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Winbond Electronics Corporation W25X16VZPIG T&R

Part No.:
W25X16VZPIG T&R
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25X16VZPIG T&R.pdf
Description:
IC FLASH 16MBIT SPI 75MHZ 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,323

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Product details

Overview

W25X16VZPIG T&R from Winbond is a 16 M-bit (2 MB) serial flash memory IC with uniform 4 KB sectors and dual-output SPI interface, operating from 2.7 V to 3.6 V, supporting up to 75 MHz clock and 150 Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.

For engineers reviewing the W25X16VZPIG T&R datasheet, W25X16VZPIG T&R pinout, W25X16VZPIG T&R application, or W25X16VZPIG T&R equivalent, key selection criteria include sector-level erase granularity, hardware/software write protection via /WP and status register, SOIC-208 and WSON-6x5-mm package compatibility, and SPI Mode 0/3 interoperability with microcontroller host interfaces.

Technical Context

The W25X16VZPIG T&R implements a standard SPI-compatible bus with four signal lines (CLK, /CS, DIO, DO) and supports both single-output and dual-output read modes. Its internal architecture features an 8,192-page array (256 bytes/page), 512 erasable 4 KB sectors, and programmable block protect bits (BP2–BP0) with top/bottom selection (TB bit).

It integrates hardware write protection via active-low /WP pin and software-controlled protection through Status Register bits SRP, BP2–BP0, and TB - enabling selective memory locking without firmware intervention. The device enters high-impedance DO state during /HOLD assertion while /CS remains low, allowing SPI bus sharing with other peripherals.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages
ArchitectureUniform 4 KB sectors (512 total) and 32 × 64 KB blocks
SPI InterfaceStandard and dual-output SPI (Fast Read Dual Output 3Bh), compatible with Modes 0 and 3
Max Clock Frequency75 MHz - enables 150 Mbps effective throughput in dual-output mode
Write/Erase Endurance100,000 program/erase cycles per sector
Data Retention20 years at +25°C, guaranteed over industrial temperature range
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Power Consumption5 mA active current (typ), 1 µA power-down current (typ)

Pinout & Package

W25X16VZPIG T&R is supplied in an 8-pin WSON 6×5 mm package (Winbond package code ZP), with exposed pad for thermal dissipation and surface-mount compatibility.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable: drives DO to high-Z when high; required low-to-high transition before instruction acceptance after power-up
DOSerial Data OutputSingle-bit output pin; shifts data on falling CLK edge; becomes high-Z during /HOLD or when /CS is high
/WPWrite Protect InputActive-low hardware lock: disables Status Register writes when SRP=1 and /WP=low
GNDGround ReferencePrimary return path for all I/O and core circuitry; must be low-impedance for noise immunity
DIOSerial Data I/OBidirectional pin: inputs instructions/addresses on rising CLK edge; outputs data during Fast Read Dual Output (3Bh)
CLKSerial Clock InputMaster-synchronized timing source; supports Modes 0 (CLK idle low) and 3 (CLK idle high)
/HOLDHold InputActive-low pause control: suspends ongoing operations while /CS remains low; preserves internal state for resumption
VCCPower Supply2.7–3.6 V supply; includes internal voltage monitoring for reset and write-inhibit during brown-out

Key Features

FeatureDesign Value
Dual-output SPI read modeEnables 150 Mbps throughput using Fast Read Dual Output (3Bh), doubling standard SPI bandwidth for rapid code shadowing
Hardware + software write protectionCombines /WP pin control with non-volatile status register bits (SRP, BP2–BP0, TB) to lock specific 4 KB sectors or full array
Flexible erase granularitySupports page (256 B), sector (4 KB), block (64 KB), and chip-wide erase - critical for firmware update and data logging applications
Low-power operation1 µA typical standby current and automatic power-down entry reduce system-level energy consumption in battery-powered devices
HOLD function for multi-peripheral SPI sharingPauses active transfers without resetting internal state, enabling deterministic arbitration when SPI bus is shared with sensors or displays
JEDEC-compliant identificationSupports Manufacturer ID (90h) and JEDEC ID (9Fh) commands for automated BOM verification and field firmware validation

Applications

Boot Code StorageFirmware Update Storage

Use Scenario: Storing boot loader and initial firmware image executed directly from flash or copied to RAM at power-on.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read capability via Fast Read Dual Output (3Bh) to minimize boot latency.

Use Value: Reduces boot time by enabling 150 Mbps read rates - comparable to parallel flash - while occupying minimal PCB area and pin count.

Use Scenario: Holding field-upgradable firmware images in embedded gateways, IoT nodes, and industrial controllers.

IC Role / Device Role / Timing Role: Sector-erasable storage for atomic firmware updates, leveraging 4 KB sector boundaries to isolate new version from active runtime code.

Use Value: Enables safe over-the-air (OTA) updates with rollback capability, using hardware /WP and status register protection to prevent corruption during power loss.

