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Winbond Electronics Corporation W25X40VZPIG
- Part No.:
- W25X40VZPIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X40VZPIG.pdf
- Description:
- IC FLASH 4MBIT SPI 75MHZ 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,219
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Product details
Overview
W25X40VZPIG from Winbond is a 4M-bit (512KB) serial flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X40VZPIG datasheet, W25X40VZPIG pinout, W25X40VZPIG application, or W25X40VZPIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware/software write protection (/WP pin + BP bits), SOIC-208-mil package compatibility, and dual-output SPI timing compliance at 75MHz.
Technical Context
The W25X40VZPIG implements a standard SPI bus (Modes 0 and 3) with four-signal interface (CLK, /CS, DIO, DO) and extends functionality via Fast Read Dual Output (3Bh), enabling simultaneous data output on DIO and DO pins to double throughput. It uses an internal page buffer (256 bytes) for program operations and supports hierarchical erase: sector (4KB), block (64KB), and chip-wide.
Its status register (8-bit) provides real-time control over write enable (WEL), busy state (BUSY), and configurable protection via BP2–BP0 and TB bits, with hardware lockout enabled when SRP=1 and /WP=low. Power-down mode draws only 1µA typical, and endurance is rated at ≥100,000 program/erase cycles with 20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M-bit (512KB), organized as 2048 pages × 256 bytes |
| Architecture | Uniform 4KB sectors (128 total) and 64KB blocks (8 total) |
| SPI Interface | Single/dual-output SPI; supports Fast Read Dual Output (3Bh) at 75MHz CLK → 150Mbps effective rate |
| Write/Erase Endurance | ≥100,000 cycles per sector; 20-year data retention at +85°C |
| Supply Voltage | 2.7V to 3.6V; active current ≤5mA, power-down current ≤1µA (typ) |
| Operating Temperature | –40°C to +85°C industrial grade |
| Write Protection | Hardware (/WP pin) + software (SRP/BP2–BP0/TB bits); top/bottom array select |
Pinout & Package
W25X40VZPIG is packaged in an 8-pin SOIC 208-mil (Package Code SS), with gull-wing leads, 1.27mm pitch, and body dimensions of 8.9mm × 4.0mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high impedance DO when deasserted; must track VCC at power-up |
| 2 DO | Serial Data Output | Primary output for standard read; outputs MSB-first on falling CLK edge; high-Z during /HOLD |
| 3 /WP | Write Protect Input | Active-low hardware lock for status register; enables top/bottom block protection when SRP=1 |
| 4 GND | Ground Reference | System ground return; decoupling capacitor required near VCC pin |
| 5 DIO | Serial Data I/O | Input for instructions/addresses; dual-role output during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Timing reference for all SPI transfers; supports Modes 0 and 3; max 75MHz frequency |
| 7 /HOLD | Hold Input | Pauses ongoing SPI operation while /CS remains low; releases on rising edge after CLK stabilization |
| 8 VCC | Power Supply | 2.7–3.6V supply; requires local 0.1µF ceramic decoupling capacitor |
Key Features
| Feature | Design Value |
|---|---|
| Dual-output SPI acceleration | Enables 150Mbps read throughput using Fast Read Dual Output (3Bh), matching parallel flash performance without extra pins |
| Flexible 4KB sector architecture | Allows independent erasure of small data regions-critical for firmware parameter storage and OTA update staging |
| Hardware + software write protection | Combines /WP pin control with programmable BP/TB/SRP bits to protect boot code or calibration data against corruption |
| Low-power operation | 1µA typical power-down current enables battery-backed applications and energy-sensitive IoT endpoints |
| JEDEC-compliant identification | Supports ABh/90h/9Fh commands for automated system detection and BOM validation in production test |
Applications
| Boot Code Storage | Firmware Parameter Retention |
|---|---|
Use Scenario: Storing bootloader and initial firmware image in microcontroller-based edge devices requiring cold-start execution. IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read access via Fast Read Dual Output (3Bh) to minimize boot latency. Use Value: 75MHz SPI clock + dual-output mode achieves ~150Mbps read speed, reducing boot time by >40% vs. standard SPI read (03h). | Use Scenario: Preserving device-specific calibration coefficients, network credentials, and user settings across power cycles in industrial sensors. IC Role / Device Role / Timing Role: Parameter storage with atomic 4KB sector erase to avoid corrupting adjacent configuration data during updates. Use Value: Independent 4KB sector erase allows reprogramming of calibration data without disturbing firmware or other parameters stored in adjacent sectors. |
| OTA Update Staging Area | Audio Voice Clip Storage |
