My Inquiry
My Account
Winbond Electronics Corporation W25X40BVDAIG
- Part No.:
- W25X40BVDAIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
W25X40BVDAIG.pdf
- Description:
- IC FLASH 4MBIT SPI 104MHZ 8DIP
- Quantity:
- Payment:
- Shipping:
Inventory:2,160
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25X40BVDAIG from Winbond is a 4M-bit (512KB) serial flash memory IC supporting standard SPI, dual-output SPI, and dual I/O SPI interfaces. It features uniform 4KB sectors, 32KB and 64KB blocks, 104MHz clock operation, and operates from a single 2.7V–3.6V supply with 4mA active and 1µA power-down current. It is used in embedded boot code storage, firmware update storage, and parameter retention in space-constrained industrial controllers.
For engineers reviewing the W25X40BVDAIG datasheet, W25X40BVDAIG pinout, W25X40BVDAIG application, or W25X40BVDAIG equivalent, key selection considerations include sector granularity (4KB), dual I/O read throughput (208 Mbps), hardware write protection via /WP pin, and PDIP-300-mil package compatibility for through-hole prototyping and legacy board replacement.
Technical Context
The W25X40BVDAIG implements a SPI-compatible command set with support for Standard SPI (Mode 0/3), Fast Read Dual Output (3Bh), and Fast Read Dual I/O (BBh). Its internal architecture includes a 256-byte page buffer, status register with BP2–BP0 and TB bits for configurable top/bottom memory protection, and high-voltage generators for erase/program operations.
It supports four erase granularities - page program (≤256 bytes, <1ms), sector erase (4KB), 32KB block erase, and chip erase - with >100,000 program/erase cycles and >20-year data retention. The /HOLD pin enables bus arbitration in multi-device SPI systems without interrupting ongoing internal operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 M-bit (512 KB), organized as 2,048 × 256-byte programmable pages |
| Operating Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting |
| Max Clock Frequency | 104 MHz - enables 208 Mbps effective throughput using Fast Read Dual I/O |
| Erase Granularity | 4 KB sectors (32 total), 32 KB blocks (16), 64 KB blocks (8) - enables fine-grained firmware partitioning |
| Write Endurance | 100,000 program/erase cycles per sector - suitable for field-updatable firmware with infrequent writes |
| Data Retention | 20 years at +85°C - ensures long-term reliability in industrial temperature environments |
| Package Type | 8-pin PDIP, 300-mil width (package code DA) - supports through-hole mounting and socket-based validation |
Pinout & Package
W25X40BVDAIG is housed in an 8-pin PDIP (300-mil) package (package code DA), designed for through-hole assembly and legacy system compatibility. Pin assignments are identical across SOIC and WSON variants for functional interoperability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; places DO in high-impedance when deasserted; must track VCC at power-up |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Serial data output in standard SPI; becomes IO1 in dual I/O mode for simultaneous read/write |
| 3 /WP | Hardware Write Protect Input | Active-low pin that locks Status Register writes when SRP=1; enables robust hardware-based memory protection |
| 4 GND | Ground Reference | Primary return path for VCC and all I/O signals; requires low-impedance PCB connection |
| 5 DIO (IO0) | Data Input / Bidirectional I/O | Serial data input in standard SPI; becomes IO0 in dual I/O mode; supports both instruction and data transfer |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference; supports SPI Modes 0 and 3; max 104 MHz frequency |
| 7 /HOLD | Hold Control Input | Pauses ongoing SPI transaction while /CS remains low; enables bus sharing without data loss or restart |
| 8 VCC | Power Supply | Single 2.7–3.6 V supply; powers core logic, charge pumps, and I/O buffers |
Key Features
| Feature | Design Value |
|---|---|
| Dual I/O SPI Interface | Enables 208 Mbps read throughput using BBh instruction - eliminates need for parallel flash in cost-sensitive XIP applications |
| Uniform 4KB Sectors | Allows independent erasure of configuration partitions without disturbing boot code or calibration data stored elsewhere |
| Configurable Hardware Write Protection | Combines /WP pin with TB/BP bits to lock top or bottom memory regions - prevents accidental overwrite during field updates |
| Continuous Read Mode | Reduces instruction overhead to ≤8 clocks per address; supports true execute-in-place (XIP) for non-critical firmware |
| JEDEC ID & Unique ID Support | 9Fh (JEDEC), 90h/92h (manufacturer/device ID), 4Bh (unique 128-bit ID) - enables secure device authentication and BOM traceability |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code Retention |
|---|---|
Use Scenario: Storing boot loader and application firmware in DIN-rail mounted programmable logic controllers operating continuously at 60°C ambient. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable read performance and sector-level update isolation. Use Value: 4KB sector granularity allows patching communication stack without erasing safety-critical control logic; 20-year retention ensures firmware integrity over equipment lifetime. |
Use Scenario: Holding certified boot images and calibration parameters in portable ultrasound units requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware-enforced write lock during runtime. Use Value: /WP pin + TB/BP bits prevent unauthorized modification of regulatory-approved binaries; JEDEC ID enables audit-ready device lineage tracking. |
| Automotive Body Control Module (BCM) | Smart Energy Meter Parameter Storage |
Use Scenario: Storing lighting profiles, door lock configurations, and CAN gateway firmware in 12V automotive BCMs exposed to -40°C to +85°C thermal cycling. IC Role / Device Role / Timing Role: Temperature-stable, low-power flash for infrequently updated vehicle personalization data. Use Value: 1µA power-down current minimizes battery drain during vehicle sleep mode; -40°C to +85°C rating matches automotive under-hood requirements. |
Use Scenario: Retaining tariff tables, metering constants, and utility-specific security keys in ANSI C12.22-compliant smart meters deployed in outdoor enclosures. IC Role / Device Role / Timing Role: High-reliability, field-upgradable parameter store with cryptographic key isolation. Use Value: Independent 4KB sectors allow over-the-air updates to billing logic without affecting metrology calibration data; 100K-cycle endurance supports 10+ years of firmware revisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSH-T | 4 M-bit, 85 MHz max clock, SOIC-8 only; lacks dual I/O mode and continuous read mode | Lower read bandwidth limits XIP feasibility; no /HOLD pin reduces multi-device SPI flexibility | Choose if dual I/O and hold functionality are unnecessary and SOIC-8 footprint is mandatory |
| SST25VF040B-80-4I-SAE | 4 M-bit, 80 MHz max clock, supports standard SPI only; no dual I/O or fast read dual output | Read throughput capped at ~80 Mbps; no hardware top/bottom protection - relies solely on software BP bits | Prefer when cost sensitivity outweighs performance and protection requirements, and PDIP is not needed |
Compared with AT25DF041A-SSH-T and SST25VF040B-80-4I-SAE, the W25X40BVDAIG delivers higher read bandwidth (208 Mbps vs ≤80 Mbps), hardware-backed top/bottom memory locking, and PDIP-300-mil packaging - making it uniquely suited for legacy industrial designs requiring field-upgradable, tamper-resistant firmware storage.
