Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25X05CLUXIG TR

Part No.:
W25X05CLUXIG TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-UFDFN Exposed Pad
Datasheet:
AetrixW25X05CLUXIG TR.pdf
Description:
IC FLASH 512KBIT SPI 8USON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,325

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25X05CLUXIG TR from Winbond is a 512K-bit (64KB) serial flash memory IC supporting standard SPI, dual output SPI, and dual I/O SPI interfaces. It features uniform 4KB sectors, 32KB and 64KB erasable blocks, 256-byte page programming, and operates from 2.3V to 3.6V with 1mA active and <1µA power-down current. It is used in embedded firmware storage, boot code retention, and parameter logging in space-constrained IoT edge nodes.

For engineers reviewing the W25X05CLUXIG TR datasheet, W25X05CLUXIG TR pinout, W25X05CLUXIG TR application, or W25X05CLUXIG TR equivalent, key selection considerations include its 104MHz SPI clock support, dual I/O read capability up to 208Mbps, hardware /WP and /HOLD control, 4KB sector granularity for fine-grained data updates, and JEDEC-compliant manufacturer/device ID and 64-bit unique serial number.

Technical Context

The W25X05CLUXIG TR implements a SPI-compatible serial interface with Mode 0 and Mode 3 support, using dedicated DI/DO pins for standard SPI and bidirectional IO0/IO1 for dual I/O operations. Its internal architecture includes a 256-page × 256-byte array organized into 16 × 4KB sectors, two 32KB blocks, and one 64KB block - enabling flexible erase granularity without full-chip erasure.

It integrates a volatile Write Enable Latch (WEL), non-volatile status register with BP1/BP0/TB bits for configurable top/bottom hardware/software write protection, and SRP bit enabling hardware lock of status register when /WP is low. The device supports true XIP via Continuous Read Mode with only 16-clock instruction overhead per 24-bit address access.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512K-bit (64KB); sufficient for small bootloader, configuration tables, or sensor calibration data in ultra-compact designs.
Supply Voltage2.3V–3.6V; compatible with single-supply 2.5V/3.3V logic systems without level-shifting.
SPI Clock Max104MHz; enables fast firmware load times and real-time parameter updates in resource-limited MCUs.
Dual I/O Throughput208Mbps equivalent; matches parallel flash performance for XIP execution without bus width expansion.
Erase Granularity4KB sectors; allows isolated update of firmware segments or user settings without disturbing adjacent code/data.
Endurance & Retention100,000 program/erase cycles; >20-year data retention; suitable for field-deployed industrial logging applications.
Operating Temp–40°C to +85°C; qualified for extended temperature operation in automotive body control and industrial HMI modules.

Pinout & Package

W25X05CLUXIG TR is packaged in an 8-pad USON 2×3-mm (package code UX), offering footprint reduction over SOIC/VSOP/TSSOP while maintaining thermal and mechanical reliability for reflow-soldered PCBs.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; must transition high→low after power-up before any instruction accepted; controls DO high-impedance state.
DO (IO1)Data Output / Dual I/OUnidirectional output in standard SPI; bidirectional I/O1 in dual SPI; high-impedance during /HOLD or /CS high.
/WPWrite Protect InputActive-low hardware lock; disables status register writes when SRP=1 and /WP=0, preventing accidental configuration changes.
GNDGround ReferencePrimary return path for VCC and all I/O signals; requires low-inductance connection to minimize noise coupling during fast reads.
DI (IO0)Data Input / Dual I/OUnidirectional input in standard SPI; bidirectional I/O0 in dual SPI; sampled on CLK rising edge with MSB-first protocol.
CLKSerial Clock InputTiming reference for all SPI transfers; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high); max 104MHz frequency.
/HOLDHold InputPauses ongoing SPI transaction when /CS is low; releases on rising edge of /HOLD; enables multi-device SPI bus sharing.
VCCPower Supply2.3V–3.6V supply; requires local 100nF ceramic decoupling; voltage threshold VWI ensures reset until stable.

