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Winbond Electronics Corporation W25X10BVZPIG
- Part No.:
- W25X10BVZPIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X10BVZPIG.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,609
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Product details
Overview
W25X10BVZPIG from Winbond is a 1M-bit (128KB) serial flash memory IC with uniform 4KB sectors, dual I/O SPI interface, and single 2.7–3.6V supply. It supports Fast Read Dual I/O (BBh) at up to 104MHz clock, delivers up to 208 Mbps effective throughput, and enables execute-in-place (XIP) operation via Continuous Read Mode. It is used in embedded boot code storage for microcontrollers in space-constrained industrial controllers.
For engineers reviewing the W25X10BVZPIG datasheet, W25X10BVZPIG pinout, W25X10BVZPIG application, or W25X10BVZPIG equivalent, key selection criteria include sector granularity (4KB), hardware write protection via /WP pin, JEDEC-compliant identification (EFh/10h), and WSON-8 (6×5 mm) package compatibility with high-density PCB layouts.
Technical Context
The W25X10BVZPIG implements a standard SPI bus (Modes 0 and 3) with optional dual I/O capability using bidirectional IO0 and IO1 pins. Its internal architecture includes a 256-byte page buffer, status register with BUSY/WEL/BP/TB/SRP bits, and high-voltage generators for erase/program operations without external charge pumps.
It supports four erase granularities-page (256B), sector (4KB), 32KB block, and chip-and provides hardware-based write protection through the /WP pin combined with non-volatile status register bits (BP2–BP0, TB, SRP). Power-down current is 1 µA typical, and it retains data for >20 years.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 M-bit (131,072 bytes), organized as 512 × 256-byte pages |
| Sector Size | Uniform 4KB sectors (32 total); enables fine-grained firmware parameter updates |
| Max SPI Clock | 104 MHz; enables 208 Mbps effective read rate with Fast Read Dual I/O (BBh) |
| Write/Erase Endurance | ≥100,000 cycles per sector; supports frequent field firmware patching |
| Data Retention | ≥20 years at +85°C; suitable for long-lifecycle industrial deployments |
| Supply Voltage | 2.7 V to 3.6 V; compatible with 3.3 V logic systems without level shifting |
| Operating Temp | −40°C to +85°C; qualified for extended-temperature industrial environments |
Pinout & Package
W25X10BVZPIG is housed in an 8-contact WSON (6×5 mm) package (JEDEC MO-229, package code ZP), optimized for thermal performance and board area efficiency in compact designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first instruction |
| DO (IO1) | Bidirectional Data I/O (Dual I/O mode) | Serial data output in standard SPI; becomes IO1 in dual I/O mode for simultaneous read/write |
| /WP | Hardware Write Protect Input | Active-low pin that locks status register writes when SRP=1; enables robust system-level protection |
| GND | Ground Reference | Primary return path for all digital and internal high-voltage circuits |
| DIO (IO0) | Bidirectional Data I/O (Dual I/O mode) | Serial data input in standard SPI; becomes IO0 in dual I/O mode for full-duplex transfers |
| CLK | Serial Clock Input | Edge-triggered timing source; supports Modes 0 and 3; max 104 MHz frequency |
| /HOLD | Operation Pause Input | Active-low; suspends ongoing SPI transaction without resetting internal state; useful in multi-device buses |
| VCC | Power Supply | 2.7–3.6 V main supply; powers core logic, charge pumps, and I/O buffers |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Reduces instruction overhead to ≤8 clocks per address; enables true XIP execution from SPI bus |
| Dual I/O SPI Interface | Uses IO0/IO1 for double-data-rate reads; achieves 208 Mbps without parallel bus complexity |
| Flexible Hardware Protection | /WP pin + non-volatile BP/TB/SRP bits allow top/bottom array locking without software intervention |
| Uniform 4KB Sector Erase | Enables independent update of bootloader, config, and application partitions without disturbing adjacent data |
| JEDEC Standard IDs | Manufacturer ID EFh and Device ID 10h ensure interoperability with generic flash programming tools |
Applications
| Boot Code Storage | Firmware Configuration |
|---|---|
Use Scenario: Storing primary bootloader and secure boot images for ARM Cortex-M microcontrollers in factory automation PLCs. IC Role / Device Role / Timing Role: Non-volatile storage device providing sequential read access during cold start; responds to Fast Read Dual I/O commands within 10 ns tSU/tH timing windows. Use Value: 4KB sector granularity allows atomic reprogramming of bootloader without erasing application firmware; 20-year retention ensures field-deployed units remain functional over product lifetime. |
Use Scenario: Holding runtime-configurable parameters (e.g., calibration offsets, network credentials, sensor thresholds) in medical diagnostic equipment. IC Role / Device Role / Timing Role: Parameter store accessed via Page Program and Sector Erase instructions; uses /HOLD to pause writes during interrupt-driven sensor sampling. Use Value: Hardware /WP pin prevents accidental overwrite during brown-out events; 100,000-cycle endurance supports daily recalibration logging over 10+ years. |
| Code Shadowing | Secure Device Identity |
Use Scenario: Copying application firmware from flash into RAM on power-up for deterministic real-time execution in motor drive inverters. IC Role / Device Role / Timing Role: High-throughput serial memory delivering burst reads via Fast Read Dual Output (3Bh) at 104 MHz CLK. Use Value: 208 Mbps effective bandwidth reduces shadowing time by >60% vs. standard SPI; Continuous Read Mode eliminates per-byte instruction overhead. |
