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Winbond Electronics Corporation W25X10CLSNIG
- Part No.:
- W25X10CLSNIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
W25X10CLSNIG.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,341
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Product details
Overview
W25X10CLSNIG from Winbond is a 1 M-bit (128 KB) serial flash memory IC supporting standard SPI, dual-output SPI, and dual I/O SPI interfaces with 4 KB uniform sectors, 104 MHz clock capability, and true XIP (execute-in-place) operation via Continuous Read Mode. It operates from 2.3 V to 3.6 V, draws 1 mA active current and <1 µA in power-down, and targets embedded boot code storage and parameter retention in space-constrained industrial controllers.
For engineers reviewing the W25X10CLSNIG datasheet, W25X10CLSNIG pinout, W25X10CLSNIG application, or W25X10CLSNIG equivalent, key selection considerations include its dual I/O SPI bandwidth (208 Mbps equivalent), hardware /WP and /HOLD control, 4 KB sector granularity for fine-grained data updates, and JEDEC-compliant manufacturer/device ID and Unique Serial Number support.
Technical Context
The W25X10CLSNIG implements a SPI-compatible interface with full support for Modes 0 and 3, enabling interoperability with diverse microcontroller SPI masters. Its dual I/O SPI mode uses bidirectional IO0 and IO1 pins for simultaneous address/data transfer, achieving up to 208 Mbps effective throughput using the BBh instruction.
Internally, the device features a status register with non-volatile BP1/BP0 and TB bits for configurable top/bottom array protection, SRP bit for hardware-locked status register writes, and volatile BUSY/WEL flags for real-time operation monitoring. Erase architecture includes 32 × 4 KB sectors, four 32 KB blocks, and two 64 KB blocks - all uniformly erasable with >100,000 cycles and >20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 M-bit (131,072 bytes), organized as 512 × 256-byte pages |
| Supply Voltage | 2.3 V to 3.6 V - compatible with 2.5 V, 3.0 V, and 3.3 V logic systems without level shifting |
| Max Clock Frequency | 104 MHz - enables Fast Read Dual I/O at 208 Mbps equivalent data rate |
| Erase Granularity | Uniform 4 KB sectors (32 total), plus 32 KB and 64 KB blocks - supports flexible firmware and configuration updates |
| Write Endurance | ≥100,000 program/erase cycles per sector - suitable for frequent parameter logging |
| Data Retention | ≥20 years at +25°C - ensures long-term reliability in unattended industrial deployments |
| Operating Temp | –40°C to +85°C - qualified for extended temperature industrial environments |
| Power Consumption | 1 mA active typical; <1 µA power-down - reduces system standby power in battery-backed applications |
Pinout & Package
W25X10CLSNIG is packaged in an 8-pin SOIC 150-mil (package code SN), with lead-free, RoHS-compliant construction and surface-mount compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first instruction; places DO in high-Z when deasserted |
| DO (IO1) | Serial Data Output / Dual I/O | Unidirectional output in standard SPI; bidirectional I/O pin in dual SPI modes (3Bh/BBh); outputs status/data on CLK falling edge |
| /WP | Write Protect Input | Active-low hardware lock; disables Status Register writes when SRP=1 and /WP=0; enables top/bottom array protection control |
| GND | Ground Reference | Primary signal and power return path; requires low-impedance connection to minimize noise during fast read/write operations |
| DI (IO0) | Serial Data Input / Dual I/O | Unidirectional input in standard SPI; bidirectional I/O pin in dual SPI modes; accepts instructions/addresses/data on CLK rising edge |
| CLK | Serial Clock Input | Master-generated timing signal; supports Modes 0 and 3; determines maximum throughput (up to 104 MHz) |
| /HOLD | Hold Input | Active-low pause control; suspends ongoing SPI transaction without resetting internal state; essential for multi-device bus sharing |
| VCC | Power Supply | Single 2.3–3.6 V supply; includes internal voltage threshold detection (VWI) and tPUW power-up write inhibit delay |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Reduces instruction overhead to ≤16 clocks for 24-bit address access - enables true XIP execution directly from flash without RAM copy |
| Dual I/O SPI Interface | Uses IO0/IO1 for concurrent address/data transfer (BBh instruction) - doubles bandwidth vs. standard SPI, matching parallel flash performance |
| Hardware + Software Write Protection | Combines /WP pin control with non-volatile BP1/BP0/TB/SRP bits - allows selective 4 KB sector locking and prevents accidental firmware corruption |
| JEDEC ID & Unique Serial Number | Supports 9Fh (JEDEC), 90h/92h (manufacturer/device ID), and 4Bh (64-bit unique ID) - enables secure device authentication and BOM traceability |
| Low-Power Power-down Mode | Enters <1 µA standby via B9h instruction - ideal for energy-sensitive IoT nodes and battery-powered diagnostics tools |
| Flexible Erase Architecture | 32 × 4 KB sectors + 4 × 32 KB blocks + 2 × 64 KB blocks - accommodates mixed-use cases: small config updates and large firmware patches |
Applications
| Industrial PLC Boot Memory | Medical Device Parameter Storage |
|---|---|
|
Use Scenario: Storing bootloader firmware and safety-critical configuration tables in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Primary non-volatile boot source accessed via XIP during cold start; provides deterministic <50 µs latency for first instruction fetch. Use Value: 4 KB sector erase enables field-upgradable safety parameters without disturbing main firmware; -40°C to +85°C rating ensures operation in factory-floor enclosures. |
Use Scenario: Retaining calibrated sensor offsets, user preferences, and audit logs in portable ultrasound and infusion pump systems. IC Role / Device Role / Timing Role: Parameter storage peripheral interfaced to ARM Cortex-M4 MCU via dual I/O SPI for sub-10 ms config load times. Use Value: Hardware /WP pin prevents runtime corruption during ESD events; >20-year data retention meets FDA 510(k) long-term reliability requirements. |
| Smart Meter Firmware Image | Automotive Body Control Module |
|
