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Winbond Electronics Corporation W25X10AVSNIG

Part No.:
W25X10AVSNIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixW25X10AVSNIG.pdf
Description:
IC FLASH 1MBIT SPI 100MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,441

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Product details

Overview

W25X10AVSNIG from Winbond is a 1M-bit (128KB) serial Flash memory IC with SPI and dual-output SPI interface, organized into 512 pages of 256 bytes each and 32 uniform 4KB sectors. It operates from 2.7V to 3.6V, supports 100MHz clock frequency (200Mbps effective via Fast Read Dual Output), and features hardware/software write protection for embedded code storage and parameter retention in space-constrained systems.

For engineers reviewing the W25X10AVSNIG datasheet, W25X10AVSNIG pinout, W25X10AVSNIG application, or W25X10AVSNIG equivalent, key selection considerations include its SOIC-8 150-mil (SN) package, /CS-/WP-/HOLD control logic, 4KB sector granularity for flexible data partitioning, and JEDEC-compliant identification (Manufacturer ID EFh, Device ID 10h).

Technical Context

The W25X10AVSNIG implements a standard SPI bus with support for Modes 0 and 3, using four dedicated pins: /CS, CLK, DIO, and DO. Its dual-output capability activates only during Fast Read Dual Output (3Bh) instruction, repurposing DIO as a second data output line to double throughput without requiring additional I/O resources.

Internal architecture includes a status register with BUSY, WEL, BP2–BP0, TB, and SRP bits enabling granular hardware- and software-based write protection. Sector erase (20h), block erase (D8h), and chip erase (C7h/60h) operations are supported, with page program time <2ms and >100,000 endurance cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 1 M-bit (131,072 bytes), organized as 512 × 256-byte pages
Architecture Uniform 4KB sectors (32 total); no block-level hierarchy beyond sector
SPI Interface Standard single-output + optional dual-output (3Bh), supporting Modes 0 and 3
Max Clock Frequency 100 MHz - enables 200 Mbps effective read rate with Fast Read Dual Output
Supply Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Endurance & Retention ≥100,000 program/erase cycles; ≥20 years data retention at +25°C
Operating Temperature −40°C to +85°C - qualified for industrial-grade embedded applications

Pinout & Package

W25X10AVSNIG is packaged in an 8-pin SOIC 150-mil (Package Code SN), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.0 × 4.0 × 1.5 mm. Pin 1 is marked by a beveled corner or dot.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable: device enters active mode only when low; DO goes high-Z when high
2 DO Serial Data Output Primary output for standard SPI reads; outputs MSB-first on falling CLK edge
3 /WP Write Protect Input Hardware lock for status register writes when SRP=1 and /WP=low
4 GND Ground Reference Common return path for VCC and all I/O signals; must be low-impedance
5 DIO Serial Data I/O Input for instructions/addresses/data; becomes secondary output during Fast Read Dual Output
6 CLK Serial Clock Input Timing reference for all SPI transfers; data sampled on rising edge, output on falling edge
7 /HOLD Hold Input Pauses ongoing SPI operation while /CS remains low; useful for multi-device bus sharing
8 VCC Power Supply Single 2.7–3.6 V supply; internal regulation ensures stable core voltage across range

Key Features

Feature Design Value
Dual Output SPI Enables 200 Mbps read throughput using existing 4-wire SPI bus-no extra pins or controller changes required
4KB Uniform Sectors Allows independent erasure of firmware partitions, configuration tables, or calibration data without disturbing adjacent regions
Hardware Write Protection /WP pin + SRP bit combination prevents accidental status register modification during power transients or noise events
Top/Bottom Block Protect TB bit configures BP2–BP0 to protect either upper or lower memory region-critical for bootloader + application separation
JEDEC ID Support Returns Manufacturer ID (EFh) and Device ID (10h) via ABh/90h/9Fh instructions-enables runtime flash identity verification

Applications

Firmware Boot Storage Industrial Sensor Calibration Data

Use Scenario: Storing boot code for microcontrollers in resource-limited edge nodes where PCB area and pin count are constrained.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read access via Fast Read Dual Output to minimize boot latency.

Use Value: Reduces boot time by ~50% vs. standard SPI read due to 200 Mbps effective bandwidth, while maintaining pin compatibility with legacy designs.

Use Scenario: Retaining factory-calibrated sensor coefficients and field-updated compensation parameters in programmable logic controllers.

IC Role / Device Role / Timing Role: Parameter storage with sector-level erase isolation to preserve valid calibration data during field updates.

Use Value: Enables safe over-the-air updates of sensor-specific data without risking corruption of unrelated firmware or configuration blocks.

Consumer IoT Device Configuration Medical Diagnostic Instrument Logs

Use Scenario: Holding user preferences, network credentials, and device state across power cycles in battery-powered smart home devices.

IC Role / Device Role / Timing Role: Low-power configuration store with 1 µA power-down current and hardware write protection against brownout-induced writes.

