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Winbond Electronics Corporation W25X10CLSNIG TR
- Part No.:
- W25X10CLSNIG TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
W25X10CLSNIG TR.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,380
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Product details
Overview
W25X10CLSNIG TR from Winbond is a 1 M-bit (128 KB) serial flash memory IC supporting standard SPI, dual-output SPI, and dual I/O SPI interfaces with 4 KB uniform sectors, 104 MHz clock operation, and true execute-in-place (XIP) capability via Continuous Read Mode - used for code storage, firmware boot, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X10CLSNIG TR datasheet, W25X10CLSNIG TR pinout, W25X10CLSNIG TR application, or W25X10CLSNIG TR equivalent, this page delivers verified electrical specs, SOIC-8 pin mapping, hardware/software write protection behavior, dual I/O timing constraints, and real-world selection guidance against comparable serial flash alternatives.
Technical Context
The W25X10CLSNIG TR implements a SPI-compatible serial interface with support for Modes 0 and 3, enabling interoperability with standard microcontroller SPI peripherals. Its dual I/O mode uses bidirectional IO0/IO1 pins to achieve 208 Mbps effective throughput at 104 MHz CLK, matching parallel flash performance while reducing pin count.
Internally, it features a 512-page × 256-byte array organized into 32 × 4 KB sectors, 4 × 32 KB blocks, and 2 × 64 KB blocks. The status register includes non-volatile BP1/BP0/TB bits for configurable top/bottom hardware-protected regions, and SRP/WP interaction enables robust dual-layer write protection during power-up transients and runtime operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 M-bit (131,072 bytes), organized as 512 pages × 256 bytes - supports fine-grained data logging and firmware partitioning. |
| Interface Support | Standard SPI (DI/DO), Fast Read Dual Output (3Bh), Fast Read Dual I/O (BBh) - enables 2×–3× bandwidth vs. legacy serial flash. |
| Max Clock Frequency | 104 MHz (standard SPI); 104 MHz with dual I/O yields 208 Mbps effective - eliminates bottleneck in code-shadowing and XIP boot paths. |
| Erase Granularity | Uniform 4 KB sectors, 32 KB blocks, 64 KB blocks - allows selective firmware update without full chip erase. |
| Write Endurance | ≥100,000 program/erase cycles per sector - suitable for field-upgradable firmware with frequent minor revisions. |
| Data Retention | ≥20 years at +25°C - ensures long-term reliability in industrial control and medical device storage. |
| Supply Voltage | 2.3 V to 3.6 V single supply - compatible with 2.5 V, 3.0 V, and 3.3 V logic domains without level shifting. |
| Power Consumption | 1 mA active current; <1 µA power-down current - critical for battery-backed IoT nodes and low-power sleep modes. |
Pinout & Package
W25X10CLSNIG TR is supplied in an 8-pin SOIC 150-mil package (package code SN), with lead-free, RoHS-compliant finish and tape-and-reel packaging (TR suffix). Pin 1 is marked by a beveled corner or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before instruction acceptance; controls DO high-impedance state. |
| DO (IO1) | Serial Data Output / Dual I/O | Unidirectional output in standard SPI; bidirectional I/O in dual modes (BBh/3Bh); outputs status/data on CLK falling edge. |
| /WP | Hardware Write Protect Input | Active-low pin that locks status register writes when SRP=1; enables top/bottom array protection independent of software control. |
| GND | Ground Reference | Primary return path for VCC and all I/O signals; requires low-impedance PCB connection to minimize noise coupling. |
| DI (IO0) | Serial Data Input / Dual I/O | Unidirectional input in standard SPI; bidirectional I/O in dual modes; accepts instructions/addresses/data on CLK rising edge. |
| CLK | Serial Clock Input | Timing reference for all SPI operations; supports Modes 0 and 3; must be stable before /CS assertion. |
| /HOLD | Operation Pause Control | Active-low signal that suspends ongoing SPI transfers without resetting internal state - essential for multi-device bus sharing. |