Configuration Parameter StorageAudio/Data Logging Buffer

Use Scenario: Persisting calibration data, network settings, and user preferences across power cycles in medical and test equipment.

IC Role / Device Role / Timing Role: Small-sector (4 KB) non-volatile storage accessed infrequently but requiring high reliability and long retention.

Use Value: 20-year data retention and 100,000 erase cycles ensure parameter integrity over product lifetime without wear leveling overhead.

Use Scenario: Capturing sensor telemetry or voice snippets in portable diagnostics tools and environmental monitors.

IC Role / Device Role / Timing Role: Cyclic buffer implemented across multiple 4 KB sectors, erased and rewritten in round-robin fashion.

Use Value: Uniform sector size simplifies firmware management of circular logs; low 1 µA power-down current extends battery life between sampling intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT25DF161-SSHN-B16 M-bit SPI flash; supports 85 MHz max clock but lacks dual-output mode; uses different status register layout and command setRequires firmware adaptation for erase/write sequences and status polling; no Fast Read Dual Output accelerationChoose when legacy Atmel toolchain support or extended temperature grade (-40°C to +105°C) is required
S25FL132K0XMFI01016 M-bit Quad SPI flash; supports x4 I/O mode (up to 80 MHz), deeper security registers, and configurable dummy cyclesDelivers higher bandwidth than W25X16VZPIG T&R in quad mode but requires QSPI-capable host controllerChoose when migrating to QSPI interface or needing enhanced security features like secure OTP memory

Compared with AT25DF161-SSHN-B and S25FL132K0XMFI010, the W25X16VZPIG T&R offers optimal balance of dual-output speed, simple SPI compatibility, and proven integration in cost-sensitive 3.3 V microcontroller designs - without requiring QSPI hardware or requalification for legacy command sets.

Availability

W25X16VZPIG T&R is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and configuration parameter storage requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for W25X16VZPIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including NOR/NAND flash, SRAM, and mobile DRAM.

The W25X series was designed for embedded systems requiring compact, low-power, high-reliability serial flash - targeting code execution, firmware storage, and data logging in consumer, industrial, and networking applications.

FAQ

What is the maximum SPI clock frequency supported by the W25X16VZPIG T&R?

The W25X16VZPIG T&R supports SPI clock frequencies up to 75 MHz in standard and dual-output modes. This allows 150 Mbps effective data transfer using the Fast Read Dual Output (3Bh) instruction. Timing compliance depends on meeting AC electrical specifications including tV, tVH, and tCHZ as defined in the datasheet's AC Characteristics table.

Does the W25X16VZPIG T&R support Quad SPI (QSPI) interface?

No, the W25X16VZPIG T&R does not support Quad SPI. It implements a standard 4-wire SPI interface with optional dual-output capability (using DIO and DO simultaneously during Fast Read Dual Output). QSPI functionality requires separate devices such as Winbond's W25Q series or Cypress/Infineon's S25FL family.

What package type does W25X16VZPIG T&R use, and is it lead-free?

The W25X16VZPIG T&R uses an 8-contact WSON 6×5 mm package (Winbond package code ZP) with exposed thermal pad. It is RoHS-compliant and lead-free, as confirmed by Winbond's material declarations and packaging specification documents dated March 2007 and later revisions.

How many erase cycles can the W25X16VZPIG T&R endure per sector?

The W25X16VZPIG T&R guarantees 100,000 program/erase cycles per 4 KB sector. This endurance rating applies under specified operating conditions (2.7–3.6 V, -40°C to +85°C) and assumes proper command sequencing, voltage stability, and adherence to timing parameters during erase and program operations.

Can the W25X16VZPIG T&R be used with SPI Mode 3 (CPOL=1, CPHA=1)?

Yes, the W25X16VZPIG T&R fully supports SPI Mode 3 (CPOL=1, CPHA=1) in addition to Mode 0. Data on the DIO pin is sampled on the rising edge of CLK, and data on DO and DIO is clocked out on the falling edge - consistent across both modes. No hardware or firmware modification is needed to switch between them.

W25X16VZPIG T&R Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x5)

W25X16VZPIG T&R FAQ

1.How can I place an order for W25X16VZPIG T&R through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X16VZPIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X16VZPIG T&R reliable?

The price and inventory of W25X16VZPIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X16VZPIG T&R is usually 5 days.

3.What payment methods are accepted for W25X16VZPIG T&R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X16VZPIG T&R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X16VZPIG T&R?

W25X16VZPIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X16VZPIG T&R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X16VZPIG T&R?

For technical support, including W25X16VZPIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X16VZPIG T&R requirements.

6.How does Aetrix verify that W25X16VZPIG T&R is sourced from the original manufacturer or authorized distributors?

All W25X16VZPIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X16VZPIG T&R meets industry standards.

7.What is the process for return or replacement of W25X16VZPIG T&R?

All W25X16VZPIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25X16VZPIG T&R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X16VZPIG T&R part is unused and in its original packaging.

Return procedure for W25X16VZPIG T&R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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