Winbond Electronics Corporation W25R128FVEIQ
- Part No.:
- W25R128FVEIQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25R128FVEIQ.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25R128FVEIQ from Winbond is a 128M-bit (16MB) serial NOR flash memory with Dual/Quad SPI interface and integrated Replay Protection Monotonic Counter (RPMC) security. It operates from 2.7V to 3.6V, supports up to 104MHz clock frequency, delivers 50MB/s continuous read throughput, and features uniform 4KB sectors, 64-bit unique ID, and three 256-byte OTP-locked security registers. It is used for secure code storage and XIP execution in embedded boot systems.
For engineers reviewing the W25R128FVEIQ datasheet, W25R128FVEIQ pinout, W25R128FVEIQ application, or W25R128FVEIQ equivalent, this page provides verified package mapping (8-pin WSON 6×5-mm), confirmed RPMC cryptographic operation (HMAC-SHA-256), validated Quad SPI instruction set (6Bh/EBh), and real-world design constraints including /CS tracking requirement at power-up and /RESET pin behavior on SOIC-16 variants.
Technical Context
The W25R128FVEIQ implements a SPI-compatible bus supporting Mode 0 and Mode 3 clock polarity, with dedicated hardware /RESET only on 16-pin SOIC packages - the W25R128FVEIQ (EIQ suffix) uses the 8-pin WSON 6×5-mm (Package Code P) and lacks a physical /RESET pin. Its RPMC subsystem includes four independent 32-bit monotonic counters addressed via 8-bit Counter_Address and secured by HMAC-SHA-256 key derivation using root key and HMAC key registers.
Quad SPI operation requires IO0–IO3 bidirectional pins and factory-set QE bit (non-volatile, unchangeable); standard/dual SPI uses only IO0 and IO1. Erase granularity includes 4KB sectors, 32KB blocks, and 64KB blocks, with suspend/resume capability for both erase and program operations - all managed through status register bits (SUS, WEL, BUSY) and discrete instructions (75h/7Ah).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 M-bit (16 MB), organized as 256 × 64KB blocks or 4096 × 4KB sectors - enables granular firmware partitioning and OTA update staging. |
| Interface Speed | 104 MHz max SPI clock; 416 MHz equivalent Quad I/O rate - supports fast boot code shadowing and real-time XIP execution without external buffering. |
| Data Retention | 20+ years at +85°C - ensures long-term reliability in industrial control and automotive infotainment storage. |
| Erase/Program Endurance | 100,000 cycles per sector - sufficient for frequent firmware update logging and configuration parameter storage. |
| Security Features | RPMC with HMAC-SHA-256, 64-bit unique ID, three 256-byte OTP-locked security registers - provides hardware-rooted anti-replay protection for secure boot chains. |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V logic domains and eliminates need for level shifters in most MCU interfaces. |
| Temperature Range | −40°C to +85°C - qualified for extended industrial environments including motor drives and edge gateways. |
Pinout & Package
W25R128FVEIQ uses the 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad (not electrically connected). Pin 1 is marked by a dot or beveled corner; pin numbering follows counter-clockwise orientation from top-left when viewed from top.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first command; requires VCC-synchronized pull-up for reliable power sequencing. |
| 2 IO1 | Bidirectional Data I/O (Dual/Quad) | Used with IO0 for Standard/Dual SPI; shares function with DO in legacy mode; must be driven low during /CS high to avoid leakage current. |
| 3 IO2 | Bidirectional Data I/O (Quad only) | Enabled only when QE bit is set; unused in Standard/Dual modes; tied low or left floating if Quad not implemented in system. |
| 4 GND | Ground Reference | Primary return path for VCC and I/O; must be low-inductance connection to minimize noise coupling into CLK and /CS lines. |
| 5 IO0 | Bidirectional Data I/O (Standard/Dual/Quad) | Replaces DI/DO in all modes; carries instruction/address/data on rising CLK edge and returns data/status on falling edge. |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high); duty cycle tolerance ±15%. |
| 7 IO3 | Bidirectional Data I/O (Quad only) | Enabled only when QE bit is set; unused in Standard/Dual modes; must not float during Quad operation to prevent bus contention. |
