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Winbond Electronics Corporation W25X40VSSIG T&R

Part No.:
W25X40VSSIG T&R
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25X40VSSIG T&R.pdf
Description:
IC FLASH 4MBIT SPI 75MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,838

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Product details

Overview

W25X40VSSIG T&R from Winbond is a 4M-bit (512KB) serial flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), widely used in code storage and firmware boot applications for microcontrollers.

For engineers reviewing the W25X40VSSIG T&R datasheet, W25X40VSSIG T&R pinout, W25X40VSSIG T&R application, or W25X40VSSIG T&R equivalent, key selection considerations include sector-erase granularity (4KB), hardware write protection via /WP pin, JEDEC ID compatibility (9Fh), and SOIC-208-mil (SS) package mapping confirmed for this variant.

Technical Context

The W25X40VSSIG T&R implements standard SPI Mode 0/3 with dual-output capability enabled only during Fast Read Dual Output (3Bh) instruction, where DIO becomes a second output channel; it uses a 256-byte page buffer and supports auto-increment sequential reads.

Its status register includes non-volatile BP2–BP0 and TB bits for configurable top/bottom array protection, and SRP bit enabling hardware lock of status register writes when /WP is low; all erase/program operations clear the Write Enable Latch (WEL) automatically upon completion.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density4M-bit (512KB), organized as 2048 pages × 256 bytes
Sector SizeUniform 4KB sectors (128 total), enabling fine-grained data parameter storage
Max Clock Frequency75MHz SPI clock, delivering 150Mbps effective throughput with Fast Read Dual Output
Write EnduranceMinimum 100,000 program/erase cycles per sector
Data Retention20 years at +25°C, critical for long-life embedded firmware storage
Supply Voltage2.7V to 3.6V single supply, compatible with 3.3V system rails
Operating Temp–40°C to +85°C industrial range, validated for extended environmental operation

Pinout & Package

W25X40VSSIG T&R is packaged in an 8-pin SOIC 208-mil (Package Code SS), with gull-wing leads, 1.27mm pitch, and body dimensions of 8.9mm × 4.0mm - confirmed for W25X40 and W25X80 variants per datasheet Section 4 and 7.1.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable; device enters standby (1µA) when high, and ignores instructions until /CS falls after power-up
DOSerial Data OutputPrimary output for standard SPI reads; outputs data on CLK falling edge; high-impedance when /HOLD active
/WPWrite Protect InputHardware lock for status register writes when SRP=1; active-low, enables top/bottom block protection coordination
GNDGround ReferenceSignal and power return path; must be low-impedance to ensure stable read/write timing margins
DIOSerial Data I/OInput for instructions/addresses/data (CLK rising edge); becomes secondary output during Fast Read Dual Output (3Bh)
CLKSerial Clock InputTiming reference for all SPI transfers; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high)
/HOLDHold InputPauses ongoing SPI transaction without deselecting; suspends DO/DIO/CLK activity while /CS remains low
VCCPower Supply2.7–3.6V supply; internal voltage regulator ensures stable core operation across rail variation

Key Features

Feature Design Value
Dual Output SPI InterfaceEnables 150Mbps read throughput using Fast Read Dual Output (3Bh), doubling bandwidth over standard SPI for fast code shadowing
Hardware + Software Write ProtectionCombines /WP pin control with SRP/BP bits to protect arbitrary memory regions - e.g., bootloader section - against accidental overwrite
Uniform 4KB Sector ArchitectureAllows independent erasure of small data partitions (e.g., calibration tables), minimizing wear on adjacent firmware sections
JEDEC Standard IdentificationReturns Manufacturer ID EFh and Device ID 3013h via 9Fh instruction, ensuring plug-and-play compatibility with standard flash programming tools
Low-Power Power-down ModeReduces current to 1µA typical; retains full memory content and status register state without external backup supply

Applications

Firmware Boot Storage IoT Edge Device Configuration

Use Scenario: Storing boot code for ARM Cortex-M microcontrollers that execute-in-place (XIP) or copy-to-RAM at startup.

IC Role / Device Role / Timing Role: Non-volatile code repository accessed via SPI during cold boot; supports Fast Read Dual Output for sub-100ms firmware load.

Use Value: 4KB sector granularity allows safe field updates of bootloader without erasing application firmware; 20-year retention ensures reliability across product lifecycle.

Use Scenario: Holding device-specific calibration data, network credentials, and OTA update metadata in battery-powered sensor nodes.

IC Role / Device Role / Timing Role: Parameter storage peripheral; leverages /HOLD to pause reads during MCU interrupt servicing, preserving bus arbitration integrity.

Use Value: Hardware /WP + SRP-based protection prevents credential corruption during brown-out events; 100K-cycle endurance supports frequent OTA metadata writes.

Industrial HMI Display Firmware Automotive Body Control Module (BCM)

Use Scenario: Hosting GUI assets, font libraries, and localized language strings for touch-screen HMIs in factory automation panels.

IC Role / Device Role / Timing Role: High-bandwidth SPI slave; uses dual-output mode to stream bitmap data to display controller with minimal CPU overhead.

Use Value: 75MHz clock support enables >10MB/s sustained read rates; SOIC-208-mil package meets IPC Class 2 solderability and thermal cycling requirements.

