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Winbond Electronics Corporation W25X16VSFIG T&R

Part No.:
W25X16VSFIG T&R
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25X16VSFIG T&R.pdf
Description:
IC FLASH 16MBIT SPI 75MHZ 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,883

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Product details

Overview

W25X16VSFIG T&R from Winbond is a 16 M-bit (2 MB) serial Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It features 4 KB uniform sectors, dual-output SPI interface supporting up to 75 MHz clock (150 Mbps effective), and operates from a single 2.7–3.6 V supply with 5 mA active and 1 µA power-down current. Used in boot code storage for microcontrollers and firmware update storage in industrial controllers.

For engineers reviewing the W25X16VSFIG T&R datasheet, W25X16VSFIG T&R pinout, W25X16VSFIG T&R application, or W25X16VSFIG T&R equivalent, key selection criteria include sector granularity (4 KB), dual-output SPI timing compliance, hardware write protection via /WP pin, and compatibility with standard SPI Mode 0/3 bus masters in resource-limited designs.

Technical Context

The W25X16VSFIG T&R implements a standard SPI-compatible serial interface with four dedicated pins (CLK, /CS, DIO, DO) and supports both single- and dual-output read modes. Its internal architecture includes a 256-byte page buffer, 512 erasable 4 KB sectors, and status register-controlled block protection with TB/BP bits enabling top/bottom array locking.

It executes Page Program (≤2 ms), Sector Erase (4 KB), Block Erase (64 KB), and Chip Erase instructions, with BUSY bit polling and Write Enable Latch (WEL) state management required for all write operations. The /HOLD pin enables SPI bus arbitration without interrupting ongoing erase/program cycles.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages
Sector SizeUniform 4 KB sectors (512 total); enables fine-grained firmware partitioning and parameter storage
SPI InterfaceDual-output SPI (Fast Read Dual Output 3Bh); delivers 150 Mbps effective throughput at 75 MHz CLK
Supply Voltage2.7 V to 3.6 V; compatible with 3.3 V logic systems without level shifting
Write Endurance100,000 program/erase cycles per sector; supports frequent field firmware updates
Data Retention20 years at +25°C; ensures long-term reliability in unattended deployments
Operating Temp−40°C to +85°C; qualified for industrial ambient environments

Pinout & Package

W25X16VSFIG T&R uses an 8-pin SOIC 208-mil package (package code SS), footprint-compatible with industry-standard 8-lead SOIC sockets and reflow profiles.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; high-impedance DO output when deasserted; must track VCC at power-up
2 DOSerial Data OutputSingle-output data path; outputs on falling CLK edge; high-Z during /HOLD or /CS high
3 /WPWrite Protect InputHardware lock for Status Register; active-low; works with SRP bit to prevent accidental writes
4 GNDGround ReferenceSignal and power return; decoupling capacitor required near VCC pin
5 DIOSerial Data I/OInput for commands/addresses; bidirectional during Fast Read Dual Output (3Bh)
6 CLKSerial Clock InputTiming reference; rising edge latches input, falling edge clocks out DO/DIO; supports Mode 0/3
7 /HOLDHold InputPauses active SPI transaction; preserves internal state while sharing bus with other peripherals
8 VCCPower Supply2.7–3.6 V main supply; requires local 0.1 µF ceramic decoupling

Key Features

FeatureDesign Value
Dual-output SPI modeEnables 150 Mbps read throughput using existing 4-wire SPI bus-no extra pins or controller changes needed
4 KB uniform sectorsAllows independent erasure of boot loader, application, and configuration sections without disturbing adjacent data
Hardware + software write protection/WP pin + SRP/BP bits provide layered defense against corruption during brown-out or firmware bugs
/HOLD pin supportPermits deterministic SPI bus arbitration in multi-peripheral systems without aborting in-progress erase/program cycles
JEDEC ID & Device IDEnables runtime identification and firmware validation-critical for secure boot and field-upgrade verification

Applications

Boot Code StorageFirmware Update Storage

Use Scenario: Storing primary bootloader and application image for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code repository accessed via SPI during reset sequence; supports fast read dual-output for rapid shadowing into RAM.

Use Value: Reduces boot time by 40% vs. standard SPI reads; eliminates need for parallel NOR Flash in cost-sensitive designs.

Use Scenario: Holding over-the-air (OTA) firmware patches in smart meters and industrial gateways before validation and installation.

IC Role / Device Role / Timing Role: Secure, field-updatable storage partition isolated via BP bits; erased only after cryptographic signature verification.

Use Value: Enables safe, atomic firmware swaps with rollback capability-no risk of bricking due to partial writes.

Configuration Parameter StorageAudio/Data Logging Buffer

Use Scenario: Retaining calibration coefficients, network credentials, and user preferences across power cycles in HVAC controllers.

IC Role / Device Role / Timing Role: Small-sector (4 KB) non-volatile scratchpad; written infrequently but read on every startup.

Use Value: Eliminates battery-backed SRAM; guarantees 20-year data retention without maintenance or replacement.

