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Winbond Electronics Corporation W25X16AVSFIG

Part No.:
W25X16AVSFIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25X16AVSFIG.pdf
Description:
IC FLASH 16MBIT SPI 75MHZ 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,329

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Product details

Overview

W25X16AVSFIG from Winbond is a 16M-bit (2MB) serial Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It features 4KB uniform sectors, dual-output SPI interface supporting up to 75MHz clock (150Mbps effective), and operates from a single 2.7–3.6V supply with 5mA active and 1µA power-down current. It is commonly used in firmware boot storage for microcontrollers in industrial controllers and IoT edge nodes.

For engineers reviewing the W25X16AVSFIG datasheet, W25X16AVSFIG pinout, W25X16AVSFIG application, or W25X16AVSFIG equivalent, key selection considerations include sector granularity (4KB), hardware/software write protection via /WP and status register, dual-output read performance, SOIC-150-mil (SN) package compatibility, and JEDEC-compliant device identification.

Technical Context

The W25X16AVSFIG implements a standard SPI bus (Modes 0 and 3) with four-signal interface (CLK, /CS, DIO, DO) and extends functionality with Fast Read Dual Output (3Bh), enabling simultaneous data output on both DIO and DO pins. Its internal architecture supports page-program (256-byte max), sector-erase (4KB), block-erase (64KB), and chip-erase operations.

Write protection is implemented through dual layers: hardware control via active-low /WP pin and software configuration of Status Register bits (BP2–BP0, TB, SRP). The device includes a dedicated /HOLD pin for pausing ongoing SPI transfers without deselecting, critical for multi-device bus sharing in real-time systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 M-bit (2,097,152 bytes), organized as 8,192 pages × 256 bytes
Sector Size Uniform 4KB sectors (512 total); enables fine-grained firmware partitioning and OTA update safety
SPI Clock Max 75 MHz; enables 150 Mbps effective throughput using Fast Read Dual Output instruction (3Bh)
Supply Voltage 2.7 V to 3.6 V; compatible with 3.3V logic domains without level shifting
Endurance & Retention 100,000 program/erase cycles; 20-year data retention at +85°C
Operating Temp −40°C to +85°C; qualified for industrial-grade embedded applications
Power Consumption 5 mA active (typ), 1 µA power-down (typ); suitable for battery-backed or low-power wake-on-event designs

Pinout & Package

W25X16AVSFIG is packaged in an 8-pin SOIC 150-mil (Package Code SN), measuring 3.9mm × 4.9mm. This compact surface-mount package supports reflow soldering and fits high-density PCB layouts.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; must transition high→low after power-up before first instruction; controls device selection on shared SPI bus
2 DO Data Output Serial data output during standard reads and dual-output mode; high-impedance when /CS high or /HOLD active
3 /WP Write Protect Input Hardware lock for Status Register writes; active-low; works with SRP bit to prevent accidental configuration changes
4 GND Ground Reference Primary return path for VCC and all I/O signals; requires low-impedance connection to system ground plane
5 DIO Data Input/Output Bi-directional SPI data line; inputs instructions/addresses; outputs data during Fast Read Dual Output (3Bh)
6 CLK Serial Clock Input Timing reference for all SPI transfers; supports Modes 0 and 3; data latched on rising edge, output on falling edge
7 /HOLD Hold Input Pauses ongoing SPI operation while /CS remains low; allows bus arbitration without interrupting internal state or buffer contents
8 VCC Power Supply Single 2.7–3.6V supply; decoupling capacitor (0.1 µF) required near pin for stable read/write timing

Key Features

Feature Design Value
Dual Output SPI Interface Enables 150 Mbps read throughput via Fast Read Dual Output (3Bh), matching parallel Flash performance in compact SPI footprint
4KB Uniform Sector Architecture Allows independent erasure of firmware partitions (e.g., bootloader vs. application), reducing update risk and wear leveling overhead
Hardware + Software Write Protection /WP pin and configurable Status Register (BP2–BP0, TB, SRP) provide layered defense against unintended writes during power transients or firmware bugs
HOLD Function with State Preservation Permits safe SPI bus sharing across multiple peripherals; suspends ongoing Page Program or Erase without data loss or restart delay
JEDEC Standard Identification Supports Read Manufacturer/Device ID (90h) and JEDEC ID (9Fh), enabling automated BOM verification and field firmware validation

Applications

Industrial PLC Firmware Storage IoT Edge Node Configuration Logging

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory holding executable code; accessed at power-up via SPI xfer to MCU RAM (code shadowing).

Use Value: 4KB sector granularity enables atomic updates of individual function blocks; 100K-cycle endurance ensures >10 years of field reprogramming at daily update frequency.

Use Scenario: Capturing sensor calibration data, network credentials, and OTA update metadata in battery-powered wireless sensors.

IC Role / Device Role / Timing Role: Parameter storage peripheral; written infrequently but read on every boot; leverages low 1µA power-down current.

Use Value: Hardware /WP pin prevents corruption during brown-out events; dual-output read accelerates credential loading during fast wake-up sequences.

Medical Device Bootloader Image Automotive Body Control Module Code

Use Scenario: Hosting certified bootloader images in Class II medical equipment requiring secure, traceable firmware execution.

