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Winbond Electronics Corporation W25X40AVSSIG
- Part No.:
- W25X40AVSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X40AVSSIG.pdf
- Description:
- IC FLASH 4MBIT SPI 100MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,877
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Product details
Overview
W25X40AVSSIG from Winbond is a 4M-bit (512KB) serial NOR flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating at 2.7–3.6V, supporting up to 100MHz clock and 200Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X40AVSSIG datasheet, W25X40AVSSIG pinout, W25X40AVSSIG application, or W25X40AVSSIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware/software write protection (/WP pin + BP bits), SOIC-208-mil package compatibility, and JEDEC ID (EFh/3013h) verification.
Technical Context
The W25X40AVSSIG implements a standard SPI bus (Modes 0 and 3) with four dedicated pins (CLK, /CS, DIO, DO) and supports dual-output read mode using the 3Bh instruction, where DIO functions as a second output during data transfer-enabling 2× throughput versus single-output SPI. It features a 2048-page array (256 bytes/page), organized into 128 erasable 4KB sectors and 8 erasable 64KB blocks.
Write protection combines hardware control (/WP pin active-low) and software configuration (Status Register BP2–BP0, TB, SRP bits), allowing top/bottom array locking and status register write disable when /WP is low and SRP=1. The device enters power-down mode (1µA typical) via B9h instruction and resumes via ABh.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 4 M-bit (524,288 bytes), organized as 2048 × 256-byte pages |
| Architecture | Uniform 4KB sectors (128 total) and 64KB blocks (8 total) |
| SPI interface | Standard SPI Modes 0/3 + Dual Output mode (3Bh instruction) |
| Max clock frequency | 100 MHz; enables 200 Mbps effective read rate in dual-output mode |
| Supply voltage | 2.7 V to 3.6 V - compatible with 3.3V logic systems without level shifting |
| Endurance & retention | ≥100,000 program/erase cycles; ≥20 years data retention at +25°C |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded applications |
Pinout & Package
W25X40AVSSIG is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.33 mm × 5.33 mm. Pin 1 marked with notch or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select input | Active-low enable; must transition high→low before instruction acceptance; controls DO high-impedance state |
| 2 DO | Data Output | Serial data output pin; outputs data on CLK falling edge; high-Z when /CS high or /HOLD active |
| 3 /WP | Write Protect input | Hardware lock for Status Register writes when SRP=1; active-low, requires external pull-up |
| 4 GND | Ground reference | Primary return path for VCC and all I/O signals; must be low-impedance connection |
| 5 DIO | Data Input/Output | Bi-directional SPI data line; inputs instructions/addresses on CLK rising edge; outputs data during Fast Read Dual Output |
| 6 CLK | Serial Clock input | Timing reference for all SPI transfers; supports 100 MHz max; idle state depends on SPI mode (0 or 3) |
| 7 /HOLD | Hold input | Pauses ongoing SPI operation while /CS remains low; enables multi-device bus sharing without reset |
| 8 VCC | Power supply | 2.7–3.6 V supply; internal voltage regulator ensures stable core operation across range |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI (3Bh) | Enables 200 Mbps read throughput by using DIO as secondary output - critical for fast code shadowing at boot |
| 4KB uniform sectors | Allows fine-grained firmware updates and parameter storage without erasing full 64KB blocks - reduces wear and improves OTA update efficiency |
| Hardware + software write protection | /WP pin + SRP/BP bits provide layered defense against accidental writes - essential for bootloader and calibration data integrity |
| Power-down mode (B9h) | Reduces current to 1 µA typical - extends battery life in always-on IoT nodes and portable devices |
| JEDEC-compliant ID (EFh/3013h) | Enables automated flash detection and configuration in bootloader firmware - eliminates hard-coded device assumptions |
Applications
| Industrial HMI Display | Medical Sensor Node |
|---|---|
Use Scenario: Storing GUI assets, font tables, and firmware patches in a panel-mounted touchscreen controller with limited PCB area. IC Role / Device Role / Timing Role: Non-volatile code and resource storage; accessed via SPI during boot and runtime asset loading. Use Value: 4KB sector erase enables incremental UI updates without full reflash; SOIC-208-mil footprint fits dense industrial layouts. | Use Scenario: Retaining calibrated sensor coefficients and patient history logs in a battery-powered wearable vital signs monitor. IC Role / Device Role / Timing Role: Parameter and event log storage; accessed intermittently during data acquisition and sync cycles. Use Value: Hardware write protection (/WP) prevents corruption during brown-out events; 20-year retention ensures long-term clinical data validity. |
| Automotive Body Control Module | Smart Home Gateway |
Use Scenario: Holding configuration profiles, lighting sequences, and diagnostic fault codes in a LIN-connected BCM with strict EMI constraints. IC Role / Device Role / Timing Role: Configuration and diagnostics storage; read during startup and written only during service-mode programming. Use Value: Dual Output SPI reduces bus occupancy time - lowers electromagnetic emissions during firmware reads near sensitive analog circuits. | Use Scenario: Storing Wi-Fi credentials, OTA update images, and Zigbee mesh keys in a multi-radio residential gateway with thermal limits. IC Role / Device Role / Timing Role: Secure, persistent storage for connectivity metadata and firmware binaries; accessed via MCU's SPI peripheral. Use Value: Power-down mode (1 µA) minimizes standby current - critical for Energy Star compliance and fanless enclosure thermal design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSH-T | 4 M-bit, SOIC-8 208-mil, supports Dual SPI but no Quad mode; 85 MHz max clock; 2.7–3.6 V | Lacks Fast Read Dual Output (3Bh); uses different instruction set (e.g., 35h for status read) | Choose if legacy Atmel toolchain support is required; verify timing margins at 85 MHz vs. W25X40AVSSIG's 100 MHz |
| S25FL004A0XMFI010 | 4 M-bit, SOIC-8 208-mil, supports Dual and Quad SPI; 66 MHz max clock; 2.7–3.6 V; includes SFDP | Supports Quad mode (3-line I/O) and SFDP for auto-configuration; slower max clock limits peak bandwidth | Prefer for future-proof designs needing Quad SPI scalability; accept lower speed if SFDP-based initialization is prioritized |
Compared with AT25DF041A-SSH-T and S25FL004A0XMFI010, the W25X40AVSSIG delivers higher read bandwidth (200 Mbps vs. ≤170 Mbps), tighter timing for fast boot sequences, and simpler dual-output implementation - making it optimal for latency-sensitive embedded firmware execution.
