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Winbond Electronics Corporation W25X16VSSIG T&R
- Part No.:
- W25X16VSSIG T&R
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X16VSSIG T&R.pdf
- Description:
- IC FLASH 16MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,710
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Product details
Overview
W25X16VSSIG T&R from Winbond is a 16M-bit (2MB) serial Flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating on single 2.7–3.6V supply, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), widely used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X16VSSIG T&R datasheet, W25X16VSSIG T&R pinout, W25X16VSSIG T&R application, or W25X16VSSIG T&R equivalent, key selection factors include sector-level erase granularity (4KB), hardware/software write protection (/WP pin + status register BP/TB/SRP bits), SOIC-208mil (SS) package compatibility, and JEDEC ID (9Fh) verification capability.
Technical Context
The W25X16VSSIG T&R implements a standard SPI Mode 0/3 interface with four dedicated pins (CLK, /CS, DIO, DO) and supports dual-output read mode using the 3Bh instruction, where DIO functions as a second output during data transfer-enabling 150Mbps throughput without bus reconfiguration. It features a 256-byte page buffer and supports sector (4KB), block (64KB), and chip erase operations.
Its status register includes non-volatile BP2–BP0, TB, and SRP bits enabling flexible top/bottom memory protection zones; write enable latch (WEL) ensures atomicity of program/erase cycles; and /HOLD pin allows deterministic pause/resume of ongoing SPI transactions while /CS remains asserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages |
| Architecture | Uniform 4KB sectors (512 total) and 64KB blocks (32 total) - enables fine-grained firmware update and parameter partitioning |
| SPI Interface | Standard and dual-output SPI (3Bh); supports up to 75MHz CLK - delivers 150Mbps effective read rate |
| Write Endurance | 100,000 program/erase cycles per sector - suitable for field-upgradable firmware with frequent minor updates |
| Data Retention | 20 years at +25°C - meets long-life industrial and automotive control module requirements |
| Supply Voltage | 2.7V to 3.6V single supply - compatible with 3.3V logic domains without level shifting |
| Operating Temp | –40°C to +85°C - qualified for extended temperature industrial applications |
Pinout & Package
W25X16VSSIG T&R uses the 8-pin SOIC 208-mil package (Winbond package code SS), with gull-wing leads, 1.27mm pitch, and body dimensions of 5.3mm × 5.3mm × 1.75mm - compatible with standard reflow and wave soldering processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives DO to high-Z when high; required low-to-high transition before instruction acceptance after power-up |
| 2 DO | Serial Data Output | Primary output for standard SPI reads; outputs MSB-first on falling CLK edge; high-Z during /HOLD or /CS high |
| 3 /WP | Write Protect Input | Hardware lock for status register: disables Write Status Register when low and SRP=1 - prevents accidental protection changes |
| 4 GND | Ground Reference | System return path for VCC and all I/O signals; must be low-impedance to maintain timing integrity under fast SPI switching |
| 5 DIO | Serial Data I/O | Bi-directional SPI data line: input for instructions/addresses, output during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Timing reference for all SPI transfers; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high); sampled on rising edge for input |
| 7 /HOLD | Hold Input | Pauses active SPI transaction (e.g., mid-page-program) without resetting internal state - essential for multi-device SPI bus sharing |
| 8 VCC | Power Supply | 2.7–3.6V core and I/O supply; requires local 0.1µF ceramic decoupling near pin to suppress switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI (3Bh) | Enables 150Mbps read throughput by using DIO as second output - cuts boot-time code shadowing latency by ~50% vs. standard SPI |
| 4KB Uniform Sectors | Allows independent erasure of firmware partitions (e.g., bootloader, app, config) without disturbing adjacent data - critical for OTA update safety |
| Hardware + Software Write Protection | Combines /WP pin control with non-volatile BP/TB/SRP bits - supports hierarchical protection (full chip, top/bottom half, or 1/32 segments) |
| Page Program (02h) | Writes up to 256 bytes per command with <2ms typical time - enables efficient small-data logging and runtime parameter storage |
| JEDEC ID Support (9Fh) | Returns manufacturer (EFh) and device (3015h) IDs - enables automated flash detection and vendor-agnostic bootloader initialization |
Applications
| Firmware Storage | Industrial HMI Configuration |
|---|---|
|
Use Scenario: Storing boot code, application firmware, and recovery images in microcontroller-based edge gateways. IC Role / Device Role / Timing Role: Non-volatile code storage with fast dual-output read for rapid RAM loading at power-on reset. Use Value: 150Mbps read speed reduces boot time by >40% versus standard SPI; 4KB sectors allow safe partial firmware updates without full chip erase. |
Use Scenario: Retaining display layouts, language packs, and calibration offsets across power cycles in panel-mounted HMIs. IC Role / Device Role / Timing Role: Parameter EEPROM replacement with byte-addressable writes and sector-level durability management. Use Value: 100,000 erase cycles and 20-year retention ensure reliable operation over 10+ year product lifecycles; /WP pin prevents corruption during ESD events. |
| Wireless Sensor Node Data Logging | Automotive Body Control Module (BCM) |
|
Use Scenario: Capturing sensor timestamps and event logs in battery-powered IoT nodes with infrequent wake-ups. IC Role / Device Role / Timing Role: Low-power data sink using power-down mode (1µA) between logging intervals; page programming minimizes active time. Use Value: 1µA power-down current extends coin-cell battery life to >5 years; 256-byte page writes reduce energy-per-byte versus byte-wise EEPROM emulation. |