Key Features

FeatureDesign Value
Continuous Read ModeReduces instruction overhead to 16 clocks per 24-bit address, enabling true execute-in-place (XIP) from SPI flash without RAM shadowing.
Dual I/O SPI InterfaceUses IO0/IO1 bidirectionally for both address and data in BBh instruction, doubling effective throughput vs. standard SPI at same clock rate.
Hardware + Software Write ProtectionCombines /WP pin control with non-volatile BP1/BP0/TB bits and SRP lock to protect 4KB–entire array against unintended writes or corruption.
Uniform Erase ArchitectureSupports independent 4KB sector, 32KB block, and 64KB block erases - critical for OTA firmware patching and dynamic parameter storage.
JEDEC ID & Unique Serial NumberProvides 64-bit factory-programmed unique ID and standard 9Fh JEDEC ID for secure device authentication and traceability in production.

Applications

Firmware Boot StorageIndustrial Sensor Calibration

Use Scenario: Storing MCU boot code and initial configuration in a compact, low-power edge node with no external RAM.

IC Role / Device Role / Timing Role: Non-volatile code storage accessed via SPI during cold start; supports XIP to eliminate RAM copy latency.

Use Value: Reduces BOM cost and PCB area by eliminating parallel NOR flash; 4KB sector erase enables safe firmware rollback without full reflash.

Use Scenario: Logging factory-calibrated sensor coefficients and field-tuned compensation parameters in programmable industrial transmitters.

IC Role / Device Role / Timing Role: Parameter storage updated infrequently but requiring long-term integrity and selective overwrite capability.

Use Value: 100,000-cycle endurance and 20-year retention ensure calibration data remains valid across product lifetime; /WP pin prevents runtime corruption.

Consumer IoT ConfigurationAutomotive Body Control Module

Use Scenario: Holding Wi-Fi credentials, user preferences, and OTA update staging buffers in battery-powered smart home devices.

IC Role / Device Role / Timing Role: Low-power persistent storage interfaced to ARM Cortex-M0+ via dual I/O SPI for fast credential retrieval.

Use Value: <1µA power-down current extends battery life; dual I/O read at 208Mbps accelerates network reconnection after sleep wake-up.

Use Scenario: Storing lighting profiles, seat position maps, and diagnostic event logs in automotive interior control units operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: AEC-Q100–grade compatible serial flash for safety-critical configuration storage with hardware write lock.

Use Value: /WP and SRP-based protection prevents ECU misconfiguration during electrical transients; USON package withstands automotive thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT25DF041A-SSH-T4Mb density (512KB), same 2.3–3.6V supply, but supports only standard and dual-output SPI (no dual I/O); max clock 85MHz.Lacks BBh dual I/O instruction; lower throughput limits XIP feasibility in latency-sensitive applications.Select when higher density is needed and dual I/O is not required; verify /HOLD timing compatibility with host controller.
MX25L512CM1I-12G512K-bit density, same USON 2×3-mm package, supports dual I/O and 104MHz clock, but uses different status register layout and command set (e.g., 05h vs. 0Bh for fast read).Requires firmware driver modification due to non-identical instruction opcodes and protection bit mapping.Use for drop-in replacement only after full command-set validation; MXIC part offers comparable performance but different JEDEC ID handling.

Compared with W25X05CLUXIG TR, AT25DF041A-SSH-T provides greater capacity but sacrifices dual I/O throughput and XIP efficiency, while MX25L512CM1I-12G matches density and interface speed but demands driver-level adaptation for status register access and erase command sequencing.

Availability

W25X05CLUXIG TR is available at Aetrix Electronics and suitable for firmware boot storage, industrial sensor calibration, and consumer IoT configuration requiring stable component supply across long-life product programs.

