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Winbond Electronics Corporation W25X10VZPIG

Part No.:
W25X10VZPIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25X10VZPIG.pdf
Description:
IC FLASH 1MBIT SPI 75MHZ 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,244

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Product details

Overview

W25X10VZPIG from Winbond is a 1M-bit (128KB) serial Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It supports standard and dual-output SPI interfaces, operates from 2.7V to 3.6V, delivers up to 75MHz clock rate (150Mbps effective with Fast Read Dual Output), and features uniform 4KB sectors and hardware/software write protection. It is commonly used in microcontroller boot code storage and firmware update buffers.

For engineers reviewing the W25X10VZPIG datasheet, W25X10VZPIG pinout, W25X10VZPIG application, or W25X10VZPIG equivalent, key selection criteria include sector granularity (4KB), dual-output SPI throughput, VCC operating range (2.7–3.6V), endurance (100,000 cycles), and package compatibility (8-pin WSON 6×5 mm).

Technical Context

The W25X10VZPIG implements a standard SPI interface compliant with Modes 0 and 3, plus a high-speed dual-output mode using DO and DIO pins simultaneously during Fast Read Dual Output (3Bh) instruction execution. Its internal architecture includes a 512-page × 256-byte array, supporting page program (≤256 bytes), sector erase (4KB), block erase (64KB), and chip erase operations.

Write protection is implemented via both hardware (/WP pin active-low control of Status Register writes) and software (configurable BP2–BP0 and TB bits in Status Register), enabling selective top/bottom array locking. The device enters low-power 1µA standby during Power-down (B9h) and resumes via Release Power-down (ABh), with BUSY and WEL status bits providing real-time operation visibility.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 M-bit (128 KB), organized as 512 pages × 256 bytes
Sector sizeUniform 4 KB sectors (32 total), enabling fine-grained data partitioning
Max SPI clock75 MHz - enables 150 Mbps effective read throughput using Fast Read Dual Output
Endurance100,000 program/erase cycles per sector - supports frequent firmware updates
Data retention20 years at +25°C - ensures long-term reliability in unpowered storage
Supply voltage2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Active current5 mA typical - minimizes power draw during code execution or data fetch
Power-down current1 µA typical - critical for battery-backed or energy-harvesting applications

Pinout & Package

W25X10VZPIG is packaged in an 8-contact WSON (6 mm × 5 mm, package code ZP), a surface-mount, leadless, thermally enhanced package suitable for high-density PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable: drives device into active state only when low; DO goes high-Z when high
DOSerial Data OutputPrimary output for standard SPI reads; also outputs LSB-aligned data during Fast Read Dual Output
/WPWrite Protect InputHardware lock for Status Register writes when low and SRP=1 - prevents accidental configuration changes
GNDGround ReferenceCommon return path for all I/O and power circuits; must be low-impedance for noise immunity
DIOSerial Data I/OInput for instructions/addresses/data; becomes secondary output (even bits) during Fast Read Dual Output
CLKSerial Clock InputEdge-triggered timing source: data latched on rising edge, output shifted on falling edge
/HOLDHold InputPauses ongoing SPI transaction while /CS remains low - enables bus sharing with other peripherals
VCCPower SupplySingle 2.7–3.6 V supply; powers internal logic, charge pump, and I/O buffers

Key Features

FeatureDesign Value
Dual Output SPI modeEnables 150 Mbps read throughput using DO + DIO simultaneously - accelerates boot code shadowing
Uniform 4 KB sectorsAllows independent erasure of parameter blocks without disturbing adjacent firmware sections
Hardware + software write protectionCombines /WP pin control with BP/TB/SRP bits to lock specific memory regions against overwrite
Page Program (≤256 bytes)Minimizes write latency and power consumption vs. full-sector programming - ideal for small config updates
Power-down mode (1 µA)Reduces system standby power significantly - essential for always-on IoT sensor nodes
JEDEC-compliant IDSupports automated detection via ABh/90h/9Fh instructions - simplifies BOM validation and firmware auto-configuration

Applications

Microcontroller Boot Code StorageFirmware Over-the-Air (OTA) Update Buffer

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V MCUs requiring fast, reliable non-volatile code storage.

IC Role / Device Role / Timing Role: Non-volatile code memory mapped via SPI; provides deterministic read latency for XIP or copy-to-RAM boot sequences.

Use Value: 4KB sector granularity allows safe in-field updates without erasing entire firmware image; dual-output SPI reduces boot time by ~50% vs. standard SPI.

Use Scenario: Holding validated firmware images prior to atomic swap during wireless updates in smart home hubs or industrial gateways.

IC Role / Device Role / Timing Role: Secondary storage buffer decoupled from main application flash; accessed only during update preparation phase.

Use Value: 100,000-cycle endurance supports repeated download/verify cycles; hardware write protect prevents corruption during power loss mid-update.

Industrial Sensor Configuration StorageAudio Voice Prompt Memory

Use Scenario: Retaining calibration coefficients, device IDs, and operational thresholds across power cycles in factory-floor sensors.