Use Scenario: Hosting encrypted firmware images and tariff tables in ANSI C12.22-compliant electricity meters with remote OTA update capability. IC Role / Device Role / Timing Role: Dual I/O SPI slave providing 208 Mbps read throughput for rapid image verification and decompression into RAM. Use Value: JEDEC ID and Unique Serial Number support secure key binding and anti-cloning; 100,000-cycle endurance handles frequent meter firmware revisions. |
Use Scenario: Storing lighting profiles, door lock sequences, and diagnostic event logs in 12 V automotive body control units (BCUs). IC Role / Device Role / Timing Role: Secondary non-volatile memory mapped via SPI to Infineon AURIX TC3xx; accessed during CAN wake-up for fast context restoration. Use Value: /HOLD pin allows seamless arbitration between BCU's SPI bus and shared CAN transceiver debug interface; 2.3–3.6 V range tolerates automotive battery transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q10EWUXIE | Same 1 M-bit density but uses newer 1.65–3.6 V Quad SPI interface; supports QPI and DTR modes; smaller 2×3-mm USON package only | Requires Quad SPI controller support; lacks /HOLD pin; optimized for ultra-compact consumer wearables rather than industrial control | Select W25Q10EWUXIE only if migrating to Quad SPI infrastructure and board space is constrained; not drop-in compatible with W25X10CLSNIG |
| Micron MT25QL10ABB8E12-0SIT | 1 M-bit Serial NOR with 1.7–2.0 V or 2.7–3.6 V dual supply options; supports SFDP and 4-byte addressing; higher 133 MHz max clock | Requires SFDP-aware bootloader; no /HOLD pin; different status register layout and protection scheme; industrial temp grade same | Choose MT25QL10ABB8E12-0SIT for designs needing future-proofing with JEDEC SFDP compliance and higher clock headroom; not pin- or software-compatible |
Compared with W25X10CLSNIG, the W25Q10EWUXIE offers higher integration density and Quad SPI speed but sacrifices /HOLD functionality and SOIC compatibility, while the MT25QL10ABB8E12-0SIT delivers enhanced protocol standardization and clock margin at the cost of increased software porting effort and altered hardware protection behavior.
Availability
W25X10CLSNIG is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostics equipment, and smart utility meters requiring stable component supply, long-lifecycle assurance, and consistent SOIC packaging across production batches.
Supply support for W25X10CLSNIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for industrial, automotive, and computing markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable boot code storage and parameter retention with minimal external components and low power consumption.
FAQ
What is the pin count and package type of the W25X10CLSNIG?
The W25X10CLSNIG uses an 8-pin SOIC 150-mil package (package code SN), with standardized pinout including /CS, DO (IO1), /WP, GND, DI (IO0), CLK, /HOLD, and VCC. This through-hole-compatible surface-mount package is widely supported in industrial PCB assembly processes and matches legacy footprint requirements for drop-in replacement scenarios.
Does the W25X10CLSNIG support execute-in-place (XIP) operation?
Yes, the W25X10CLSNIG supports true XIP via its Continuous Read Mode, which reduces instruction overhead to as few as 16 clock cycles for 24-bit address access. This enables direct code execution from flash without copying to RAM, reducing system memory footprint and boot latency - a key advantage confirmed in Section 1 and Figure 2 of the official datasheet.
How does hardware write protection work on the W25X10CLSNIG?
Hardware write protection on the W25X10CLSNIG is implemented via the active-low /WP pin in conjunction with the non-volatile Status Register Protect (SRP) bit. When SRP = 1 and /WP = 0, writes to the status register (including BP1/BP0/TB bits) are locked out, preventing accidental reconfiguration of memory protection regions - a feature explicitly defined in Section 8.1.6 and Table on page 11 of the datasheet.
What erase block sizes are available on the W25X10CLSNIG?
The W25X10CLSNIG provides three uniform erase granularities: thirty-two 4 KB sectors, four 32 KB blocks, and two 64 KB blocks. This hierarchical structure is documented in Section 1 and Table on page 12 (Status Register Memory Protection), allowing precise control over firmware updates, configuration storage, and field calibration data without erasing unrelated memory regions.
Is the W25X10CLSNIG compatible with standard SPI Mode 0 and Mode 3?
Yes, the W25X10CLSNIG fully supports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1), as specified in Section 7.1.1. This dual-mode compatibility ensures interoperability with a broad range of microcontrollers - including legacy 8-bit MCUs and modern ARM Cortex-M devices - without requiring custom SPI peripheral configuration.
W25X10CLSNIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 800µs
- Access Time:
- -
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X10CLSNIG FAQ
1.How can I place an order for W25X10CLSNIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X10CLSNIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X10CLSNIG reliable?
The price and inventory of W25X10CLSNIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X10CLSNIG is usually 5 days.
3.What payment methods are accepted for W25X10CLSNIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X10CLSNIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X10CLSNIG?
W25X10CLSNIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X10CLSNIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X10CLSNIG?
For technical support, including W25X10CLSNIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X10CLSNIG requirements.
6.How does Aetrix verify that W25X10CLSNIG is sourced from the original manufacturer or authorized distributors?
All W25X10CLSNIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X10CLSNIG meets industry standards.
7.What is the process for return or replacement of W25X10CLSNIG?
All W25X10CLSNIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X10CLSNIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X10CLSNIG part is unused and in its original packaging.
Return procedure for W25X10CLSNIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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