQ pinout, W25Q80JVZPIQ application, or W25Q80JVZPIQ equivalent, key selection criteria include Quad SPI read throughput (up to 532 MHz equivalent), 100K program-erase cycles per sector, hardware/software write protection, 64-bit unique ID, and JEDEC SFDP register support for auto-configuration.
Technical Context
The W25Q80JVZPIQ implements a standard SPI bus (Mode 0/3) with extended Dual/Quad I/O modes using shared IO0–IO3 pins. Its command set includes Fast Read Quad I/O (EBh) enabling 532 MHz effective throughput, and supports Erase/Program Suspend & Resume for real-time task interleaving.
It features three status registers (SR1–SR3) with volatile/non-volatile control bits including Quad Enable (QE), Write Protect Selection (WPS), Block Protect (BP2–BP0), Top/Bottom protect (TB), and Security Register Locks (LB1–LB3), all configurable via Write Status Register instructions under WEL-enabled state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 M-bit (1,048,576 bytes), organized as 4,096 × 256-byte pages |
| Interface Support | Standard SPI (CLK, /CS, DI, DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3) with factory-quad-enabled default |
| Max Clock Frequency | 133 MHz single-ended; 266 MHz (Dual I/O), 532 MHz (Quad I/O) effective data rate |
| Erase Granularity | Uniform 4 KB sectors (256 total), 32 KB blocks (128 total), 64 KB blocks (16 total), and chip-erase |
| Endurance & Retention | ≥100,000 program/erase cycles per sector; >20 years data retention at +25°C |
| Power Supply | Single 2.7 V to 3.6 V supply; typical power-down current <1 µA |
| Operating Temperature | -40°C to +85°C industrial grade, qualified per JEDEC JESD22-A108 |
Pinout & Package
W25Q80JVZPIQ uses an 8-pad WSON 6×5-mm package (package code ZP), with exposed pad for thermal dissipation and no internal reset pin - consistent with the ZP variant's pinout definition in Winbond's datasheet Revision C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: high-impedance outputs and standby current when high; must track VCC during power-up/down |
| DO (IO1) | Serial Data Output / I/O1 | Output in Standard/Dual SPI; bidirectional I/O in Dual/Quad modes; used with IO0 for dual-speed reads |
| IO2 | Serial Data I/O2 | Bidirectional quad-mode data line; required for Fast Read Quad Output (6Bh) and Quad I/O (EBh) |
| GND | Ground Reference | Primary signal and power return path; connects to PCB ground plane for noise immunity |
| DI (IO0) | Serial Data Input / I/O0 | Instruction/address/data input in Standard SPI; bidirectional I/O0 in Dual/Quad modes; clocked on rising CLK edge |
| CLK | Serial Clock Input | Master-generated timing signal; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1) |
| IO3 | Serial Data I/O3 | Bidirectional quad-mode data line; enables 4-line parallel data transfer for highest throughput |
| VCC | Power Supply | 2.7–3.6 V core supply; internal voltage regulators generate high-voltage programming pulses |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI XIP Support | Enables direct code execution from flash via Fast Read Quad I/O (EBh), eliminating RAM copy overhead |
| Configurable Write Protection | Three-tier protection: status-register-based (BP/TB/SEC), individual sector/block locks (32 sectors + 14 blocks), and OTP security registers |
| JEDEC SFDP Register | Provides standardized, host-readable parameter table for automatic driver initialization without hard-coded timing values |
| 64-bit Unique ID | Factory-programmed immutable serial number per device, usable for firmware binding, anti-cloning, or secure boot validation |
| Erase/Program Suspend | Allows pausing active erase/program operations to service time-critical interrupts, then resuming without data loss |
Applications
| IoT Edge Node Firmware Storage | Industrial HMI Code Execution |
|---|---|
|
Use Scenario: Storing bootloader, RTOS image, and field-upgradable application firmware in battery-powered wireless sensor nodes. IC Role / Device Role / Timing Role: Non-volatile code storage with Quad SPI XIP capability to reduce BOM count and eliminate external RAM for boot code. Use Value: 532 MHz Quad I/O read speed enables sub-100 ms firmware load; 1 µA power-down current extends battery life over multi-year deployments. |
Use Scenario: Hosting GUI assets, localized language strings, and logic control firmware in panel-mounted HMIs with limited PCB area. IC Role / Device Role / Timing Role: Primary flash memory providing deterministic read latency and concurrent erase-suspend for OTA updates without UI freeze. Use Value: 4 KB uniform sectors allow atomic update of individual GUI elements; SFDP register simplifies driver porting across display controller platforms. |
| Medical Diagnostic Device Boot Memory | Automotive Body Control Module (BCM) Parameter Storage |
|
Use Scenario: Storing certified diagnostic algorithms, calibration tables, and audit logs in Class II medical equipment requiring data integrity assurance. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP-locked security registers and individual sector locks for regulatory compliance logging. Use Value: 64-bit unique ID binds firmware to hardware; >20-year data retention meets FDA long-term recordkeeping requirements. |
Use Scenario: Retaining vehicle-specific configuration data (e.g., door lock behavior, mirror presets, lighting profiles) across ignition cycles in BCMs. IC Role / Device Role / Timing Role: Parameter EEPROM replacement with faster write throughput and higher endurance than legacy serial EEPROMs. Use Value: 100K program/erase cycles exceed automotive lifetime requirements; hardware write-protection prevents corruption during voltage transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L8006EM1I-12G | 8 M-bit, 3 V, SOIC-8; max clock 86 MHz (standard SPI only); no Quad I/O or SFDP support | Lacks XIP performance and auto-configuration; suitable only for legacy SPI-only designs | Select only if Quad SPI, SFDP, or >100 MHz throughput are not required |
| S25FL008KAGMFI010 | 8 M-bit, 3 V, WSON-8; supports Quad SPI and SFDP, but max clock 104 MHz; no individual sector lock bits | Lower throughput and reduced write protection granularity vs. W25Q80JVZPIQ | Prefer when cost sensitivity outweighs need for 133 MHz operation and fine-grained locking |
Compared with MX25L8006EM1I-12G and S25FL008KAGMFI010, W25Q80JVZPIQ delivers the highest Quad SPI bandwidth (532 MHz), full SFDP compliance, and the most flexible write protection architecture - making it optimal for new designs requiring XIP, secure updates, and future-proof configurability.
