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Winbond Electronics Corporation W25X40BVZPIG
- Part No.:
- W25X40BVZPIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X40BVZPIG.pdf
- Description:
- IC FLASH 4MBIT SPI 104MHZ 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,168
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Product details
Overview
W25X40BVZPIG from Winbond is a 4M-bit (512KB) serial NOR flash memory IC with SPI and Dual I/O interface, organized into 2,048 pages of 256 bytes each and 128 uniform 4KB sectors. It operates on a single 2.7V–3.6V supply, supports up to 104MHz SPI clock (208Mbps effective via Fast Read Dual Output), and delivers ≤1µA power-down current. It is used for code storage, firmware boot, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X40BVZPIG datasheet, W25X40BVZPIG pinout, W25X40BVZPIG application, or W25X40BVZPIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware/software write protection (/WP pin + status register BP/TB bits), JEDEC ID compatibility (EFh/3013h), and WSON-8 (6×5mm) package suitability for high-density PCB layouts.
Technical Context
The W25X40BVZPIG implements a standard SPI Mode 0/3 interface with optional Dual I/O operation using bidirectional IO0 (DIO) and IO1 (DO) pins. Its command set includes Fast Read Dual Output (3Bh) and Fast Read Dual I/O (BBh), enabling 2×–3× throughput over standard SPI reads.
Internal architecture features a 256-byte page buffer, dedicated status register (S0–S7) with BUSY, WEL, BP2–BP0, TB, and SRP bits, and hardware write protection coordinated between /WP pin state and SRP bit. Erase granularity spans 4KB sectors, 32KB blocks, 64KB blocks, and full-chip erase - all supporting >100,000 program/erase cycles and >20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 M-bit (512 KB), organized as 2,048 × 256-byte pages |
| Interface | SPI-compatible with Standard/Dual Output/Dual I/O modes; supports CLK up to 104 MHz |
| Erase Granularity | Uniform 4KB sectors (128 total), plus 32KB and 64KB block erase options |
| Write Protection | Hardware via /WP pin + software via Status Register (BP2–BP0, TB, SRP bits) |
| Supply Voltage | 2.7 V to 3.6 V; typical active current 4 mA, power-down current 1 µA |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade reliability |
| JEDEC ID | Manufacturer ID = EFh, Device ID = 3013h (confirmed for W25X40BV) |
Pinout & Package
W25X40BVZPIG is housed in an 8-contact WSON package (6 mm × 5 mm, package code ZP), optimized for compact PCB layouts and thermal performance in high-density applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; places device in standby (high-Z DO) when high; must track VCC at power-up |
| DO (IO1) | Data Output / Bidirectional I/O | Standard SPI output (DO); becomes IO1 in Dual I/O mode; high-impedance during /HOLD |
| /WP | Write Protect Input | Active-low hardware lock for Status Register writes when SRP = 1 |
| GND | Ground Reference | Primary return path for VCC and signal currents; requires low-impedance PCB plane |
| DIO (IO0) | Data Input / Bidirectional I/O | Standard SPI input (DI); becomes IO0 in Dual I/O mode; ignored during /HOLD |
| CLK | Serial Clock Input | Edge-triggered timing reference for all SPI operations; supports Mode 0/3 |
| /HOLD | Hold Input | Pauses ongoing SPI transaction while /CS remains low; enables multi-device bus sharing |
| VCC | Power Supply | Single 2.7–3.6 V supply; decoupling capacitor required per datasheet layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP (execute-in-place) with ≤8 clocks to address next byte; reduces instruction overhead in boot code |
| Dual I/O High-Speed Read | Fast Read Dual I/O (BBh) achieves up to 208 Mbps effective throughput - comparable to parallel flash |
| Flexible Memory Protection | Configurable top/bottom array protection via TB bit + BP2–BP0; supports partial firmware lockdown without full chip lock |
| Robust Power-Up Sequencing | Automatic write-disable after power-up (tPUW delay) and VCC tracking requirement prevent spurious writes during brown-out |
| Industry-Standard Identification | JEDEC-compliant Manufacturer ID (EFh) and Device ID (3013h) ensure interoperability with generic flash programmers and OS drivers |
Applications
| Industrial HMI Boot Storage | IoT Edge Sensor Firmware |
|---|---|
Use Scenario: Stores boot loader and GUI assets for ARM Cortex-M based human-machine interface panels operating in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via SPI during cold start; supports XIP for fast UI initialization. Use Value: 4KB sector erase enables incremental firmware updates without disrupting operational configuration stored in adjacent sectors. |
Use Scenario: Holds firmware images and calibration tables for battery-powered environmental sensors deployed in remote locations. IC Role / Device Role / Timing Role: Low-power firmware repository; leverages 1µA power-down mode between measurement cycles to extend battery life. Use Value: Hardware /WP pin + SRP bit combination prevents accidental corruption during brown-out events common in energy-harvesting power supplies. |
| Medical Diagnostic Device Log | Automotive Infotainment Update Cache |
Use Scenario: Retains diagnostic event logs and calibration history in portable ultrasound units requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: Parameter and log storage with deterministic 4KB sector boundaries for atomic write/erase alignment. Use Value: Block Protect bits (BP2–BP0) isolate critical calibration data in bottom sectors while allowing field-updatable logs in top sectors. |