Use Scenario: Capturing sensor telemetry or voice snippets in portable medical devices during intermittent connectivity windows.

IC Role / Device Role / Timing Role: Circular-buffer storage with sector-level wear leveling; managed via background erase scheduling.

Use Value: Sustains >100,000 write cycles across full memory map-supports 5+ years of daily logging at 100 kB/day.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT25DF161-SSHN-B16 M-bit, 2.7–3.6 V, SOIC-8; supports standard SPI only (no dual-output); max CLK = 85 MHzLacks dual-output acceleration; slower read throughput limits boot performance in latency-critical systemsSelect if dual-output is unnecessary and higher clock tolerance (85 MHz) is prioritized over bandwidth efficiency
MX25L1606EM2I-12G16 M-bit, 2.7–3.6 V, SOIC-8; supports dual-output SPI; max CLK = 80 MHz; built-in security registersIncludes OTP security registers for unique ID and secure boot keys-adds tamper-resistant provisioning capabilityChoose when cryptographic key storage or device identity binding is required alongside code storage

Compared with AT25DF161-SSHN-B and MX25L1606EM2I-12G, the W25X16VSFIG T&R delivers optimal balance of dual-output speed, 4 KB sector flexibility, and industrial temperature support-making it ideal for cost-sensitive, performance-aware embedded boot and update architectures where security extensions are optional.

Availability

W25X16VSFIG T&R is available at Aetrix Electronics and suitable for industrial control panels, medical diagnostic instruments, and automotive telematics modules requiring stable component supply and long-term manufacturability.

Supply support for W25X16VSFIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial Flash, PSRAM, and TrustME secure memory products.

The W25X series was engineered for embedded systems needing compact, low-power, high-reliability code and data storage-targeting applications where pin count, board area, and power budget constrain use of parallel Flash or EEPROM.

FAQ

What is the maximum SPI clock frequency supported by the W25X16VSFIG T&R?

The W25X16VSFIG T&R supports SPI clock frequencies up to 75 MHz in standard and dual-output modes. At this rate, the Fast Read Dual Output (3Bh) instruction achieves an effective data transfer rate of 150 Mbps. This specification is validated across the full −40°C to +85°C operating range and requires proper PCB layout with controlled impedance and minimized trace length to maintain signal integrity.

Does the W25X16VSFIG T&R support both SPI Mode 0 and Mode 3?

Yes, the W25X16VSFIG T&R supports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). Data is sampled on the rising edge of CLK in both modes, and output is clocked on the falling edge. This dual-mode compatibility allows seamless integration with diverse microcontroller SPI peripherals without requiring hardware or firmware modification for clock polarity/phase alignment.

How does hardware write protection work on the W25X16VSFIG T&R?

Hardware write protection on the W25X16VSFIG T&R is implemented via the /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is driven low, writes to the status register-including block protect (BP) and top/bottom (TB) bits-are disabled. This prevents accidental or malicious modification of memory protection settings during system operation or power transients, ensuring critical firmware regions remain locked.

Can the W25X16VSFIG T&R be used in place of a parallel NOR Flash device?

Yes, the W25X16VSFIG T&R is frequently used as a drop-in replacement for parallel NOR Flash in boot code storage applications-particularly where board space, pin count, or power consumption are constrained. Its dual-output SPI interface delivers read throughput comparable to 8-bit parallel Flash (e.g., ~150 Mbps vs. ~120 Mbps), while reducing I/O count from 24+ to just 4 signals and eliminating address/data bus routing complexity.

What is the sector erase time for the W25X16VSFIG T&R, and how is it managed?

The W25X16VSFIG T&R specifies a typical sector (4 KB) erase time of 100 ms, with a maximum of 400 ms. Erase execution is asynchronous: after issuing the Sector Erase (20h) command with valid address, the device sets the BUSY bit (S0) in the status register. Host firmware must poll this bit until cleared to confirm completion-enabling concurrent processing while erase proceeds internally without blocking the SPI bus.

W25X16VSFIG T&R Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25X16VSFIG T&R FAQ

1.How can I place an order for W25X16VSFIG T&R through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X16VSFIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X16VSFIG T&R reliable?

The price and inventory of W25X16VSFIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X16VSFIG T&R is usually 5 days.

3.What payment methods are accepted for W25X16VSFIG T&R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X16VSFIG T&R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X16VSFIG T&R?

W25X16VSFIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X16VSFIG T&R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X16VSFIG T&R?

For technical support, including W25X16VSFIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X16VSFIG T&R requirements.

6.How does Aetrix verify that W25X16VSFIG T&R is sourced from the original manufacturer or authorized distributors?

All W25X16VSFIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X16VSFIG T&R meets industry standards.

7.What is the process for return or replacement of W25X16VSFIG T&R?

All W25X16VSFIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25X16VSFIG T&R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X16VSFIG T&R part is unused and in its original packaging.

Return procedure for W25X16VSFIG T&R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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