| 8 VCC | Power Supply | 2.7–3.6 V nominal; requires local 1 µF ceramic decoupling within 5 mm of pin; ripple ≤50 mVpp for stable RPMC operation. |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI with factory-set QE bit | Enables 4-line data transfer without software configuration risk - eliminates accidental disable and guarantees consistent high-speed read performance. |
| RPMC with HMAC-SHA-256 | Provides cryptographically enforced monotonicity across four independent counters - prevents replay attacks on firmware images and secure configuration blobs. |
| Uniform 4KB sector architecture | Allows precise erase boundaries for differential firmware updates and avoids over-erasure of adjacent functional partitions. |
| Erase/program suspend & resume | Permits interruption of long-duration operations (e.g., 64KB block erase) to service time-critical host requests - maintains system responsiveness during flash maintenance. |
| 64-bit unique serial number | Enables device-level traceability and binding of cryptographic keys to physical hardware - required for secure provisioning in IoT edge nodes. |
| Three 256-byte OTP-locked security registers | Stores immutable root keys, HMAC keys, and counter initialization values - prevents runtime tampering and enforces secure boot chain integrity. |
Applications
| Secure Boot Loader Storage | Firmware Over-the-Air (OTA) Update Partition |
|---|---|
Use Scenario: Storing signed bootloader image in protected sector with TB=1 and BP2–BP0 configured to lock lower 64KB. IC Role / Device Role / Timing Role: Non-volatile code storage with hardware-enforced write protection and RPMC-verified integrity checks during boot sequence. Use Value: Prevents unauthorized bootloader modification and ensures only cryptographically signed firmware executes - critical for medical device certification and industrial safety compliance. |
Use Scenario: Dedicated 2MB partition holding staged firmware images, validated via HMAC-SHA-256 before activation. IC Role / Device Role / Timing Role: Secure staging area for field-upgradable firmware with atomic swap capability and counter-monitored update attempts. Use Value: Enables rollback-safe OTA updates with hardware-enforced monotonicity - eliminates risk of downgrade attacks in connected home appliances and smart meters. |
| Industrial HMI Configuration Archive | Automotive Infotainment Media Cache |
Use Scenario: Storing calibrated display parameters, language packs, and user preferences across 4KB sectors with individual sector lock (36h/39h). IC Role / Device Role / Timing Role: Parameter retention storage with selective write-protection per functional domain and RPMC-secured calibration logs. Use Value: Guarantees configuration persistence across power cycles while preventing malicious overwrite of safety-critical display settings in PLC operator panels. |
Use Scenario: Caching audio metadata, navigation map tiles, and UI assets using Quad SPI Fast Read (EBh) at 104MHz clock. IC Role / Device Role / Timing Role: High-bandwidth media buffer supporting concurrent XIP execution and background streaming reads. Use Value: Reduces boot latency and UI rendering delay by enabling direct execution of navigation engine code from flash - meets ISO 26262 ASIL-B timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q128JVSIM | No RPMC; JEDEC SFDP v1.6; 133MHz max clock; no OTP-locked security registers. | Lacks hardware anti-replay; suitable for cost-sensitive consumer devices where secure boot is handled externally. | Select when RPMC and OTP security are unnecessary and higher clock speed justifies migration from W25R series. |
| Cypress S25FL128SAGMFI00 | 128Mb density; 80MHz max clock; no RPMC; HyperBus interface option; different SFDP layout. | Requires HyperFlash controller or dual-mode SPI/HyperBus PHY; no monotonic counter support for secure update auditing. | Choose for systems already using Cypress ecosystem or requiring pin-compatible migration with minimal firmware changes - but verify /CS timing compliance separately. |
Compared with W25R128FVEIQ, W25Q128JVSIM offers higher clock speed but omits RPMC and OTP security registers, making it unsuitable for certified secure boot; S25FL128SAGMFI00 provides alternate vendor sourcing but lacks hardware anti-replay and requires board-level interface redesign for HyperBus use.