Availability
W25X40BVDAIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code retention, and automotive body control module applications requiring stable component supply, long-lifecycle support, and through-hole assembly compatibility.
Supply support for W25X40BVDAIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25X series was designed specifically for embedded systems needing compact, low-power, high-reliability code and data storage - emphasizing sector flexibility, SPI protocol extensions, and robust write protection for mission-critical firmware.
FAQ
What is the maximum SPI clock frequency supported by the W25X40BVDAIG?
The W25X40BVDAIG supports SPI clock frequencies up to 104 MHz in standard and dual I/O modes. When using the Fast Read Dual I/O (BBh) instruction, this enables an effective data transfer rate of 208 Mbps. This specification is validated across the full industrial temperature range (-40°C to +85°C) and 2.7V–3.6V supply voltage window. The W25X40BVDAIG datasheet confirms timing compliance under these conditions in Section 10.6 AC Electrical Characteristics.
Does the W25X40BVDAIG support execute-in-place (XIP) operation?
Yes, the W25X40BVDAIG supports true execute-in-place operation via its Continuous Read Mode, which reduces instruction overhead to as few as 8 clocks per address and enables seamless sequential reads. This capability is enhanced by Fast Read Dual Output (3Bh) and Fast Read Dual I/O (BBh) instructions, allowing efficient code shadowing and direct execution of non-speed-critical firmware. The W25X40BVDAIG's 4KB sector architecture further supports XIP by enabling selective updates without disrupting running code.
How does hardware write protection work on the W25X40BVDAIG?
Hardware write protection on the W25X40BVDAIG combines the /WP pin with Status Register bits (SRP, BP2–BP0, TB). When SRP = 1 and /WP is driven low, writes to the Status Register - including block protect configuration - are disabled. The TB bit selects whether protection applies to the top or bottom portion of memory, and BP2–BP0 define the protected density (e.g., upper 1/8, lower 1/2, or full array). This dual-layer scheme ensures robust, field-proof memory lockdown independent of software state. The W25X40BVDAIG implements this per JEDEC JESD216 compliance.
What package type does the W25X40BVDAIG use, and is it pin-compatible with other W25X40BV variants?
The W25X40BVDAIG uses an 8-pin PDIP package with 300-mil width (package code DA), distinct from SOIC-150/208-mil and WSON-6x5-mm variants. While all W25X40BV variants share identical pin functions and electrical behavior, the PDIP package has different mechanical dimensions and soldering requirements. Pin numbering and signal mapping (e.g., /CS on Pin 1, VCC on Pin 8) are consistent across all packages, enabling schematic reuse with footprint adaptation. The W25X40BVDAIG datasheet confirms this in Sections 5 and 6.1.
Can the W25X40BVDAIG be used in automotive applications?
The W25X40BVDAIG is rated for -40°C to +85°C operation and meets industrial temperature specifications, but it is not AEC-Q100 qualified. It has been deployed in automotive body control modules and infotainment subsystems where extended temperature tolerance is required but formal automotive qualification is not mandated. For safety-critical powertrain or ADAS applications, Winbond's AEC-Q100-qualified W25Q-series devices are recommended instead. The W25X40BVDAIG's 20-year data retention and 100,000-cycle endurance remain valid within its specified temperature range.
W25X40BVDAIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
W25X40BVDAIG FAQ
1.How can I place an order for W25X40BVDAIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40BVDAIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40BVDAIG reliable?
The price and inventory of W25X40BVDAIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40BVDAIG is usually 5 days.
3.What payment methods are accepted for W25X40BVDAIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40BVDAIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40BVDAIG?
W25X40BVDAIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40BVDAIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40BVDAIG?
For technical support, including W25X40BVDAIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40BVDAIG requirements.
6.How does Aetrix verify that W25X40BVDAIG is sourced from the original manufacturer or authorized distributors?
All W25X40BVDAIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40BVDAIG meets industry standards.
7.What is the process for return or replacement of W25X40BVDAIG?
All W25X40BVDAIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40BVDAIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40BVDAIG part is unused and in its original packaging.
Return procedure for W25X40BVDAIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25X40BVDAIG Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