Use Scenario: Caches OTA firmware updates before validation and installation in automotive head units with strict ASIL-B timing constraints. IC Role / Device Role / Timing Role: High-reliability update staging area; uses Fast Read Dual Output (3Bh) to minimize download latency over CAN-FD gateway SPI bridges. Use Value: 104MHz SPI clock support ensures <50ms read latency for 64KB update chunks - meeting real-time cache refill deadlines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L4006EM1I-12G | Same density (4M-bit), SOIC-8 package; lacks Dual I/O mode; max SPI clock 80MHz | Lower throughput limits XIP performance; no Fast Read Dual I/O instruction support | Select if board uses SOIC-8 footprint and dual-I/O is unnecessary |
| S25FL032P0XMFI001 | 4M-bit, supports Quad SPI (QSPI); higher pin count (8-pin SOIC vs. WSON-8); 100MHz clock | Requires QSPI controller; incompatible pinout and command set; not drop-in | Choose only when migrating to QSPI ecosystem and redesigning layout |
Compared with MX25L4006EM1I-12G and S25FL032P0XMFI001, the W25X40BVZPIG uniquely balances WSON-8 space efficiency, Dual I/O throughput (208 Mbps), and industrial temperature support - making it optimal for new designs prioritizing compactness and SPI bandwidth without QSPI complexity.
Availability
W25X40BVZPIG is available at Aetrix Electronics and suitable for industrial HMI boot storage, IoT edge sensor firmware, medical diagnostic device log retention, automotive infotainment update caching, and embedded code shadowing requiring stable component supply across long-lifecycle programs.
Supply support for W25X40BVZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded and industrial markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable, low-power serial code storage - emphasizing sector-level flexibility, JEDEC compatibility, and robust write protection.
FAQ
What is the exact memory organization of the W25X40BVZPIG?
The W25X40BVZPIG contains 4 M-bit (512 KB) of NOR flash memory, organized into 2,048 programmable pages of 256 bytes each. It features 128 uniform 4KB erasable sectors and 8 erasable 64KB blocks. This structure allows fine-grained updates and efficient wear leveling in firmware storage applications where the W25X40BVZPIG is commonly deployed.
Does the W25X40BVZPIG support Quad SPI (QSPI) mode?
No, the W25X40BVZPIG does not support Quad SPI. It supports Standard SPI, Dual Output SPI (using DO pin), and Dual I/O SPI (using both DIO and DO pins). Quad SPI functionality requires four I/O lines and is not implemented in the W25X40BVZPIG's command set or pinout - confirmed by its datasheet instruction table and pin description section.
What is the purpose of the /HOLD pin on the W25X40BVZPIG?
The /HOLD pin on the W25X40BVZPIG pauses ongoing SPI transactions while /CS remains low, placing DO in high-impedance and ignoring DIO/CLK signals. This enables safe time-sharing of the SPI bus among multiple peripherals. In systems using the W25X40BVZPIG for boot code, /HOLD prevents bus contention during interrupt-driven peripheral access without resetting the flash state.
How does hardware write protection work on the W25X40BVZPIG?
Hardware write protection on the W25X40BVZPIG combines the /WP pin (active-low) with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is low, Write Status Register instructions are blocked - preventing changes to BP2–BP0 and TB bits. This dual-layer mechanism ensures that critical firmware regions remain immutable even during voltage transients, a key reliability feature of the W25X40BVZPIG.
Is the W25X40BVZPIG pin-compatible with other W25X family members in WSON-8?
Yes, the W25X40BVZPIG shares identical pinout, electrical characteristics, and command set with W25X10BVZPIG and W25X20BVZPIG in the ZP (WSON-8) package. All three use the same 8-pin mapping (/CS, DO, /WP, GND, DIO, CLK, /HOLD, VCC) and support identical SPI/Dual I/O protocols - enabling density-scaling within the same PCB footprint for the W25X40BVZPIG and siblings.
W25X40BVZPIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25X40BVZPIG FAQ
1.How can I place an order for W25X40BVZPIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40BVZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40BVZPIG reliable?
The price and inventory of W25X40BVZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40BVZPIG is usually 5 days.
3.What payment methods are accepted for W25X40BVZPIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40BVZPIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40BVZPIG?
W25X40BVZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40BVZPIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40BVZPIG?
For technical support, including W25X40BVZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40BVZPIG requirements.
6.How does Aetrix verify that W25X40BVZPIG is sourced from the original manufacturer or authorized distributors?
All W25X40BVZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40BVZPIG meets industry standards.
7.What is the process for return or replacement of W25X40BVZPIG?
All W25X40BVZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40BVZPIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40BVZPIG part is unused and in its original packaging.
Return procedure for W25X40BVZPIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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