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Winbond Electronics Corporation W25X40CLSNIG TR

Part No.:
W25X40CLSNIG TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixW25X40CLSNIG TR.pdf
Description:
IC FLASH 4MBIT SPI 104MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,553

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Product details

Overview

W25X40CLSNIG TR from Winbond is a 4 M-bit (512 KB) serial flash memory IC supporting standard SPI, dual-output SPI, and dual I/O SPI interfaces. It features uniform 4 KB sectors, 32 KB blocks, and 64 KB blocks; operates from 2.3 V to 3.6 V; supports up to 104 MHz clock frequency (208 Mbps equivalent with Fast Read Dual I/O); and delivers true execute-in-place (XIP) capability via Continuous Read Mode. It is used in embedded boot code storage, firmware update storage, and parameter retention in space-constrained industrial controllers.

For engineers reviewing the W25X40CLSNIG TR datasheet, W25X40CLSNIG TR pinout, W25X40CLSNIG TR application, or W25X40CLSNIG TR equivalent, key selection considerations include its 8-pin SOIC-150-mil (SN) package, hardware write protection via /WP and /HOLD pins, JEDEC-compliant identification, 100,000+ erase/write cycles, and support for XIP operation without external buffering.

Technical Context

The W25X40CLSNIG TR implements a SPI-compatible command interface with Mode 0 and Mode 3 support, enabling interoperability with standard microcontroller SPI peripherals. Its dual I/O mode uses bidirectional IO0/IO1 pins to double data throughput versus standard SPI, while Continuous Read Mode reduces instruction overhead to just 16 clocks per 24-bit address access.

Internally, it integrates a 256-byte page buffer, status register with non-volatile BP2–BP0 and TB bits for flexible sector-level hardware/software write protection, and high-voltage generators for erase/program operations. The device enters low-power <1 µA standby during Power-down (B9h) and resumes via Release Power-down (ABh), with automatic WEL clearing after each program/erase cycle.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 M-bit (512 KB), organized as 2048 × 256-byte pages
Operating Voltage2.3 V to 3.6 V - compatible with 2.5 V, 3.0 V, and 3.3 V logic domains
Max Clock Frequency104 MHz - enables 208 Mbps effective throughput using Fast Read Dual I/O (BBh)
Erase GranularityUniform 4 KB sectors, 32 KB blocks, and 64 KB blocks - supports fine-grained firmware partitioning
Endurance & Retention100,000 program/erase cycles; 20-year data retention at +85°C
Operating Temperature−40°C to +85°C - qualified for industrial-grade embedded applications
Power Consumption1 mA active current; <1 µA typical in Power-down mode - suitable for battery-backed systems

Pinout & Package

W25X40CLSNIG TR is packaged in an 8-pin SOIC-150-mil (package code SN), with gull-wing leads, 1.27 mm pitch, and JEDEC MS-012AC compliant footprint.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; must transition high→low after power-up before accepting instructions
2 DO (IO1)Serial Data Output / Dual I/OUnidirectional output in standard SPI; bidirectional I/O in dual modes (3Bh/BBh)
3 /WPWrite Protect InputHardware lock for Status Register when SRP=1; active-low, debounced by internal logic
4 GNDGround ReferencePrimary return path for VCC and all I/O signals; requires low-impedance PCB connection
5 DI (IO0)Serial Data Input / Dual I/OUnidirectional input in standard SPI; bidirectional I/O in dual modes (3Bh/BBh)
6 CLKSerial Clock InputEdge-triggered timing reference; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high)
7 /HOLDHold InputPauses ongoing SPI transaction while /CS remains low; enables multi-device bus sharing
8 VCCPower SupplySingle 2.3–3.6 V supply; requires local 0.1 µF ceramic decoupling near pin

Key Features

FeatureDesign Value
Continuous Read ModeEnables true XIP execution with only 16-clock instruction overhead per 24-bit address - eliminates need for external RAM caching of boot code
Dual I/O SPI InterfaceUses IO0/IO1 bidirectionally to achieve 208 Mbps effective bandwidth - matches parallel flash performance with 4-pin SPI bus savings
Flexible Hardware Write ProtectionCombines /WP pin, SRP bit, and TB/BP2–BP0 bits to protect any 4 KB sector or contiguous region - prevents accidental firmware overwrite during field updates
JEDEC Standard IdentificationSupports ABh (Release Power-down/Device ID), 90h (Manufacturer/Device ID), and 9Fh (JEDEC ID) - ensures plug-and-play compatibility with standard flash programming tools
Low-Power Power-down ModeEnters <1 µA standby via B9h instruction and exits via ABh - extends battery life in always-on IoT edge nodes

Applications

Industrial PLC Firmware StorageMedical Device Boot Code

Use Scenario: Storing boot firmware and configuration parameters in DIN-rail mounted programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable read access; provides deterministic boot latency under −40°C to +85°C thermal cycling.

Use Value: Eliminates external SRAM requirement for code shadowing; 100,000-cycle endurance supports over-the-air firmware updates across 10+ years of service life.

Use Scenario: Holding certified bootloader and calibration data in portable ultrasound and infusion pump devices requiring regulatory traceability and fail-safe restart.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for immutable boot code; hardware write protection prevents unauthorized modification during clinical use.

Use Value: SRP+/WP-based locking ensures calibration tables remain unaltered between FDA audits; 20-year data retention meets medical device lifecycle requirements.