Availability
W25X40AVSSIG is available at Aetrix Electronics and suitable for industrial HMIs, medical sensor nodes, automotive body control modules, smart home gateways, and battery-powered IoT endpoints requiring stable component supply across extended product lifecycles.
Supply support for W25X40AVSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded and consumer applications.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems requiring reliable code storage, fast read access, and robust write protection - targeting industrial control, medical devices, and automotive subsystems.
FAQ
What is the JEDEC manufacturer and device ID for W25X40AVSSIG?
The W25X40AVSSIG reports Manufacturer ID = EFh (Winbond) and Device ID = 3013h via the Release Power-down / Device ID (ABh) and JEDEC ID (9Fh) instructions. This ID pair is unique to the W25X40A family and distinguishes it from W25X10A (3011h), W25X20A (3012h), and W25X80A (3014h). Confirming these IDs during system initialization ensures correct driver binding and avoids misconfiguration in multi-flash designs.
Does W25X40AVSSIG support Quad SPI mode?
No, the W25X40AVSSIG does not support Quad SPI mode. It supports standard SPI (single I/O) and Dual Output SPI (3Bh instruction), where DIO serves as a second data output during reads. Quad SPI capability requires four I/O lines and is not implemented in the W25X40AVSSIG's pinout or instruction set - confirmed by the absence of 4-line instructions (e.g., 6Bh, EBh) in its datasheet. Use W25Q40 or S25FL004A for Quad SPI needs.
What is the maximum allowable clock frequency for W25X40AVSSIG in Fast Read Dual Output mode?
The W25X40AVSSIG supports up to 100 MHz SPI clock frequency in Fast Read Dual Output (3Bh) mode, enabling 200 Mbps effective data throughput (two bits per clock cycle). This is specified in Section 11.6 AC Electrical Characteristics and validated across the full −40°C to +85°C operating range. Exceeding 100 MHz may cause setup/hold violations on DIO/DO outputs and is not guaranteed by Winbond's characterization.
How is hardware write protection enabled on W25X40AVSSIG?
Hardware write protection on W25X40AVSSIG is enabled by pulling the /WP pin low *and* setting the Status Register Protect (SRP) bit to 1. When both conditions are met, the Write Status Register instruction (01h) is locked out, preventing modification of block protect bits (BP2–BP0) and TB. The /WP pin must be externally pulled low (e.g., via resistor to GND); floating or high /WP disables hardware lock regardless of SRP state. This dual-condition mechanism prevents accidental protection activation.
What package type does the 'VSSIG' suffix indicate for W25X40AVSSIG?
The 'VSSIG' suffix in W25X40AVSSIG denotes an 8-pin SOIC package with 208-mil width (package code SS), industrial temperature grade (−40°C to +85°C), and lead-free, RoHS-compliant finish. This matches Winbond's ordering convention where 'V' = lead-free, 'SS' = SOIC 208-mil, and 'IG' = industrial grade. It is distinct from 'SN' (SOIC 150-mil) and 'ZP' (WSON 6x5-mm) variants of the same W25X40A die.
W25X40AVSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X40AVSSIG FAQ
1.How can I place an order for W25X40AVSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40AVSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40AVSSIG reliable?
The price and inventory of W25X40AVSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40AVSSIG is usually 5 days.
3.What payment methods are accepted for W25X40AVSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40AVSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40AVSSIG?
W25X40AVSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40AVSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40AVSSIG?
For technical support, including W25X40AVSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40AVSSIG requirements.
6.How does Aetrix verify that W25X40AVSSIG is sourced from the original manufacturer or authorized distributors?
All W25X40AVSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40AVSSIG meets industry standards.
7.What is the process for return or replacement of W25X40AVSSIG?
All W25X40AVSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40AVSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40AVSSIG part is unused and in its original packaging.
Return procedure for W25X40AVSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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