| VCC | Power Supply | 2.3–3.6 V supply; internal voltage regulator ensures stable core operation across rail variation; decoupling capacitor required. |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | As few as 16 clocks to initiate address access - enables true XIP execution with minimal instruction overhead and deterministic latency. |
| Dual I/O SPI Interface | Uses IO0/IO1 for simultaneous address/data transfer - doubles effective bandwidth over standard SPI without increasing pin count. |
| Hardware + Software Write Protection | Combines /WP pin control with non-volatile BP1/BP0/TB/SRP bits - prevents accidental firmware corruption during brown-out or ESD events. |
| Uniform 4 KB Sector Architecture | 32 erasable sectors allow independent parameter storage, calibration tables, and event logs without disturbing application code. |
| JEDEC ID & Unique Serial Number | 64-bit factory-programmed unique ID (4Bh) and JEDEC-compliant 9Fh response - supports secure device authentication and traceability. |
| Low-Power Power-Down Mode | B9h instruction reduces current to <1 µA - extends battery life in always-on sensors and remote monitoring devices. |
Applications
| IoT Edge Node Firmware Storage | Industrial PLC Configuration Memory |
|---|---|
|
Use Scenario: Storing boot firmware, OTA update images, and sensor calibration data in battery-powered wireless gateways. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable Continuous Read Mode for fast cold-boot execution. Use Value: 104 MHz dual I/O read speed enables sub-100 ms firmware load; 4 KB sectors permit atomic update of configuration without erasing operational code. |
Use Scenario: Retaining ladder logic programs, I/O mapping tables, and alarm history in DIN-rail mounted programmable controllers. IC Role / Device Role / Timing Role: Parameter and program storage with hardware write protection (/WP + SRP) to prevent runtime corruption during EMI exposure. Use Value: Top/bottom block protection (TB bit) isolates user program (top) from system firmware (bottom), ensuring safe field updates. |
| Medical Device Bootloader Storage | Automotive Body Control Module (BCM) NVRAM |
|
Use Scenario: Holding certified bootloader code and cryptographic keys in Class II medical instruments requiring data integrity validation. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with 20-year data retention and JEDEC ID for audit-trail traceability. Use Value: Factory-programmed 64-bit Unique ID (4Bh) enables device-specific key binding; SRP/BP bits enforce immutable bootloader region. |
Use Scenario: Saving window position, mirror settings, and seat memory in automotive BCMs operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Automotive-grade non-volatile memory with extended temperature range and >100k endurance for frequent setting changes. Use Value: 100,000+ erase/write cycles ensure >10 years of daily use; 2.3–3.6 V supply tolerates vehicle battery fluctuations (9–16 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q10EWUXIE | Same 1 M-bit density but uses newer 1.8 V core (1.65–1.95 V I/O), QPI/DTR support, and enhanced security registers; no /HOLD pin in USON-8 variant. | Targeted at ultra-low-power wearables and AI edge accelerators requiring lower voltage and faster quad-mode access. | Select W25Q10EWUXIE only if system operates at 1.8 V and requires QPI; W25X10CLSNIG TR remains optimal for 2.5/3.3 V legacy MCU designs with /HOLD requirement. |
| Micron MT25QL10ABB8E12-0SIT | 1 M-bit, 3.3 V, SOIC-8; supports octal DTR, deeper power-down (<100 nA), and stricter AEC-Q100 Grade 2 qualification (-40°C to +105°C). | Designed for automotive infotainment and ADAS where extended temperature and automotive qualification are mandatory. | Choose MT25QL10ABB8E12-0SIT only for AEC-Q100-compliant designs; W25X10CLSNIG TR meets industrial temp (-40°C to +85°C) and offers broader SPI mode compatibility. |
Compared with W25Q10EWUXIE and MT25QL10ABB8E12-0SIT, the W25X10CLSNIG TR provides superior pin-level compatibility with legacy 3.3 V SPI controllers, retains /HOLD functionality critical for multi-peripheral buses, and delivers proven stability in cost-sensitive industrial and medical applications without requiring voltage translation or qualification overhead.