Use Scenario: Storing lamp control logic, CAN message lookup tables, and diagnostic fault codes in automotive BCMs operating under wide temperature swings.

IC Role / Device Role / Timing Role: Mission-critical configuration memory; relies on TB/BP bits to lock bootloader region while permitting runtime parameter updates.

Use Value: –40°C to +85°C rating and 20-year data retention meet AEC-Q100 Grade 2 requirements for under-hood electronics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
AT25DF041A-SSH-T4M-bit SPI flash with 4KB sectors; supports 85MHz clock but lacks dual-output mode; uses different status register layout and JEDEC ID (1Fh/41h)No Fast Read Dual Output - limits max read bandwidth to ~85Mbps; requires firmware rework for status register accessChoose if higher clock tolerance is needed and dual-output bandwidth is unnecessary
MX25L4005AM1I-12G4M-bit SPI flash with identical 4KB sectors and dual-output support (3Bh); same 75MHz max clock; JEDEC ID 9Dh/40h differsPinout and instruction set match W25X40VSSIG T&R; however, power-down current is 5µA vs. 1µA, impacting ultra-low-power designsPreferred for drop-in replacement where layout reuse is critical and 1µA power-down is not required

Compared with AT25DF041A-SSH-T and MX25L4005AM1I-12G, W25X40VSSIG T&R delivers the lowest power-down current (1µA) and native dual-output bandwidth (150Mbps), making it optimal for battery-constrained and high-speed code-fetch applications where both metrics are design-critical.

Availability

W25X40VSSIG T&R is available at Aetrix Electronics and suitable for firmware boot storage, IoT edge device configuration, industrial HMI display firmware, and automotive body control module applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for W25X40VSSIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, PSRAM, and code storage devices for embedded systems.

The W25X series was designed specifically for cost-sensitive, space-constrained applications requiring reliable code and parameter storage with SPI simplicity and enhanced performance over legacy serial flash - targeting consumer, industrial, and automotive electronics.

FAQ

What is the exact memory organization of the W25X40VSSIG T&R?

The W25X40VSSIG T&R contains 4M-bit (512KB) of flash memory, organized into 2048 programmable pages of 256 bytes each, grouped into 128 uniform 4KB sectors and 8 erasable 64KB blocks. This structure enables flexible partial erases for firmware updates and parameter storage without disturbing adjacent data regions in the W25X40VSSIG T&R.

Does W25X40VSSIG T&R support dual-output SPI, and how is it activated?

Yes, W25X40VSSIG T&R supports dual-output SPI exclusively through the Fast Read Dual Output instruction (0x3B). When issued, the DIO pin functions as a second data output alongside DO, doubling read bandwidth to 150Mbps at 75MHz clock. Standard SPI operations use DIO as input only; no configuration register enables this mode - it is instruction-triggered in the W25X40VSSIG T&R.

What package type does W25X40VSSIG T&R use, and is it pin-compatible with other W25X variants?

W25X40VSSIG T&R uses the 8-pin SOIC 208-mil package (Package Code SS), confirmed in datasheet Sections 4 and 7.1. It shares identical pinout and electrical behavior with W25X80 in SS packaging, but differs from W25X10/W25X20/W25X40 in SN (150-mil) packages - mechanical incompatibility prevents PCB reuse between SN and SS footprints for W25X40VSSIG T&R.

How does hardware write protection work on W25X40VSSIG T&R?

Hardware write protection on W25X40VSSIG T&R combines the /WP pin with Status Register Protect (SRP) bit: when SRP = 1, asserting /WP low disables all status register writes, locking block protection (BP2–BP0) and top/bottom (TB) settings. This prevents accidental modification of protected memory regions even during firmware updates - a critical safeguard in the W25X40VSSIG T&R's industrial applications.

What JEDEC ID does W25X40VSSIG T&R report, and why is it important?

W25X40VSSIG T&R reports JEDEC ID 0xEF3013h (Manufacturer ID 0xEF, Device ID 0x3013) via the 9Fh instruction. This standardized identifier enables automatic detection and configuration by flash programmers, bootloader frameworks, and debug tools - ensuring interoperability and eliminating manual part selection in production programming workflows for W25X40VSSIG T&R.

W25X40VSSIG T&R Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
SPI
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25X40VSSIG T&R FAQ

1.How can I place an order for W25X40VSSIG T&R through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X40VSSIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X40VSSIG T&R reliable?

The price and inventory of W25X40VSSIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40VSSIG T&R is usually 5 days.

3.What payment methods are accepted for W25X40VSSIG T&R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40VSSIG T&R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X40VSSIG T&R?

W25X40VSSIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X40VSSIG T&R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X40VSSIG T&R?

For technical support, including W25X40VSSIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40VSSIG T&R requirements.

6.How does Aetrix verify that W25X40VSSIG T&R is sourced from the original manufacturer or authorized distributors?

All W25X40VSSIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40VSSIG T&R meets industry standards.

7.What is the process for return or replacement of W25X40VSSIG T&R?

All W25X40VSSIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25X40VSSIG T&R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X40VSSIG T&R part is unused and in its original packaging.

Return procedure for W25X40VSSIG T&R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25X40VSSIG T&R Tags

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