Supply support for W25X05CLUXIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable, low-power serial flash with enhanced performance beyond legacy SPI devices - targeting code storage, configuration, and data logging in IoT endpoints and industrial controllers.

FAQ

What is the maximum SPI clock frequency supported by the W25X05CLUXIG TR?

The W25X05CLUXIG TR supports SPI clock frequencies up to 104MHz in standard and dual I/O modes. When using the Fast Read Dual I/O (BBh) instruction, this yields an effective data transfer rate of 208Mbps. This specification is validated under AC Electrical Characteristics in the official datasheet and applies to all supported package variants including the USON 2×3-mm form factor of W25X05CLUXIG TR.

Does the W25X05CLUXIG TR support execute-in-place (XIP) operation?

Yes, the W25X05CLUXIG TR supports true XIP via its Continuous Read Mode, which reduces instruction overhead to just 16 clock cycles per 24-bit address access. This enables direct code execution from flash without copying to RAM, confirmed by the "Allows true XIP (execute in place) operation" statement in the General Description section of the datasheet for W25X05CLUXIG TR.

What package type is used for the W25X05CLUXIG TR variant?

The W25X05CLUXIG TR uses the 8-pad USON 2×3-mm package (package code UX), as specified in Section 4 ("Pad Configuration USON 2X3-MM") and Section 10.4 of the datasheet. This surface-mount, leadless package provides a compact footprint ideal for high-density PCB layouts while maintaining thermal performance for industrial temperature operation.

How does hardware write protection work on the W25X05CLUXIG TR?

Hardware write protection on the W25X05CLUXIG TR is implemented via the active-low /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP = 0, writes to the status register - including block protect configuration - are locked out. This prevents accidental changes to memory protection settings during system operation or power transients, as detailed in Section 8.1.6 and Table of SRP/WP states for W25X05CLUXIG TR.

Can the W25X05CLUXIG TR be used in automotive applications?

The W25X05CLUXIG TR is rated for –40°C to +85°C operation and meets industrial temperature requirements, but it is not AEC-Q200 qualified. While it has been deployed in non-safety-critical automotive body control modules (e.g., lighting or seat memory), Winbond does not certify W25X05CLUXIG TR for under-hood or ASIL-B/C applications. For automotive-grade use, consult Winbond's AEC-Q200–qualified W25Q family alternatives.

W25X05CLUXIG TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-UFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Kbit
Memory Organization:
64K x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
800µs
Access Time:
-
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-USON (2x3)

W25X05CLUXIG TR FAQ

1.How can I place an order for W25X05CLUXIG TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X05CLUXIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X05CLUXIG TR reliable?

The price and inventory of W25X05CLUXIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X05CLUXIG TR is usually 5 days.

3.What payment methods are accepted for W25X05CLUXIG TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X05CLUXIG TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X05CLUXIG TR?

W25X05CLUXIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X05CLUXIG TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X05CLUXIG TR?

For technical support, including W25X05CLUXIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X05CLUXIG TR requirements.

6.How does Aetrix verify that W25X05CLUXIG TR is sourced from the original manufacturer or authorized distributors?

All W25X05CLUXIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X05CLUXIG TR meets industry standards.

7.What is the process for return or replacement of W25X05CLUXIG TR?

All W25X05CLUXIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25X05CLUXIG TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X05CLUXIG TR part is unused and in its original packaging.

Return procedure for W25X05CLUXIG TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25X05CLUXIG TR Tags

  • W25X05CLUXIG TR
  • W25X05CLUXIG TR PDF
  • W25X05CLUXIG TR Datasheet
  • W25X05CLUXIG TR Specifications
  • W25X05CLUXIG TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25X05CLUXIG TR
  • Buy W25X05CLUXIG TR
  • W25X05CLUXIG TR Price
  • W25X05CLUXIG TR Distributor
  • W25X05CLUXIG TR Supplier
  • W25X05CLUXIG TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER