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Winbond Electronics Corporation W25X16VSSIG
- Part No.:
- W25X16VSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X16VSSIG.pdf
- Description:
- IC FLASH 16MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,615
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Product details
Overview
W25X16VSSIG from Winbond is a 16 M-bit (2 MB) serial Flash memory IC with uniform 4 KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75 MHz clock and 150 Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X16VSSIG datasheet, W25X16VSSIG pinout, W25X16VSSIG application, or W25X16VSSIG equivalent, key selection considerations include SOIC-8 208-mil package compatibility, hardware write protection via /WP pin, sector-level erase granularity, and JEDEC-compliant device identification support.
Technical Context
The W25X16VSSIG implements a standard SPI bus with Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1) support, using four dedicated pins: /CS, CLK, DIO, and DO. Its dual-output capability activates only during Fast Read Dual Output (3Bh) instruction, repurposing DIO as a second output while retaining single-input functionality for all other commands.
Internal architecture features a 256-byte page buffer, 512 erasable 4 KB sectors, and programmable status register with BP2–BP0, TB, and SRP bits enabling flexible top/bottom hardware- and software-based memory protection. Write Enable Latch (WEL) enforces explicit enable/disable sequencing before any program/erase operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages |
| Operating Voltage | 2.7 V to 3.6 V - ensures compatibility with 3.3 V logic systems without level shifting |
| Max Clock Frequency | 75 MHz - enables 150 Mbps effective throughput with Fast Read Dual Output |
| Erase Granularity | 4 KB sectors (512 total) and 64 KB blocks (32 total) - supports fine-grained firmware updates and configuration partitioning |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - suitable for field-upgradable embedded applications |
| Power Consumption | 5 mA active current (typ), 1 µA power-down current (typ) - minimizes system standby power in battery-backed designs |
| Temperature Range | –40 °C to +85 °C - qualified for industrial-grade operation without derating |
Pinout & Package
W25X16VSSIG is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.3 mm × 5.3 mm × 1.75 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives DO to high-Z when high; must transition high→low after power-up to accept instructions |
| 2 DO | Data Output | Primary serial output; outputs data on falling CLK edge; high-Z during /HOLD or /CS high |
| 3 /WP | Write Protect Input | Hardware lock for status register: low disables Write Status Register when SRP=1; active during power-up sequencing |
| 4 GND | Ground Reference | Signal and power return path; must be low-impedance to ensure stable read/write margins and noise immunity |
| 5 DIO | Data Input/Output | Serial input for instructions/addresses/data; becomes secondary output during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Timing reference for all SPI transfers; data sampled on rising edge (input), shifted out on falling edge (output) |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction when low (with /CS low); preserves internal state for multi-master bus arbitration |
| 8 VCC | Power Supply | Single 2.7–3.6 V supply; requires local 0.1 µF ceramic decoupling adjacent to pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI Interface | Enables 150 Mbps read throughput via Fast Read Dual Output (3Bh), doubling standard SPI bandwidth for boot code shadowing |
| Uniform 4 KB Sector Architecture | Allows precise firmware patching and configuration storage without erasing unrelated memory regions |
| Hardware + Software Write Protection | Combines /WP pin control with programmable BP2–BP0 and TB bits to protect top/bottom memory segments independently |
| JEDEC Standard Identification | Supports Read Manufacturer/Device ID (90h) and JEDEC ID (9Fh) for automated BOM verification and supply chain traceability |
| Low-Power Power-Down Mode | Reduces current to 1 µA (typ) while preserving memory contents - critical for energy-sensitive IoT endpoints |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
Use Scenario: Storing primary bootloader and application firmware executed directly from SPI Flash on microcontroller startup. IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read access; supports XIP-capable controllers via Fast Read Dual Output timing. Use Value: Eliminates external parallel Flash or RAM copy step; reduces BOM count and PCB area by leveraging 75 MHz SPI interface. | Use Scenario: Isolating field-upgradable firmware images in dedicated memory regions to enable atomic over-the-air (OTA) updates. IC Role / Device Role / Timing Role: Parameter and image storage with independent 4 KB sector erase - allows safe dual-bank update without corrupting active code. Use Value: Enables rollback-safe updates using sector-level granularity; avoids full-chip erase delays during production programming. |
| Configuration Data Retention | Industrial HMI Display Memory |
Use Scenario: Preserving calibration constants, user preferences, and network settings across power cycles in medical or test equipment. IC Role / Device Role / Timing Role: Byte-addressable non-volatile storage with hardware write protection (/WP pin) to prevent accidental corruption during runtime. Use Value: Guarantees data integrity without software overhead; leverages 100K-cycle endurance for frequent parameter writes. | Use Scenario: Holding GUI assets (fonts, icons, bitmaps) for touch-enabled human-machine interfaces in factory automation panels. IC Role / Device Role / Timing Role: High-bandwidth serial memory serving as frame buffer supplement; accessed via burst reads using Fast Read Dual Output. Use Value: Delivers 150 Mbps read rate to sustain smooth graphical rendering without requiring parallel interface routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF161-SSH-T | 16 M-bit, 3.3 V, SOIC-8; supports standard SPI only (no dual-output mode); max clock 85 MHz but no 3Bh instruction | Lacks dual-output acceleration - lower effective read bandwidth for boot code loading | Choose when dual-output is unnecessary and higher clock tolerance is preferred over throughput optimization |
| S25FL132K0XMFI010 | 16 M-bit, 3.0 V min, SOIC-8; includes Quad SPI (QSPI) support and configurable latency; 100K cycle endurance | Offers QSPI mode for up to 300 Mbps read speed but requires controller QSPI peripheral support | Prefer when migrating to QSPI-capable MCUs and seeking future scalability beyond dual-output limits |
Compared with AT25DF161-SSH-T and S25FL132K0XMFI010, the W25X16VSSIG delivers optimized 150 Mbps read performance via dual-output SPI at minimal pin count, making it ideal for cost-sensitive 3.3 V systems where QSPI infrastructure is unavailable and boot latency is critical.