Use Scenario: Holding downloaded firmware patches in a dedicated region before atomic swap-and-reboot in connected medical devices. IC Role / Device Role / Timing Role: Secure staging memory with hardware write protection (/WP pin) to prevent accidental overwrite during download. Use Value: /WP pin + SRP/BP bits ensure patch region remains locked until explicit unlock sequence, eliminating risk of partial writes during brown-out. | Use Scenario: Embedding localized voice prompts and alarm tones in home security panels with limited PCB area. IC Role / Device Role / Timing Role: Compact audio asset storage leveraging 512KB density and SOIC-208-mil footprint to fit tight mechanical envelopes. Use Value: 8.9mm × 4.0mm SOIC-208 package occupies 35.6mm²-42% smaller than equivalent PDIP, enabling denser front-panel designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSHN-B | 4M-bit SPI flash; supports 85MHz clock but lacks dual-output mode; uses different instruction set (e.g., 03h only, no 3Bh) | Lower read bandwidth (≤85Mbps); requires modified driver for status register and erase commands | Choose when dual-output is unnecessary and higher clock tolerance is prioritized over throughput |
| MX25L4005AM1I-12G | 4M-bit SPI flash; supports dual-output (3Bh) and same 75MHz max clock; identical 4KB sector size and /WP pin behavior | Pin-compatible and functionally equivalent; differs only in JEDEC ID and minor AC timing specs (tSHSL = 4ns vs. 5ns) | Drop-in alternative with validated layout reuse; verify tSHSL timing margin in high-noise environments |
Compared with AT25DF041A-SSHN-B, W25X40VZPIG delivers 76% higher effective read bandwidth via dual-output SPI; versus MX25L4005AM1I-12G, it offers identical functionality with marginally tighter hold timing, making it suitable for noise-immune industrial control designs.
Availability
W25X40VZPIG is available at Aetrix Electronics and suitable for boot code storage, firmware parameter retention, OTA update staging, and audio voice clip storage requiring stable component supply, long-term lifecycle support, and industrial temperature operation.
Supply support for W25X40VZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions.
The W25X series was designed for cost-sensitive, space-constrained embedded systems needing reliable code and data storage with SPI simplicity and enhanced throughput via dual-output capability.
FAQ
What is the maximum SPI clock frequency supported by the W25X40VZPIG?
The W25X40VZPIG supports SPI clock frequencies up to 75MHz in standard and dual-output modes. When using the Fast Read Dual Output instruction (3Bh), this enables an effective data transfer rate of 150Mbps. This specification is validated across the full –40°C to +85°C operating range and requires adherence to AC timing parameters including tCH and tCL as defined in the datasheet.
Does the W25X40VZPIG support hardware write protection independent of software configuration?
Yes, the W25X40VZPIG supports hardware write protection via the active-low /WP pin, which-when asserted-locks the status register if Status Register Protect (SRP) is set to 1. This prevents modification of block protection bits (BP2–BP0) and top/bottom selection (TB) regardless of software state, providing fail-safe protection for critical boot sectors in the W25X40VZPIG.
How many 4KB sectors does the W25X40VZPIG contain, and what is their erase granularity?
The W25X40VZPIG contains 128 uniform 4KB sectors, totaling 512KB of addressable memory. Each sector can be erased independently using the Sector Erase instruction (20h), allowing precise, non-disruptive updates to configuration data or firmware segments without affecting adjacent memory regions in the W25X40VZPIG.
Is the W25X40VZPIG pin-compatible with other members of the W25X family in the same package?
Yes, the W25X40VZPIG shares identical pinout and electrical characteristics with W25X10, W25X20, and W25X80 when packaged in the same SOIC-208-mil (SS) variant. All use the same 8-pin mapping, voltage ranges, instruction set, and timing-enabling scalable memory selection without PCB redesign for the W25X40VZPIG.
What is the endurance rating and data retention specification for the W25X40VZPIG?
The W25X40VZPIG is rated for a minimum of 100,000 program/erase cycles per sector and guarantees 20 years of data retention at +85°C. These specifications are measured under standard operating conditions (2.7–3.6V, –40°C to +85°C) and apply uniformly across all 128 sectors of the W25X40VZPIG device.
W25X40VZPIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25X40VZPIG FAQ
1.How can I place an order for W25X40VZPIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X40VZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X40VZPIG reliable?
The price and inventory of W25X40VZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X40VZPIG is usually 5 days.
3.What payment methods are accepted for W25X40VZPIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X40VZPIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X40VZPIG?
W25X40VZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X40VZPIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X40VZPIG?
For technical support, including W25X40VZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X40VZPIG requirements.
6.How does Aetrix verify that W25X40VZPIG is sourced from the original manufacturer or authorized distributors?
All W25X40VZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X40VZPIG meets industry standards.
7.What is the process for return or replacement of W25X40VZPIG?
All W25X40VZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X40VZPIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X40VZPIG part is unused and in its original packaging.
Return procedure for W25X40VZPIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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