Winbond Electronics Corporation W25X40AVZPIG
- Part No.:
- W25X40AVZPIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X40AVZPIG.pdf
- Description:
- IC FLASH 4MBIT SPI 100MHZ 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:4,183
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Product details
Overview
W25X40AVZPIG from Winbond is a 4M-bit (512KB) serial flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating at 2.7–3.6V, supporting up to 100MHz clock and 200Mbps data transfer via Fast Read Dual Output (3Bh), widely used in firmware storage for microcontroller boot code and parameter retention in industrial controllers.
For engineers reviewing the W25X40AVZPIG datasheet, W25X40AVZPIG pinout, W25X40AVZPIG application, or W25X40AVZPIG equivalent, key selection criteria include sector erase granularity (4KB), hardware write protection via /WP pin, JEDEC ID compatibility (EFh/3013h), and WSON-8 (6×5mm) package suitability for space-constrained PCB layouts.
Technical Context
The W25X40AVZPIG implements a standard SPI bus (Modes 0 and 3) with dedicated DO and bidirectional DIO pins, enabling both single-output and dual-output read modes. Its internal architecture includes a 2048-page array (256 bytes/page), 128 erasable 4KB sectors, and 8 erasable 64KB blocks - all managed via status register-controlled protection (BP2–BP0, TB, SRP).
It supports full instruction set compliance including Page Program (02h), Sector Erase (20h), Block Erase (D8h), Chip Erase (C7h), and Power-down (B9h), with BUSY flag monitoring and automatic WEL clearing after program/erase completion. The /HOLD pin enables SPI bus arbitration without interrupting ongoing operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 M-bit (524,288 bytes), organized as 2048 × 256-byte pages |
| Architecture | Uniform 4KB sectors (128 total) and 64KB blocks (8 total) for flexible data partitioning |
| SPI Interface | Dual-output capable (Fast Read Dual Output 3Bh); supports Modes 0 and 3; CLK up to 100 MHz |
| Write/Erase Endurance | ≥100,000 program/erase cycles per sector |
| Data Retention | ≥20 years at +25°C, verified under JEDEC JESD22-A117 |
| Supply Voltage | 2.7 V to 3.6 V; active current ≤5 mA (typ), power-down current ≤1 µA (typ) |
| Operating Temp | –40°C to +85°C industrial grade temperature range |
Pinout & Package
W25X40AVZPIG is packaged in an 8-pad WSON (6 mm × 5 mm, package code ZP), lead-free and RoHS-compliant, with wettable flank side terminals for automated optical inspection (AOI) and improved solder joint reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low before instruction acceptance; tracks VCC at power-up |
| DO | Serial Data Output | Unidirectional output; data shifted out on CLK falling edge; high-Z when /CS high or /HOLD active |
| /WP | Write Protect Input | Hardware lock for status register writes when SRP=1; active-low; enables top/bottom array protection |
| GND | Ground Reference | Primary return path for VCC and I/O signals; requires low-impedance PCB plane connection |
| DIO | Serial Data I/O | Bidirectional SPI data line; latches input on CLK rising edge; outputs dual-bit data during 3Bh instruction |
| CLK | Serial Clock Input | Master-generated timing signal; defines setup/hold windows; supports 100 MHz max frequency |
| /HOLD | Hold Control Input | Pauses active SPI transaction without resetting internal state; enables multi-device bus sharing |
| VCC | Power Supply | 2.7–3.6 V supply; requires local 100 nF ceramic decoupling capacitor placed within 5 mm |
Key Features
| Feature | Design Value |
|---|---|
| Dual-output read mode | Enables 200 Mbps effective throughput using Fast Read Dual Output (3Bh), doubling standard SPI bandwidth for boot code shadowing |
| Hardware write protection | Combines /WP pin with SRP and BP bits to lock status register and protect defined memory regions against accidental overwrite |
| Flexible erase granularity | Independent 4KB sector erase (20h) and 64KB block erase (D8h) allow selective firmware updates without full chip erase |
| JEDEC-compliant identification | Returns Manufacturer ID EFh and Device ID 3013h via ABh/90h/9Fh instructions - ensures interoperability with standard flash programming tools |
| Low-power operation | 1 µA typical power-down current enables battery-backed retention in always-on embedded systems |
Applications
| Firmware Storage | Industrial Parameter Logging |
|---|---|
|
Use Scenario: Storing bootloader and application firmware for ARM Cortex-M microcontrollers in factory automation PLCs. IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read access; supports XIP-capable dual-output reads for zero-wait-state execution from RAM. Use Value: 4KB sector granularity allows over-the-air (OTA) firmware patching without disrupting operational code sections. |
Use Scenario: Recording sensor calibration coefficients and runtime configuration parameters in HVAC control units. IC Role / Device Role / Timing Role: Parameter EEPROM replacement; uses page-program (02h) and sector-erase (20h) for infrequent but reliable non-volatile writes. Use Value: Hardware /WP pin + SRP bit prevents corruption during brown-out events, ensuring parameter integrity across power cycles. |
| Consumer Device Configuration | Medical Diagnostic Instrument Boot |
|
Use Scenario: Holding user preferences and display settings in smart thermostats with limited board space. IC Role / Device Role / Timing Role: Compact configuration store; leverages WSON-8 (6×5mm) footprint and 2.7–3.6V operation compatible with Li-ion backup rails. Use Value: 20-year data retention meets consumer product lifecycle requirements without periodic refresh. |
Use Scenario: Secure boot image storage in portable ultrasound devices requiring FDA-compliant firmware traceability. IC Role / Device Role / Timing Role: Certified boot memory; uses JEDEC ID (EFh/3013h) and status register read (05h) for pre-boot authenticity verification. Use Value: Dual-output read reduces boot time by >40% vs. standard SPI, accelerating device readiness for clinical use. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSH-T | 4 M-bit SPI flash; supports only single-output reads (no dual-output mode); max CLK = 85 MHz | Lacks Fast Read Dual Output (3Bh), limiting boot speed in XIP-critical designs | Choose when cost sensitivity outweighs bandwidth needs and /HOLD functionality is unused |
| MX25L4005AM2I-12G | 4 M-bit SPI flash; supports dual-output (3Bh); 100 MHz CLK; but requires 2.3–3.6 V supply | Wider VCC range enables direct integration with 2.5 V logic domains; identical pinout and instruction set | Select for mixed-voltage systems where 2.7 V minimum is not guaranteed |
Compared with W25X40AVZPIG, AT25DF041A-SSH-T trades dual-output performance for lower unit cost and simpler timing margins, while MX25L4005AM2I-12G matches bandwidth and adds 2.3 V compatibility - making it suitable for legacy 2.5 V controller interfaces without level-shifting.
