My Inquiry
My Account
Winbond Electronics Corporation W25X32VSSIG
- Part No.:
- W25X32VSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X32VSSIG.pdf
- Description:
- IC FLASH 32MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,578
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25X32VSSIG from Winbond is a 32M-bit (4MB) serial NOR flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), widely used in code storage and firmware boot applications for microcontrollers.
For engineers reviewing the W25X32VSSIG datasheet, W25X32VSSIG pinout, W25X32VSSIG application, or W25X32VSSIG equivalent, key selection criteria include sector erase granularity (4KB), hardware/software write protection (/WP pin + status register BP/TB bits), SOIC-8 208-mil package compatibility, and SPI Mode 0/3 support with hold functionality.
Technical Context
The W25X32VSSIG implements a standard SPI-compatible 4-wire interface (CLK, /CS, DIO, DO) with optional /HOLD and /WP control lines, supporting both single-output and dual-output read modes. Its internal architecture organizes memory into 16,384 pages of 256 bytes each, grouped into 1,024 erasable 4KB sectors and 64 erasable 64KB blocks.
It features a programmable status register with Block Protect (BP2–BP0), Top/Bottom (TB), and Status Register Protect (SRP) bits enabling flexible hardware- and software-based memory protection. The device supports JEDEC-standard manufacturer/device ID (9Fh), auto-increment read, and power-down mode with 1µA typical standby current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4 MB) - provides sufficient space for firmware images, configuration data, and bootloader code in resource-constrained embedded systems. |
| Organization | 16,384 × 256-byte pages - enables efficient page-level programming with ≤2ms latency per 256-byte write. |
| Sector Size | Uniform 4 KB sectors (1,024 total) - allows fine-grained data updates without erasing larger memory regions. |
| Max Clock Frequency | 75 MHz - enables high-speed instruction execution and fast read throughput in time-critical boot sequences. |
| Data Transfer Rate | 150 Mbps (dual-output Fast Read) - matches performance of parallel flash in SPI-limited designs, reducing bus contention. |
| Write Endurance | 100,000 program/erase cycles - ensures long-term reliability for field-updatable firmware and logging applications. |
| Data Retention | 20 years - guarantees non-volatile data integrity across product lifecycle without refresh. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with common 3.3V logic domains and low-power MCU supply rails. |
Pinout & Package
W25X32VSSIG is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.3 mm × 5.3 mm. This industrial-grade surface-mount package supports reflow soldering and is compatible with standard PCB assembly processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable signal; must transition high→low before instruction acceptance; controls device power state (standby vs active). |
| 2 DO | Data Output | Serial output for standard SPI reads and status register access; outputs on CLK falling edge. |
| 3 /WP | Write Protect Input | Hardware lock for status register writes when SRP=1; prevents accidental configuration changes during system operation. |
| 4 GND | Ground Reference | Primary return path for all I/O and core circuitry; requires low-impedance connection to minimize noise coupling. |
| 5 DIO | Data Input/Output | Bidirectional serial data line; inputs instructions/addresses on CLK rising edge; outputs data during Fast Read Dual Output (3Bh). |
| 6 CLK | Serial Clock Input | Master-generated timing signal; supports SPI Modes 0 and 3; defines data sampling (rising edge) and output (falling edge) edges. |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction while /CS remains low; enables multi-device bus sharing without losing internal state. |
| 8 VCC | Power Supply | Single 2.7–3.6V supply; powers core logic, memory array, and I/O buffers; requires local decoupling capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI Interface | Enables 150 Mbps read throughput using Fast Read Dual Output (3Bh), doubling bandwidth over standard SPI for faster code shadowing. |
| Flexible Write Protection | Combines hardware (/WP pin) and software (status register BP/TB/SRP bits) to protect arbitrary 4KB sectors or full array, preventing corruption during power transitions. |
| Uniform 4KB Sector Architecture | Allows precise erasure of parameter storage or firmware segments without affecting adjacent code, improving update safety and wear leveling efficiency. |
| Low-Power Operation | 5 mA active current and 1 µA power-down current reduce system-level power budget impact, critical for battery-powered IoT endpoints. |
| JEDEC Standard Identification | Supports 9Fh (JEDEC ID) and 90h (Manufacturer/Device ID) commands for automated BOM verification and firmware compatibility checks. |
| HOLD Functionality | Permits interruption and resumption of SPI transactions without resetting internal state-essential for real-time systems sharing SPI buses with sensors or displays. |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
Use Scenario: Storing primary bootloader and application firmware executed directly from flash or copied to RAM at startup. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic read latency and SPI-mode compatibility for ARM Cortex-M and RISC-V MCUs. Use Value: Enables reliable cold-boot within milliseconds using Fast Read Dual Output (3Bh), eliminating need for external parallel flash or RAM preloading. | Use Scenario: Holding signed firmware images and delta patches for secure over-the-air (OTA) updates in connected devices. IC Role / Device Role / Timing Role: Secure, field-updatable storage partition with hardware write protection to prevent rollback or corruption during update failure. Use Value: 4KB sector granularity allows atomic patch application; 100K-cycle endurance supports frequent updates over 10+ years of service life. |