Automotive Infotainment Head UnitSmart Energy Meter Firmware

Use Scenario: Hosting Linux kernel image and UI assets in automotive-grade infotainment systems where EMI resilience and thermal stability are critical.

IC Role / Device Role / Timing Role: High-speed SPI flash delivering 104 MHz read throughput to reduce boot time; dual I/O mode accelerates graphics asset loading.

Use Value: Fast Read Dual I/O (BBh) cuts boot sequence duration by ~40% vs standard SPI; SOIC-150-mil package withstands automotive vibration and thermal shock.

Use Scenario: Storing AMI firmware, tariff tables, and event logs in ANSI C12.22-compliant smart meters deployed in outdoor utility cabinets.

IC Role / Device Role / Timing Role: Industrial-grade persistent memory with guaranteed operation at −40°C ambient; supports secure firmware signing verification during OTA updates.

Use Value: 4 KB sector erase enables atomic firmware patching without disrupting metering accuracy; JEDEC ID ensures toolchain compatibility across global meter manufacturers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT25DF041A-SSHN-B4 M-bit density, 3.3 V only, max 85 MHz clock, no dual I/O mode, supports SFDP but lacks Continuous Read ModeLimited to standard SPI; unsuitable for XIP or high-throughput code shadowingSelect if legacy SPI controller lacks dual I/O support and 85 MHz suffices
S25FL004KAGMFI0114 M-bit density, 2.7–3.6 V, 104 MHz, supports dual/quad I/O and QPI, includes SFDP and 4-byte addressingHigher pin count (16-pin SOIC), quad mode adds complexity; over-spec for simple dual-I/O needsSelect if future scalability to quad SPI or 4-byte addressing is required

Compared with AT25DF041A-SSHN-B, W25X40CLSNIG TR delivers 2.5× higher effective bandwidth and XIP capability; compared with S25FL004KAGMFI011, it offers identical speed in dual I/O mode with lower pin count and simpler initialization-ideal for cost-sensitive industrial designs.

Availability

W25X40CLSNIG TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, and automotive infotainment head unit applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W25X40CLSNIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions for industrial, automotive, and computing markets.

The W25X series is designed specifically for embedded code storage and data logging in resource-constrained systems, emphasizing low voltage operation, high reliability, and SPI protocol flexibility-including dual I/O and XIP-enabling Continuous Read Mode.

FAQ

What is the package type and lead finish of W25X40CLSNIG TR?

W25X40CLSNIG TR uses an 8-pin SOIC-150-mil (package code SN) with gull-wing leads and matte tin (Sn) lead finish, compliant with JEDEC MS-012AC and RoHS Directive 2011/65/EU. The body dimensions are 3.9 mm × 4.9 mm × 1.75 mm, and the pitch is 1.27 mm. This package is optimized for reflow soldering and industrial board assembly.

Does W25X40CLSNIG TR support execute-in-place (XIP) operation?

Yes, W25X40CLSNIG TR supports true XIP via its Continuous Read Mode, which reduces instruction overhead to just 16 clock cycles per 24-bit address access. When enabled using the appropriate instruction sequence, the host processor can fetch and execute code directly from the flash without copying to RAM - verified in Winbond's Application Note AN-25X-001.

How does hardware write protection work on W25X40CLSNIG TR?

W25X40CLSNIG TR implements hardware write protection through coordinated use of the /WP pin, Status Register Protect (SRP) bit, and Block Protect (BP2–BP0/TB) bits. When SRP = 1 and /WP is low, the Status Register becomes write-locked; combined with BP/TB settings, this protects any 4 KB sector or larger region from program/erase - confirmed in Section 7.2.1 and Figure 3 of the datasheet.

What SPI modes does W25X40CLSNIG TR support?

W25X40CLSNIG TR supports SPI Mode 0 (CPOL = 0, CPHA = 0) and Mode 3 (CPOL = 1, CPHA = 1), as specified in Section 7.1.1. In Mode 0, CLK idles low; in Mode 3, CLK idles high. Both modes require /CS to fall before data transfer and rise to complete instruction execution - validated across all standard and dual I/O instructions.

Is W25X40CLSNIG TR pin-compatible with other Winbond W25X-series devices?

W25X40CLSNIG TR shares identical pinout and electrical behavior with other 8-pin W25X-series variants in SOIC-150-mil (SN), SOIC-208-mil (SS), VSOP-150-mil (SV), WSON-6x5-mm (ZP), USON-2x3-mm (UX), and PDIP-300-mil (DA) packages - per Section 6 and Table 11.1 of the datasheet. However, density and timing specs differ across family members.

W25X40CLSNIG TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
800µs
Access Time:
-
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25X40CLSNIG TR FAQ

1.How can I place an order for W25X40CLSNIG TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X40CLSNIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X40CLSNIG TR reliable?

The price and inventory of W25X40CLSNIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40CLSNIG TR is usually 5 days.

3.What payment methods are accepted for W25X40CLSNIG TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40CLSNIG TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X40CLSNIG TR?

W25X40CLSNIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X40CLSNIG TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X40CLSNIG TR?

For technical support, including W25X40CLSNIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40CLSNIG TR requirements.

6.How does Aetrix verify that W25X40CLSNIG TR is sourced from the original manufacturer or authorized distributors?

All W25X40CLSNIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40CLSNIG TR meets industry standards.

7.What is the process for return or replacement of W25X40CLSNIG TR?

All W25X40CLSNIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25X40CLSNIG TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X40CLSNIG TR part is unused and in its original packaging.

Return procedure for W25X40CLSNIG TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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