Use Scenario: Storing vehicle-specific configuration (e.g., door lock behavior, mirror presets) and diagnostic trouble codes (DTCs) in BCM ECUs. IC Role / Device Role / Timing Role: AEC-Q100 stress-tested non-volatile memory for ASIL-B relevant data storage with robust write protection. Use Value: –40°C to +85°C operation and hardware /WP + SRP protection prevent misconfiguration during cold cranking or EMI transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF021-SSH-T | 2M-bit density, same SOIC-208 package, but only standard SPI (no dual-output); max CLK = 50MHz | Lacks Fast Read Dual Output - unsuitable for latency-critical boot code loading | Select if cost sensitivity outweighs throughput needs and dual-output is unused in design |
| MX25L1606EM2I-12G | 16M-bit, SOIC-208, supports dual-output SPI (3Bh), but requires 2.7–3.6V and has 10ms typical sector erase time (vs. W25X16VSSIG T&R's 15–25ms) | Similar performance envelope but different status register bit mapping - requires firmware adaptation | Choose for drop-in replacement only after verifying status register compatibility and timing margins in target system |
Compared with AT25DF021-SSH-T and MX25L1606EM2I-12G, W25X16VSSIG T&R uniquely balances 150Mbps dual-output throughput, 4KB sector granularity, and proven industrial temperature reliability - making it optimal for boot-critical and field-upgradable embedded systems where both speed and data integrity are non-negotiable.
Availability
W25X16VSSIG T&R is available at Aetrix Electronics and suitable for firmware storage, industrial HMI configuration, and wireless sensor node data logging requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for W25X16VSSIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, PSRAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.
The W25X series was designed specifically for embedded systems needing compact, low-power, high-reliability serial Flash - emphasizing fast read speeds, flexible protection schemes, and broad temperature operation without sacrificing endurance.
FAQ
What is the maximum SPI clock frequency supported by W25X16VSSIG T&R?
W25X16VSSIG T&R supports SPI clock frequencies up to 75MHz in standard and dual-output modes. When using the Fast Read Dual Output (3Bh) instruction, this enables an effective data transfer rate of 150Mbps. The AC Electrical Characteristics table in the datasheet specifies tVCL and tVCH timing parameters that must be met at this frequency, and proper PCB layout (controlled impedance, short traces, ground plane) is required to maintain signal integrity.
Does W25X16VSSIG T&R support hardware write protection independent of software configuration?
Yes, W25X16VSSIG T&R supports hardware write protection via the /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is driven low, the Write Status Register instruction is locked out - preventing modification of block protection bits (BP2–BP0) and top/bottom control (TB). This provides tamper-resistant configuration locking even if firmware is compromised.
What package type does W25X16VSSIG T&R use, and is it RoHS compliant?
W25X16VSSIG T&R uses the 8-pin SOIC 208-mil package (Winbond package code SS), with lead-free (Pb-free) construction and RoHS compliance confirmed in Winbond's official packaging documentation. The "G" suffix in the part number denotes green (halogen-free) material set, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
How many erase cycles can W25X16VSSIG T&R endure, and what is its data retention specification?
W25X16VSSIG T&R guarantees 100,000 program/erase cycles per sector and 20 years of data retention at +25°C. Retention degrades predictably with temperature - e.g., ~10 years at +85°C - as specified in the Endurance and Data Retention section of the datasheet. These values are measured per JEDEC standards and apply to all 512 sectors uniformly.
Can W25X16VSSIG T&R be used in dual-output SPI mode with existing standard SPI controllers?
Yes, W25X16VSSIG T&R maintains full backward compatibility with standard SPI controllers. Its dual-output mode is activated only when the Fast Read Dual Output (3Bh) instruction is issued; all other commands (e.g., 03h Read Data) operate in standard single-output mode. No controller hardware changes are needed - only firmware update to issue 3Bh and handle dual-bit reads.
W25X16VSSIG T&R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X16VSSIG T&R FAQ
1.How can I place an order for W25X16VSSIG T&R through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X16VSSIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X16VSSIG T&R reliable?
The price and inventory of W25X16VSSIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X16VSSIG T&R is usually 5 days.
3.What payment methods are accepted for W25X16VSSIG T&R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X16VSSIG T&R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X16VSSIG T&R?
W25X16VSSIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X16VSSIG T&R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X16VSSIG T&R?
For technical support, including W25X16VSSIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X16VSSIG T&R requirements.
6.How does Aetrix verify that W25X16VSSIG T&R is sourced from the original manufacturer or authorized distributors?
All W25X16VSSIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X16VSSIG T&R meets industry standards.
7.What is the process for return or replacement of W25X16VSSIG T&R?
All W25X16VSSIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25X16VSSIG T&R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X16VSSIG T&R part is unused and in its original packaging.
Return procedure for W25X16VSSIG T&R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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