| Configuration Parameter Storage | Audio/Data Logging Buffer |
Use Scenario: Retaining calibration data, network credentials, and user preferences across power cycles in industrial controllers. IC Role / Device Role / Timing Role: Persistent parameter store accessed via SPI during initialization or runtime; protected by /WP and status register BP bits. Use Value: Hardware write lock prevents accidental overwrite during brown-out events; 20-year retention ensures data integrity across product lifetime. | Use Scenario: Capturing sensor telemetry or voice snippets in edge nodes where SD cards are impractical due to size or reliability constraints. IC Role / Device Role / Timing Role: Circular buffer implemented across multiple 4KB sectors, erased and rewritten using sector-erase command (20h). Use Value: Uniform sector size simplifies wear leveling algorithms; 150 Mbps read speed enables rapid post-acquisition data retrieval for analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3206EM2I-12G | 32M-bit, SOIC-8 208-mil, 85°C rating, supports 104MHz Quad SPI (QPI) but not dual-output SPI; no /HOLD pin. | Higher bandwidth via QPI, but lacks HOLD functionality and uses different instruction set; requires firmware driver update. | Select when maximum read speed is critical and quad interface is supported; avoid if HOLD or legacy dual-output SPI is required. |
| S25FL032P0XMFI001 | 32M-bit, SOIC-16 300-mil, supports 104MHz Quad SPI and 66MHz dual SPI; includes configurable reset pin and deeper power-down mode. | Larger footprint and different pinout; adds reset control and enhanced security features (secure boot support); higher cost. | Select for automotive or security-sensitive applications requiring reset supervision and secure boot; avoid for space-constrained SOIC-8 layouts. |
Compared with MX25L3206EM2I-12G and S25FL032P0XMFI001, the W25X32VSSIG offers proven dual-output SPI compatibility, compact SOIC-8 footprint, and integrated /HOLD functionality-making it optimal for cost-sensitive, space-constrained embedded designs requiring deterministic interruptible SPI access.
Availability
W25X32VSSIG is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and configuration parameter storage requiring stable component supply, long-term lifecycle support, and industrial temperature range (-40°C to +85°C) compliance.
Supply support for W25X32VSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage products for embedded and consumer markets.
The W25X series was designed specifically for cost-effective, low-pin-count code and data storage in microcontroller-based systems, emphasizing SPI compatibility, sector flexibility, and robust write protection for industrial and networking applications.
FAQ
What is the maximum SPI clock frequency supported by the W25X32VSSIG?
The W25X32VSSIG supports a maximum SPI clock frequency of 75 MHz for standard and dual-output operations. When using the Fast Read Dual Output instruction (3Bh), this enables an effective data rate of 150 Mbps. This specification is validated across the full industrial temperature range (-40°C to +85°C) and 2.7–3.6V supply voltage.
Does the W25X32VSSIG support both SPI Mode 0 and Mode 3?
Yes, the W25X32VSSIG supports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). Data is sampled on the rising edge of CLK in both modes, and output on the falling edge. This dual-mode compatibility ensures interoperability with a wide range of microcontroller SPI peripherals without requiring hardware or firmware modification.
How many 4KB sectors does the W25X32VSSIG contain?
The W25X32VSSIG contains exactly 1,024 uniform 4KB sectors, totaling 4 MB of addressable memory space. Each sector can be independently erased using the Sector Erase instruction (20h), and the sector map is fixed and non-reconfigurable-enabling predictable wear leveling and deterministic update boundaries in firmware design.
Can the W25X32VSSIG be used with a 1.8V I/O interface?
No, the W25X32VSSIG is specified only for 2.7V to 3.6V operation and is not 1.8V I/O compatible. Its input thresholds and output drive levels are designed for 3.3V logic families. Using it with 1.8V signals may result in unreliable communication or damage; level-shifting circuitry is required for interfacing with 1.8V hosts.
What is the purpose of the /HOLD pin on the W25X32VSSIG?
The /HOLD pin on the W25X32VSSIG allows an active SPI transaction to be paused while /CS remains low, placing DO in high-impedance and ignoring DIO/CLK activity. This enables safe time-sharing of the SPI bus among multiple peripherals without aborting or restarting operations-critical for real-time systems managing concurrent sensor and memory access.
W25X32VSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X32VSSIG FAQ
1.How can I place an order for W25X32VSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X32VSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X32VSSIG reliable?
The price and inventory of W25X32VSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X32VSSIG is usually 5 days.
3.What payment methods are accepted for W25X32VSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X32VSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X32VSSIG?
W25X32VSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X32VSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X32VSSIG?
For technical support, including W25X32VSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X32VSSIG requirements.
6.How does Aetrix verify that W25X32VSSIG is sourced from the original manufacturer or authorized distributors?
All W25X32VSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X32VSSIG meets industry standards.
7.What is the process for return or replacement of W25X32VSSIG?
All W25X32VSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X32VSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X32VSSIG part is unused and in its original packaging.
Return procedure for W25X32VSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25X32VSSIG Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