IC Role / Device Role / Timing Role: Trusted boot source verified by MCU before application launch; accessed via deterministic SPI timing.

Use Value: Status Register memory protection (TB/BP bits) locks bootloader region against overwrite; −40°C to +85°C rating meets IEC 60601 ambient requirements.

Use Scenario: Storing lighting control algorithms and CAN message lookup tables in automotive BCMs exposed to under-hood temperature cycling.

IC Role / Device Role / Timing Role: Code and data repository interfaced to 32-bit ARM Cortex-M MCU over SPI; supports fast read for real-time response.

Use Value: 75MHz SPI clock and dual-output mode reduce boot latency by 40% vs. standard SPI; 20-year data retention ensures lifetime reliability without refresh.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
AT25DF161-SSHN-B 16Mb SPI Flash; same 4KB sectors, but supports 85MHz clock and Quad SPI (QSPI) mode; no /HOLD pin Better bandwidth for QSPI-capable MCUs; lacks hardware hold function for bus arbitration Choose if system uses QSPI controller and prioritizes speed over bus-sharing flexibility
MX25L1606EM2I-12G 16Mb SPI Flash; identical pinout (SOIC-150), 75MHz max, includes /HOLD and /WP; supports additional security registers Drop-in replacement with extended security features (secure OTP area); same industrial temp range Prefer for new designs requiring enhanced firmware integrity; validated pin-compatible with W25X16AVSFIG

Compared with AT25DF161-SSHN-B and MX25L1606EM2I-12G, the W25X16AVSFIG offers balanced performance and proven industrial reliability with full /HOLD support, while MX25L1606EM2I-12G provides direct layout compatibility and added security - making it the strongest drop-in alternative where enhanced protection is needed.

Availability

W25X16AVSFIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, IoT edge node configuration logging, medical device bootloader image hosting, automotive body control module code storage, and embedded system parameter retention requiring stable component supply across long-lifecycle programs.

Supply support for W25X16AVSFIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR Flash, PSRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems requiring reliable serial Flash with fast read access, flexible protection, and industrial temperature operation - targeting MCU boot and data logging use cases.

FAQ

What is the maximum SPI clock frequency supported by W25X16AVSFIG?

The W25X16AVSFIG supports SPI clock frequencies up to 75 MHz. When using the Fast Read Dual Output instruction (3Bh), this enables an effective data transfer rate of 150 Mbps, as both DO and DIO pins output data simultaneously. This specification is guaranteed across the full −40°C to +85°C operating temperature range and 2.7–3.6V supply voltage.

Does W25X16AVSFIG support Quad SPI (QSPI) mode?

No, W25X16AVSFIG does not support Quad SPI mode. It implements standard SPI (single I/O) and Dual Output SPI only, using four pins: CLK, /CS, DIO, and DO. QSPI functionality requires four bidirectional I/O lines and is not present in the W25X16A family per its official datasheet revision I (May 2008). For QSPI capability, consider newer Winbond families like W25Qxx or third-party alternatives.

What package type does W25X16AVSFIG use, and is it RoHS compliant?

W25X16AVSFIG uses the 8-pin SOIC 150-mil package (Package Code SN), with dimensions 3.9 mm × 4.9 mm. It is RoHS compliant and lead-free, meeting JEDEC J-STD-020 moisture sensitivity level (MSL) 3 requirements. The 'G' suffix in the part number confirms green (halogen-free) packaging per Winbond's standard product definition.

How many erase/write cycles does W25X16AVSFIG guarantee?

W25X16AVSFIG guarantees a minimum of 100,000 program/erase cycles per sector, with 20-year data retention at +85°C. This endurance rating applies to all 4KB sectors across the full memory array and is validated per JEDEC standards. Wear leveling must be implemented in firmware to distribute writes and achieve rated lifetime in high-update applications.

Can W25X16AVSFIG be used as a direct replacement for W25X16VSFIG?

Yes, W25X16AVSFIG is the enhanced revision of W25X16VSFIG, with identical pinout, timing, and command set. The 'A' suffix denotes improved electrical characteristics including tighter AC timing margins and enhanced ESD robustness. All documentation, layout footprints, and firmware drivers for W25X16VSFIG apply directly to W25X16AVSFIG without modification.

W25X16AVSFIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25X16AVSFIG FAQ

1.How can I place an order for W25X16AVSFIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X16AVSFIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X16AVSFIG reliable?

The price and inventory of W25X16AVSFIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X16AVSFIG is usually 5 days.

3.What payment methods are accepted for W25X16AVSFIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X16AVSFIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X16AVSFIG?

W25X16AVSFIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X16AVSFIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X16AVSFIG?

For technical support, including W25X16AVSFIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X16AVSFIG requirements.

6.How does Aetrix verify that W25X16AVSFIG is sourced from the original manufacturer or authorized distributors?

All W25X16AVSFIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X16AVSFIG meets industry standards.

7.What is the process for return or replacement of W25X16AVSFIG?

All W25X16AVSFIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X16AVSFIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X16AVSFIG part is unused and in its original packaging.

Return procedure for W25X16AVSFIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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