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Winbond Electronics Corporation W25X40VSSIG
- Part No.:
- W25X40VSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X40VSSIG.pdf
- Description:
- IC FLASH 4MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,809
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Product details
Overview
W25X40VSSIG from Winbond is a 4M-bit (512KB) serial Flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X40VSSIG datasheet, W25X40VSSIG pinout, W25X40VSSIG application, or W25X40VSSIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware/software write protection (/WP pin + BP bits), SOIC-208-mil package compatibility, and dual-output SPI timing compliance at 75MHz.
Technical Context
The W25X40VSSIG implements a standard SPI bus (Modes 0 and 3) with four dedicated pins-/CS, CLK, DIO, and DO-and extends functionality via dual-output mode using DIO as a second output during Fast Read Dual Output (3Bh) instruction, doubling effective throughput. It uses a 256-byte page programming architecture with 128 erasable 4KB sectors and 8 erasable 64KB blocks.
Internal control relies on an 8-bit status register with non-volatile BP2–BP0 and TB bits enabling configurable top/bottom hardware write protection, while the /WP and /HOLD pins provide external signal-level control over write enable and bus arbitration without interrupting internal state. Power-down current is 1µA (typ), and endurance is rated at ≥100,000 program/erase cycles with 20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M-bit (512KB), organized as 2048 pages × 256 bytes |
| Sector Size | Uniform 4KB sectors (128 total), enabling fine-grained data updates |
| Max SPI Clock | 75MHz, enabling 150Mbps effective read rate with dual-output mode |
| Write Endurance | ≥100,000 program/erase cycles per sector |
| Data Retention | 20 years at +25°C, critical for long-life industrial firmware storage |
| Supply Voltage | 2.7V to 3.6V single supply, compatible with 3.3V logic systems |
| Operating Temp | –40°C to +85°C, qualified for industrial ambient environments |
| Power-down Current | 1µA (typ), minimizing standby power in battery-backed applications |
Pinout & Package
W25X40VSSIG is packaged in an 8-pin SOIC 208-mil (Package Code SS), with gull-wing leads, 1.27mm pitch, and JEDEC MS-012AC compliant dimensions (8.97mm × 4.00mm × 1.75mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before instruction acceptance |
| 2 DO | Serial Data Output | Primary output for standard SPI reads; outputs MSB-first on CLK falling edge |
| 3 /WP | Write Protect Input | Hardware lock for status register writes when SRP=1; active-low |
| 4 GND | Ground Reference | Return path for VCC and all I/O signals; requires low-impedance PCB connection |
| 5 DIO | Serial Data I/O | Input for instructions/addresses; becomes secondary output during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Timing reference for all SPI transfers; supports Modes 0 and 3 (CLK idle low/high) |
| 7 /HOLD | Hold Input | Pauses ongoing SPI operation while /CS remains low; enables multi-device bus sharing |
| 8 VCC | Power Supply | 2.7–3.6V supply; requires local 0.1µF ceramic decoupling near pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output SPI Interface | Enables 150Mbps read throughput via 3Bh instruction, matching parallel Flash performance in pin-limited designs |
| Uniform 4KB Sector Architecture | Allows independent erase of small data partitions without disturbing adjacent firmware or configuration blocks |
| Hardware + Software Write Protection | Combines /WP pin control with BP2–BP0 and TB bits to protect top/bottom memory regions at boot or runtime |
| Page Programming (≤256 bytes) | Minimizes write latency and power burst duration; completes in <2ms per page |
| JEDEC Standard Identification | Supports ABh/90h/9Fh commands for automated BOM verification and field firmware validation |
| Low-Power Power-down Mode | Reduces system standby current by >99% vs. active mode (1µA vs. 5mA), extending battery life in portable devices |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
Use Scenario: Storing primary bootloader and initial firmware image executed directly from SPI Flash on MCU reset. IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read capability via Fast Read Dual Output (3Bh) to minimize boot time. Use Value: Reduces boot latency by 50% vs. standard SPI read due to 150Mbps dual-output transfer rate, accelerating system initialization. | Use Scenario: Holding field-upgradable application firmware images in a secure, isolated partition. IC Role / Device Role / Timing Role: Parameter- and code-segment storage with hardware write protection enabled via /WP pin and BP bits during update validation. Use Value: Prevents accidental overwrite of active firmware during OTA update by locking protected sectors until explicit unlock sequence. |
| Configuration Parameter Storage | Industrial Sensor Calibration Data |
Use Scenario: Retaining user-configurable settings (e.g., display brightness, network ID, alarm thresholds) across power cycles. IC Role / Device Role / Timing Role: Small-data EEPROM replacement using 4KB sector erase to preserve unrelated configuration blocks during partial updates. Use Value: Enables atomic 256-byte page writes without erasing full 4KB sectors, reducing wear on frequently modified parameter fields. | Use Scenario: Storing factory-calibrated sensor offset/gain coefficients and temperature compensation tables. IC Role / Device Role / Timing Role: High-reliability data archive with 20-year retention and ≥100,000 erase cycles for recalibration events. Use Value: Guarantees calibration integrity over product lifetime in industrial environments where rework is costly or impractical. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSHN-B | 4M-bit SPI Flash, 85MHz max clock, no dual-output mode; uses standard single-output SPI only | Lacks 150Mbps dual-output read path; slower boot and code-shadowing performance | Select when dual-output timing is unnecessary and legacy SPI controller compatibility is prioritized |
| MX25L4005AM1I-12G | 4M-bit SPI Flash, supports dual-output (3Bh), but requires separate /WP and /HOLD pins tied high for basic operation | Less flexible hardware write protection; no top/bottom block select (TB bit) in status register | Choose when simplified protection scheme suffices and footprint matches SOIC-208-mil |
Compared with AT25DF041A-SSHN-B and MX25L4005AM1I-12G, W25X40VSSIG delivers superior boot-time performance via dual-output SPI and more granular memory protection with TB/BP bit control-critical for secure, field-upgradable embedded systems requiring both speed and configurability.