Availability
W25X16VSSIG is available at Aetrix Electronics and suitable for industrial HMI displays, medical device boot storage, and IoT sensor node firmware updates requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for W25X16VSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial NOR Flash memory solutions for embedded and industrial markets.
The W25X series was designed specifically for space-constrained, low-power embedded systems requiring reliable code and data storage with SPI simplicity and enhanced throughput via dual-output capability.
FAQ
What is the maximum SPI clock frequency supported by the W25X16VSSIG?
The W25X16VSSIG supports a maximum SPI clock frequency of 75 MHz. This enables standard read operations at up to 75 Mbps and Fast Read Dual Output (3Bh) operations at up to 150 Mbps. The timing is validated across the full –40 °C to +85 °C operating range and 2.7–3.6 V supply, with setup/hold margins defined in the AC Electrical Characteristics table of the official datasheet. W25X16VSSIG maintains timing compliance without external clock dividers or controller-specific tuning.
Does the W25X16VSSIG support Quad SPI (QSPI) mode?
No, the W25X16VSSIG does not support Quad SPI mode. It implements standard SPI with single- or dual-output capability only - using pins /CS, CLK, DIO, and DO. Dual-output operation is activated exclusively by the Fast Read Dual Output (3Bh) instruction, which repurposes DIO as a second data output. W25X16VSSIG lacks quad I/O signaling, command set extensions for QSPI, or dedicated QUADEN configuration bits found in later Winbond families like W25Q.
What package type is used for the W25X16VSSIG part number?
The W25X16VSSIG uses an 8-pin SOIC 208-mil package (Winbond package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.3 mm × 5.3 mm × 1.75 mm. This package is distinct from the 16-pin SOIC 300-mil (SF) or WSON variants offered for other members of the W25X family. The 'VSSIG' suffix explicitly denotes this SOIC-8 208-mil industrial-grade variant.
How does hardware write protection work on the W25X16VSSIG?
Hardware write protection on the W25X16VSSIG is implemented via the /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is driven low, the Write Status Register instruction is locked out, preventing changes to block protection bits (BP2–BP0) and top/bottom select (TB). This provides tamper-resistant configuration locking. W25X16VSSIG retains this behavior across power cycles, and /WP must be pulled high to re-enable status register writes after protection is engaged.
Can the W25X16VSSIG be used as a direct replacement for the W25X16VNI?
No, the W25X16VSSIG is not a direct replacement for W25X16VNI. While both are 16 M-bit Winbond serial Flash devices, W25X16VNI uses an 8-pin PDIP 300-mil package (DA), whereas W25X16VSSIG uses SOIC-8 208-mil (SS). Pinouts differ: PDIP places /HOLD on pin 1 and VCC on pin 2, while SOIC places /CS on pin 1 and VCC on pin 8. Mechanical incompatibility and signal mapping differences preclude drop-in substitution without PCB redesign. W25X16VSSIG requires SOIC-8 footprint and layout.
W25X16VSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X16VSSIG FAQ
1.How can I place an order for W25X16VSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X16VSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X16VSSIG reliable?
The price and inventory of W25X16VSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X16VSSIG is usually 5 days.
3.What payment methods are accepted for W25X16VSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X16VSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X16VSSIG?
W25X16VSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X16VSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X16VSSIG?
For technical support, including W25X16VSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X16VSSIG requirements.
6.How does Aetrix verify that W25X16VSSIG is sourced from the original manufacturer or authorized distributors?
All W25X16VSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X16VSSIG meets industry standards.
7.What is the process for return or replacement of W25X16VSSIG?
All W25X16VSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X16VSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X16VSSIG part is unused and in its original packaging.
Return procedure for W25X16VSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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