Availability
W25Q80JVZPIQ is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial HMI code execution, medical diagnostic device boot memory, and automotive BCM parameter storage requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for W25Q80JVZPIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.
The W25Q series is Winbond's high-performance serial NOR flash product line designed for code storage and execution in resource-constrained embedded systems, emphasizing speed, security, and compatibility with modern MCU boot interfaces.
FAQ
What is the maximum supported SPI clock frequency for W25Q80JVZPIQ in Quad I/O mode?
W25Q80JVZPIQ supports up to 133 MHz single-ended SPI clock frequency. In Quad I/O mode using instructions like Fast Read Quad I/O (EBh), this yields an effective data transfer rate of 532 MHz (133 MHz × 4). This value is specified in the AC Electrical Characteristics section (Table 9.6) of the official Winbond datasheet Revision C and confirmed by timing measurements under VCC = 3.0 V and TA = +25°C.
Does W25Q80JVZPIQ include a hardware reset pin (/RESET)?
No, W25Q80JVZPIQ does not include a hardware /RESET pin. The ZP (WSON 6×5-mm) package variant - which W25Q80JVZPIQ uses - omits the dedicated /RESET pin. Hardware reset is only available on SOIC-16 and TFBGA packages per Winbond's datasheet Section 4.4 and Note 1. System-level reset must be implemented via software sequence (Enable Reset 66h + Reset 99h) for W25Q80JVZPIQ.
How many program/erase cycles does W25Q80JVZPIQ guarantee per sector?
W25Q80JVZPIQ guarantees a minimum of 100,000 program/erase cycles per sector, as stated in the "Features" section (page 4) and confirmed in Section 9.6 AC Electrical Characteristics of the Winbond datasheet Revision C. This endurance rating applies to all 256 uniform 4 KB sectors and is validated under standard industrial temperature and voltage conditions.
What package type is used by W25Q80JVZPIQ, and what does the 'ZP' suffix indicate?
W25Q80JVZPIQ uses the 8-pad WSON 6×5-mm package, identified by the 'ZP' ordering code per Winbond's Package Specifications (Section 10.4). This RoHS-compliant, surface-mount package features an exposed thermal pad, optimized for compact layouts and thermal performance in high-density PCBs - distinct from SOIC, VSOP, or USON variants.
Can W25Q80JVZPIQ be used for execute-in-place (XIP) applications?
Yes, W25Q80JVZPIQ supports true execute-in-place (XIP) operation via its Fast Read Quad I/O (EBh) instruction, enabling direct code execution from flash without copying to RAM. The "Efficient Continuous Read" feature - including 8/16/32/64-byte wrap modes and low-latency addressing - is explicitly designed for XIP, as documented in Section 2 (Features) and Section 6.3 (Quad SPI Instructions) of the datasheet.
W25Q80JVZPIQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25Q80JVZPIQ FAQ
1.How can I place an order for W25Q80JVZPIQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q80JVZPIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q80JVZPIQ reliable?
The price and inventory of W25Q80JVZPIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q80JVZPIQ is usually 5 days.
3.What payment methods are accepted for W25Q80JVZPIQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q80JVZPIQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q80JVZPIQ?
W25Q80JVZPIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q80JVZPIQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q80JVZPIQ?
For technical support, including W25Q80JVZPIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q80JVZPIQ requirements.
6.How does Aetrix verify that W25Q80JVZPIQ is sourced from the original manufacturer or authorized distributors?
All W25Q80JVZPIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q80JVZPIQ meets industry standards.
7.What is the process for return or replacement of W25Q80JVZPIQ?
All W25Q80JVZPIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q80JVZPIQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q80JVZPIQ part is unused and in its original packaging.
Return procedure for W25Q80JVZPIQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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