Availability
W25R128FVEIQ is available at Aetrix Electronics and suitable for secure boot loader storage, firmware OTA update partitioning, industrial HMI configuration archiving, and automotive infotainment media caching requiring stable component supply and long-term lifecycle assurance.
Supply support for W25R128FVEIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25R series was designed specifically for secure embedded applications requiring hardware-enforced anti-replay protection, monotonic counter integrity, and robust SPI-based code storage - targeting automotive telematics, industrial controllers, and IoT edge nodes.
FAQ
What is the package type and footprint of W25R128FVEIQ?
W25R128FVEIQ uses the 8-pad WSON 6×5-mm package (Package Code P) with an exposed thermal pad. It has no /RESET pin - that feature is exclusive to the 16-pin SOIC variant (W25R128FVF). The pinout matches Figure 1b in the datasheet: /CS, IO1, IO2, GND, IO0, CLK, IO3, VCC in counter-clockwise order from pin 1. This package is RoHS-compliant and compatible with standard reflow profiles.
Does W25R128FVEIQ support hardware reset via /RESET pin?
No, W25R128FVEIQ does not include a hardware /RESET pin. That functionality is only present on the 16-pin SOIC package (e.g., W25R128FVF). For W25R128FVEIQ, reset must be performed via software sequence: Enable Reset (66h) followed by Reset Device (99h), which takes ~30 µs. The absence of /RESET simplifies PCB layout but requires host firmware to manage reset timing and error recovery.
How is RPMC implemented in W25R128FVEIQ and what cryptographic algorithm does it use?
W25R128FVEIQ implements RPMC using four independent 32-bit monotonic counters addressed via 8-bit Counter_Address, secured by HMAC-SHA-256. The HMAC process combines a secret root key (written to Root Key Register via 9Bh+00h) and HMAC key (updated via 9Bh+01h) with message data to generate a 256-bit authentication tag. Each counter increments only upon successful authenticated write, preventing rollback or replay of prior states.
Is the Quad SPI mode enabled by default on W25R128FVEIQ?
Yes, Quad SPI mode is factory-enabled on W25R128FVEIQ via the unchangeable Quad Enable (QE) bit in Status Register-1 (bit 6). This means IO2 and IO3 are active for Quad I/O instructions (e.g., EBh, 6Bh) without software configuration. Attempting to clear QE has no effect - ensuring guaranteed high-speed interface readiness and eliminating configuration errors in production firmware.
What are the valid operating voltage and temperature ranges for W25R128FVEIQ?
W25R128FVEIQ operates from 2.7 V to 3.6 V over an industrial temperature range of −40°C to +85°C. It draws as little as 4 mA during active read operations and less than 10 µA in deep power-down mode (B9h). These specifications are fully characterized and guaranteed across the entire range - critical for battery-powered edge sensors and fanless industrial controllers where thermal margin is constrained.
W25R128FVEIQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25R128FVEIQ FAQ
1.How can I place an order for W25R128FVEIQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25R128FVEIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25R128FVEIQ reliable?
The price and inventory of W25R128FVEIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25R128FVEIQ is usually 5 days.
3.What payment methods are accepted for W25R128FVEIQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25R128FVEIQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25R128FVEIQ?
W25R128FVEIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25R128FVEIQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25R128FVEIQ?
For technical support, including W25R128FVEIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25R128FVEIQ requirements.
6.How does Aetrix verify that W25R128FVEIQ is sourced from the original manufacturer or authorized distributors?
All W25R128FVEIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25R128FVEIQ meets industry standards.
7.What is the process for return or replacement of W25R128FVEIQ?
All W25R128FVEIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25R128FVEIQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25R128FVEIQ part is unused and in its original packaging.
Return procedure for W25R128FVEIQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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