IC Role / Device Role / Timing Role: Parameter EEPROM replacement; accessed infrequently via SPI during initialization or maintenance mode.

Use Value: 4KB sectors allow isolated write/erase of config blocks without affecting calibration data stored elsewhere; 20-year retention ensures lifetime validity.

Use Scenario: Storing pre-recorded voice prompts (e.g., error announcements, menu navigation) in medical devices or building access panels.

IC Role / Device Role / Timing Role: Sequential audio playback memory; streamed via SPI DMA to audio DAC during user interaction.

Use Value: Fast Read Dual Output enables continuous 48 kbps mono audio streaming without CPU intervention; low active current extends battery life in portable units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT25DF021A-SSH-T2 M-bit density, same 8-pin SOIC/WSON packages, 85 MHz max clock, but lacks dual-output SPI modeHigher capacity for larger firmware, but slower read throughput limits boot performance in latency-sensitive designsSelect if capacity >128 KB is required and dual-output speed is not critical
MX25L1006EZN-12G1 M-bit, identical 4KB sectors and dual-output SPI, but rated for -40°C to +105°C and supports 100 MHz clockBetter thermal margin for automotive under-hood or industrial motor-control environmentsSelect for extended temperature operation where W25X10VZPIG's +85°C limit is insufficient

Compared with AT25DF021A-SSH-T, W25X10VZPIG offers faster boot via dual-output SPI but less capacity; versus MX25L1006EZN-12G, it shares core functionality but trades extended temperature rating for lower cost and broader legacy design adoption.

Availability

W25X10VZPIG is available at Aetrix Electronics and suitable for microcontroller boot code storage, firmware OTA update buffers, industrial sensor configuration storage, and audio voice prompt memory requiring stable component supply and long-lifecycle support.

Supply support for W25X10VZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, Serial Flash, and RAM products for embedded and industrial markets.

The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable, low-power serial Flash with flexible protection and high-speed read capability - targeting MCU-based consumer, industrial, and networking applications.

FAQ

What is the maximum SPI clock frequency supported by the W25X10VZPIG?

The W25X10VZPIG supports a maximum SPI clock frequency of 75 MHz. This enables standard read operations at up to 75 Mbps and, when using the Fast Read Dual Output (3Bh) instruction, achieves an effective throughput of 150 Mbps by utilizing both DO and DIO pins for simultaneous data output. Timing compliance is verified per AC Electrical Characteristics in the June 2007 datasheet Revision L.

Does the W25X10VZPIG support hardware write protection, and how is it enabled?

Yes, the W25X10VZPIG supports hardware write protection via the /WP pin. When the /WP pin is held low and the Status Register Protect (SRP) bit is set to 1, writes to the Status Register-including Block Protect (BP) and Top/Bottom (TB) bits-are disabled. This prevents accidental reconfiguration of memory protection settings. The /WP pin is active-low and requires external pull-up or controller-driven logic for proper control.

What package type does the W25X10VZPIG use, and what are its key mechanical features?

The W25X10VZPIG uses an 8-contact WSON (6 mm × 5 mm) package, designated package code ZP. It is a leadless, surface-mount, thermally enhanced package with exposed pad for improved heat dissipation. Pin pitch is 0.5 mm, and the package complies with JEDEC MO-229 standards. Its compact footprint and low profile make it ideal for high-density PCB layouts in portable and space-constrained embedded systems.

How many program/erase cycles is the W25X10VZPIG rated for, and what is its data retention period?

The W25X10VZPIG is rated for a minimum of 100,000 program/erase cycles per sector and guarantees 20 years of data retention at +25°C. Retention decreases with elevated temperature and usage; actual field lifetime depends on operating conditions and wear-leveling implementation in host firmware. These values are specified in Section 11.3 of the official datasheet (Revision L, June 2007).

Can the W25X10VZPIG be used in dual-output SPI mode, and which instruction enables it?

Yes, the W25X10VZPIG supports dual-output SPI mode using the Fast Read Dual Output instruction (0x3B). During this operation, the DIO pin functions as a second data output alongside DO, delivering even-numbered bits (D0, D2, D4, D6) while DO outputs odd-numbered bits (D1, D3, D5, D7), effectively doubling read bandwidth. Standard SPI instructions (e.g., 0x03, 0x0B) operate in single-output mode only.

W25X10VZPIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
SPI
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x5)

W25X10VZPIG FAQ

1.How can I place an order for W25X10VZPIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X10VZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X10VZPIG reliable?

The price and inventory of W25X10VZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X10VZPIG is usually 5 days.

3.What payment methods are accepted for W25X10VZPIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X10VZPIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X10VZPIG?

W25X10VZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X10VZPIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X10VZPIG?

For technical support, including W25X10VZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X10VZPIG requirements.

6.How does Aetrix verify that W25X10VZPIG is sourced from the original manufacturer or authorized distributors?

All W25X10VZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X10VZPIG meets industry standards.

7.What is the process for return or replacement of W25X10VZPIG?

All W25X10VZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X10VZPIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X10VZPIG part is unused and in its original packaging.

Return procedure for W25X10VZPIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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