Use Scenario: Storing unique device identifiers and cryptographic keys in IoT edge gateways requiring FIPS-aligned secure boot. IC Role / Device Role / Timing Role: Secure storage element accessed via Read Unique ID Number (4Bh) and JEDEC ID (9Fh) instructions. Use Value: Factory-programmed 64-bit unique ID enables hardware-rooted device attestation; SRP-enabled status register lock prevents tampering with protection bits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF011-SSH-T | 1 M-bit, SOIC-8 only; no dual I/O support; max SPI clock 50 MHz; lacks Continuous Read Mode | Lower throughput limits suitability for XIP or fast shadowing; better suited for simple configuration storage | Select if dual I/O and >100 Mbps read rates are unnecessary and SOIC-150-mil footprint is required |
| MX25L1006EZN-12G | 1 M-bit, WSON-8; supports dual I/O and 80 MHz clock; no Continuous Read Mode; different status register layout | Requires modified driver for status bit interpretation; lower max clock reduces peak bandwidth by ~23% | Select if Winbond ecosystem independence is preferred and 166 Mbps (vs. 208 Mbps) meets system timing budget |
Compared with AT25DF011-SSH-T and MX25L1006EZN-12G, W25X10BVZPIG delivers the highest effective read bandwidth (208 Mbps), unique Continuous Read Mode for XIP, and tighter integration of hardware/software write protection - making it optimal for resource-constrained, high-reliability boot and firmware storage.
Availability
W25X10BVZPIG is available at Aetrix Electronics and suitable for industrial control, medical diagnostics, and IoT edge gateway designs requiring stable component supply, long-term lifecycle assurance, and WSON-8 footprint compatibility.
Supply support for W25X10BVZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions for industrial, automotive, and computing markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable boot code storage, fast read performance, and robust hardware-assisted write protection - targeting MCU-based applications where parallel flash is impractical.
FAQ
What is the package type and footprint of W25X10BVZPIG?
W25X10BVZPIG uses an 8-contact WSON (6×5 mm) package with exposed pad, designated package code ZP per Winbond documentation. It has a standardized JEDEC MO-229 outline, 0.65 mm pitch, and thermal pad for enhanced heat dissipation. This footprint is not interchangeable with SOIC-8 or PDIP-8 variants of the W25X10BV family.
Does W25X10BVZPIG support execute-in-place (XIP) operation?
Yes, W25X10BVZPIG supports true XIP via its Continuous Read Mode, which requires only 8 clocks to address memory and eliminates per-byte instruction overhead. When enabled, the device streams code directly from flash over SPI without host CPU intervention - a capability confirmed in Section 2 (Features) and Section 8.1.2 of the datasheet.
How does hardware write protection work on W25X10BVZPIG?
W25X10BVZPIG combines the /WP pin with non-volatile status register bits (SRP, BP2–BP0, TB) to enforce hardware write protection. When SRP = 1 and /WP is low, writes to the status register - including block protect settings - are locked. This dual-layer mechanism prevents accidental or malicious modification of protected memory regions during power transients or firmware faults.
What is the maximum clock frequency supported by W25X10BVZPIG in dual I/O mode?
W25X10BVZPIG supports SPI clock frequencies up to 104 MHz in dual I/O mode, as specified in Section 1 (General Description) and Table 10.6 (AC Electrical Characteristics). At this rate, Fast Read Dual I/O (BBh) achieves an effective throughput of 208 Mbps - matching the performance of many parallel flash devices while using only four signal lines.
Is W25X10BVZPIG compatible with standard SPI Mode 0 and Mode 3?
Yes, W25X10BVZPIG fully supports both SPI Mode 0 (CPOL = 0, CPHA = 0) and Mode 3 (CPOL = 1, CPHA = 1), as explicitly stated in Section 8.1.1. The device samples DI/IO0 on the rising edge of CLK and drives DO/IO1 on the falling edge in both modes, ensuring interoperability with common microcontroller SPI peripherals without protocol translation.
W25X10BVZPIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25X10BVZPIG FAQ
1.How can I place an order for W25X10BVZPIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X10BVZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X10BVZPIG reliable?
The price and inventory of W25X10BVZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X10BVZPIG is usually 5 days.
3.What payment methods are accepted for W25X10BVZPIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X10BVZPIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X10BVZPIG?
W25X10BVZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X10BVZPIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X10BVZPIG?
For technical support, including W25X10BVZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X10BVZPIG requirements.
6.How does Aetrix verify that W25X10BVZPIG is sourced from the original manufacturer or authorized distributors?
All W25X10BVZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X10BVZPIG meets industry standards.
7.What is the process for return or replacement of W25X10BVZPIG?
All W25X10BVZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X10BVZPIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X10BVZPIG part is unused and in its original packaging.
Return procedure for W25X10BVZPIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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