Availability
W25X40VSSIG is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and configuration parameter storage requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for W25X40VSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial NOR Flash memory solutions for consumer, industrial, and automotive markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems needing reliable, low-power, high-speed serial code and data storage with robust write protection-targeting MCU-based applications from IoT nodes to industrial HMIs.
FAQ
What is the maximum clock frequency supported by W25X40VSSIG in dual-output mode?
W25X40VSSIG supports up to 75MHz SPI clock frequency. When executing the Fast Read Dual Output instruction (3Bh), this enables an effective data transfer rate of 150Mbps, as two bits are clocked per cycle on DO and DIO. This timing is validated in the AC Electrical Characteristics section (pages 35–36) of the June 2007 datasheet under "Fast Read 75MHz" conditions.
Does W25X40VSSIG support hardware write protection independent of software configuration?
Yes, W25X40VSSIG supports independent hardware write protection via the /WP pin. When the Status Register Protect (SRP) bit is set to 1, asserting /WP low disables all status register writes-including Block Protect (BP) and Top/Bottom (TB) bit changes-even if the device is otherwise write-enabled. This provides fail-safe protection against noise-induced corruption during power transitions.
What package type does W25X40VSSIG use, and is it pin-compatible with other W25X series variants?
W25X40VSSIG uses an 8-pin SOIC 208-mil package (Package Code SS). It shares identical pinout and electrical behavior with W25X40 in SOIC-150-mil (SN) and W25X80 in SOIC-208-mil (SS), but mechanical compatibility requires verifying board land pattern against JEDEC MS-012AC dimensions. Pin functions are identical across all W25X family SOIC variants.
How many 4KB sectors does W25X40VSSIG contain, and what is the erase granularity?
W25X40VSSIG contains 128 uniform 4KB sectors (total 512KB). Erase granularity is fully flexible: individual 4KB sectors can be erased using the Sector Erase (20h) instruction, groups of 256KB (4 sectors) via Block Erase (D8h), or the entire array with Chip Erase (C7h). This allows precise wear leveling and selective data updates without disturbing adjacent code or configuration.
Can W25X40VSSIG be used with standard SPI controllers that do not support dual-output mode?
Yes, W25X40VSSIG is fully backward-compatible with standard SPI controllers. It operates in standard single-output mode using /CS, CLK, DIO (input), and DO (output) pins. Dual-output functionality is optional and activated only when issuing the Fast Read Dual Output (3Bh) instruction; all other instructions-including Read Data (03h) and Fast Read (0Bh)-use conventional SPI signaling.
W25X40VSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X40VSSIG FAQ
1.How can I place an order for W25X40VSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40VSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40VSSIG reliable?
The price and inventory of W25X40VSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40VSSIG is usually 5 days.
3.What payment methods are accepted for W25X40VSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40VSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40VSSIG?
W25X40VSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40VSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40VSSIG?
For technical support, including W25X40VSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40VSSIG requirements.
6.How does Aetrix verify that W25X40VSSIG is sourced from the original manufacturer or authorized distributors?
All W25X40VSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40VSSIG meets industry standards.
7.What is the process for return or replacement of W25X40VSSIG?
All W25X40VSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40VSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40VSSIG part is unused and in its original packaging.
Return procedure for W25X40VSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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