Availability
W25X40AVZPIG is available at Aetrix Electronics and suitable for industrial control firmware storage, medical device boot code retention, and consumer electronics configuration management requiring stable component supply across multi-year production cycles.
Supply support for W25X40AVZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND flash, SRAM, and mobile DRAM, serving automotive, industrial, and communications markets since 1987.
The W25X series was designed specifically for embedded systems requiring high-reliability, low-pin-count serial flash with enhanced security features like hardware write protection and JEDEC-standard identification - targeting MCU-based applications with strict space and power constraints.
FAQ
What is the memory organization of the W25X40AVZPIG?
The W25X40AVZPIG contains 4 M-bit (524,288 bytes) of flash memory, organized into 2048 programmable pages of 256 bytes each, 128 uniform 4KB sectors, and 8 erasable 64KB blocks. This structure enables precise firmware updates and robust data partitioning in resource-constrained embedded systems. Each sector can be independently erased using the 20h instruction, and the device supports page programming of up to 256 bytes per operation.
Does the W25X40AVZPIG support dual-output SPI reads?
Yes, the W25X40AVZPIG supports dual-output SPI reads via the Fast Read Dual Output instruction (3Bh), which uses both DIO and DO pins simultaneously to deliver 2 bits per clock cycle - achieving up to 200 Mbps effective throughput at 100 MHz CLK. This capability significantly accelerates boot code loading and firmware shadowing compared to standard single-output SPI, and is fully compliant with JEDEC JESD216 standards for serial flash interoperability.
How does hardware write protection work on the W25X40AVZPIG?
Hardware write protection on the W25X40AVZPIG combines the /WP pin with Status Register bits SRP, BP2–BP0, and TB. When SRP = 1 and /WP is low, writes to the status register are disabled. BP2–BP0 and TB define protected address ranges (top or bottom), allowing selective locking of sectors or blocks. This dual-layer scheme prevents accidental firmware corruption during power transients or software faults - a critical requirement for industrial and medical applications where data integrity is non-negotiable.
What package type is used for the W25X40AVZPIG?
The W25X40AVZPIG uses an 8-pad WSON (6 mm × 5 mm) package with exposed pad and wettable flank side terminals (package code ZP). This RoHS-compliant, lead-free package supports automated optical inspection (AOI) and offers superior thermal dissipation and solder joint reliability versus SOIC variants. Its compact footprint makes it ideal for space-constrained PCBs in portable and IoT devices where board area is at a premium.
Is the W25X40AVZPIG compatible with standard SPI controllers?
Yes, the W25X40AVZPIG is fully compatible with standard SPI controllers supporting Modes 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). It uses four primary signals: /CS, CLK, DIO (bidirectional), and DO (unidirectional), with optional /HOLD and /WP for advanced control. All instructions follow JEDEC-standard opcodes (e.g., 03h for Read Data, 05h for Read Status Register), ensuring drop-in compatibility with existing flash programming tools and HAL drivers across ARM, RISC-V, and PIC platforms.
W25X40AVZPIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25X40AVZPIG FAQ
1.How can I place an order for W25X40AVZPIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40AVZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40AVZPIG reliable?
The price and inventory of W25X40AVZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40AVZPIG is usually 5 days.
3.What payment methods are accepted for W25X40AVZPIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40AVZPIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40AVZPIG?
W25X40AVZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40AVZPIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40AVZPIG?
For technical support, including W25X40AVZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40AVZPIG requirements.
6.How does Aetrix verify that W25X40AVZPIG is sourced from the original manufacturer or authorized distributors?
All W25X40AVZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40AVZPIG meets industry standards.
7.What is the process for return or replacement of W25X40AVZPIG?
All W25X40AVZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40AVZPIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40AVZPIG part is unused and in its original packaging.
Return procedure for W25X40AVZPIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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