Use Value: Extends battery life in always-on devices and prevents credential loss or misconfiguration during unexpected power loss.

Use Scenario: Recording time-stamped diagnostic measurements and error logs in portable ultrasound or ECG units with strict data integrity requirements.

IC Role / Device Role / Timing Role: High-reliability data logger with >100,000 erase/write cycles and 20-year retention for audit-trail compliance.

Use Value: Meets IEC 62304 Class C software lifecycle requirements by guaranteeing log persistence across device service intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
AT25DF011-SSH-T 1 M-bit, SOIC-8, but uses standard SPI only (no dual-output mode); max clock 85 MHz Lacks Fast Read Dual Output acceleration; lower peak read bandwidth (170 Mbps) Choose if dual-output timing is unnecessary and Atmel/Advantra ecosystem alignment is preferred
MX25L1006EZN-12G 1 M-bit, SOIC-8, supports dual-output SPI (3Bh), 104 MHz clock, but requires different status register layout Compatible instruction set except for minor status bit mapping differences (e.g., TB bit position) Valid alternative when migrating from Macronix platform; verify SRP/BP bit handling in firmware

Compared with AT25DF011-SSH-T and MX25L1006EZN-12G, the W25X10AVSNIG delivers identical density and package fit but uniquely combines 100 MHz dual-output performance with Winbond's proven 4KB sector architecture and industrial temperature rating-making it optimal for latency-sensitive boot and real-time logging applications.

Availability

W25X10AVSNIG is available at Aetrix Electronics and suitable for firmware boot storage, industrial sensor calibration, and consumer IoT configuration requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for W25X10AVSNIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR Flash memory solutions for embedded, communications, and consumer markets.

The W25X series was designed specifically for cost-sensitive, space-constrained applications needing reliable code execution and data storage-emphasizing fast read speeds, flexible protection schemes, and industrial-grade reliability in compact packages.

FAQ

What is the exact memory organization of the W25X10AVSNIG?

The W25X10AVSNIG contains 1 M-bit (131,072 bytes) of Flash memory, organized into 512 programmable pages of 256 bytes each and 32 uniform 4KB erasable sectors. There are no 64KB blocks-sector erase (20h) is the largest atomic erase operation supported. This structure enables fine-grained data management ideal for mixed-code-and-parameter applications.

Does the W25X10AVSNIG support true quad-SPI or only dual-output SPI?

The W25X10AVSNIG supports only dual-output SPI (via instruction 3Bh), not full quad-SPI. During Fast Read Dual Output, the DIO pin functions as a second data output alongside DO, delivering two bits per clock cycle. It does not support QSPI instructions (e.g., 6Bh) or four-line data transfer. The W25X10AVSNIG pinout and instruction set confirm dual-output only.

What is the function of the /HOLD pin on the W25X10AVSNIG, and when is it most useful?

The /HOLD pin on the W25X10AVSNIG pauses ongoing SPI operations while /CS remains low, placing DO in high-impedance and ignoring DIO/CLK transitions. It is most useful in multi-peripheral systems-such as those sharing an SPI bus between Flash, sensors, and DACs-where interrupt-driven tasks require temporary bus arbitration without aborting partial page writes or reads.

How does hardware write protection work on the W25X10AVSNIG?

Hardware write protection on the W25X10AVSNIG combines the /WP pin and Status Register Protect (SRP) bit. When SRP = 1 and /WP = low, the Write Status Register instruction (01h) is blocked-preventing changes to BP2–BP0, TB, and SRP itself. This protects against spurious writes during power-up/down or EMI events, and is independent of the software WEL bit state.

Is the W25X10AVSNIG pin-compatible with other W25X family members in the same package?

Yes-the W25X10AVSNIG shares identical SOIC-8 150-mil (SN) pinout, electrical characteristics, and instruction set with W25X20A, W25X40A, and W25X80A in the same package code. This allows direct density upgrades (e.g., from 1M-bit to 2M-bit) without PCB redesign, provided firmware handles the increased address space and sector count correctly.

W25X10AVSNIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
SPI
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25X10AVSNIG FAQ

1.How can I place an order for W25X10AVSNIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X10AVSNIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X10AVSNIG reliable?

The price and inventory of W25X10AVSNIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X10AVSNIG is usually 5 days.

3.What payment methods are accepted for W25X10AVSNIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X10AVSNIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X10AVSNIG?

W25X10AVSNIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X10AVSNIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X10AVSNIG?

For technical support, including W25X10AVSNIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X10AVSNIG requirements.

6.How does Aetrix verify that W25X10AVSNIG is sourced from the original manufacturer or authorized distributors?

All W25X10AVSNIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X10AVSNIG meets industry standards.

7.What is the process for return or replacement of W25X10AVSNIG?

All W25X10AVSNIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X10AVSNIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X10AVSNIG part is unused and in its original packaging.

Return procedure for W25X10AVSNIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25X10AVSNIG Tags

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