Availability
W25X10CLSNIG TR is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial PLC configuration memory, and medical device bootloader storage requiring stable component supply, long-lifecycle availability, and RoHS-compliant tape-and-reel delivery.
Supply support for W25X10CLSNIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions for embedded, communications, and consumer markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems requiring reliable code storage, fast read performance, and flexible hardware/software write protection - targeting applications where parallel flash footprint and power consumption are prohibitive.
FAQ
What is the maximum SPI clock frequency supported by the W25X10CLSNIG TR?
The W25X10CLSNIG TR supports up to 104 MHz for standard and dual I/O SPI operations. At this frequency, Fast Read Dual I/O (BBh) achieves 208 Mbps effective throughput. This rating is guaranteed across the full industrial temperature range (-40°C to +85°C) and 2.3–3.6 V supply, as specified in Section 9.6 of the official datasheet. Exceeding 104 MHz may result in timing violations and data corruption.
Does the W25X10CLSNIG TR support true execute-in-place (XIP) operation?
Yes, the W25X10CLSNIG TR supports true XIP via its Continuous Read Mode, which requires only 16 clocks to initiate memory access and enables uninterrupted sequential reads with minimal instruction overhead. This allows microcontrollers to execute code directly from the flash without copying to RAM, reducing boot time and SRAM usage - confirmed in Section 1 General Description and Figure 2 timing diagrams.
How does hardware write protection work on the W25X10CLSNIG TR?
Hardware write protection on the W25X10CLSNIG TR combines the /WP pin with non-volatile status register bits (SRP, BP1, BP0, TB). When SRP = 1 and /WP is low, the status register is locked; when TB = 0 and BP1/BP0 = 01, the upper 64 KB is protected. This dual-layer scheme prevents accidental writes during power transients or software faults - detailed in Sections 7.2.1 and 8.1.6–8.1.7.
What package type does the W25X10CLSNIG TR use, and is it RoHS-compliant?
The W25X10CLSNIG TR uses an 8-pin SOIC 150-mil package (package code SN), with lead-free, halogen-free, and RoHS-compliant construction. The "TR" suffix indicates tape-and-reel packaging for automated SMT assembly. Package dimensions and soldering profiles comply with JEDEC MS-012, as documented in Section 10.1 of the datasheet.
Can the W25X10CLSNIG TR be used in automotive applications?
The W25X10CLSNIG TR is rated for -40°C to +85°C operation and meets industrial temperature requirements, but it is not AEC-Q100 qualified. For automotive body control modules or infotainment systems requiring automotive qualification, Micron MT25QL10ABB8E12-0SIT or Cypress S25FL108K0XMFI010 are recommended alternatives. The W25X10CLSNIG TR remains suitable for under-hood-adjacent industrial equipment with similar thermal profiles.
W25X10CLSNIG TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 800µs
- Access Time:
- -
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X10CLSNIG TR FAQ
1.How can I place an order for W25X10CLSNIG TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X10CLSNIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X10CLSNIG TR reliable?
The price and inventory of W25X10CLSNIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X10CLSNIG TR is usually 5 days.
3.What payment methods are accepted for W25X10CLSNIG TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X10CLSNIG TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X10CLSNIG TR?
W25X10CLSNIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X10CLSNIG TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X10CLSNIG TR?
For technical support, including W25X10CLSNIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X10CLSNIG TR requirements.
6.How does Aetrix verify that W25X10CLSNIG TR is sourced from the original manufacturer or authorized distributors?
All W25X10CLSNIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X10CLSNIG TR meets industry standards.
7.What is the process for return or replacement of W25X10CLSNIG TR?
All W25X10CLSNIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25X10CLSNIG TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X10CLSNIG TR part is unused and in its original packaging.
Return procedure for W25X10CLSNIG TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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