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Winbond Electronics Corporation W25X64VSFIG
- Part No.:
- W25X64VSFIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25X64VSFIG.pdf
- Description:
- IC FLASH 64MBIT SPI 75MHZ 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,063
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Product details
Overview
W25X64VSFIG from Winbond is a 64M-bit (8MB) serial flash memory IC designed for code storage and data logging in space-constrained embedded systems. It features uniform 4KB sectors, dual-output SPI interface supporting up to 75MHz clock (150Mbps effective), and operates from a single 2.7–3.6V supply with 5mA active and 1µA power-down current. Used in boot code storage for microcontrollers and firmware updates in industrial controllers.
For engineers reviewing the W25X64VSFIG datasheet, W25X64VSFIG pinout, W25X64VSFIG application, or W25X64VSFIG equivalent, key selection considerations include sector-level erase granularity, hardware/software write protection via /WP and status register, dual-output read performance, and compatibility with standard and Mode 0/3 SPI controllers.
Technical Context
The W25X64VSFIG implements a standard SPI-compatible 4-wire interface (CLK, /CS, DIO, DO) with optional /HOLD and /WP control lines. It supports both SPI Modes 0 and 3, with data latched on CLK rising edge and output on falling edge. Dual-output operation is enabled exclusively via the Fast Read Dual Output (3Bh) instruction, repurposing DIO as a second data output during that command only.
Internally, the 64M-bit array is organized into 2,048 programmable pages of 256 bytes each and 2,048 erasable 4KB sectors (totaling 8MB). Erase operations support sector (4KB), block (64KB), and chip-wide granularity. The status register provides BUSY flag, Write Enable Latch (WEL), and configurable Block Protect (BP2–BP0) + Top/Bottom (TB) bits for flexible memory locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) - sufficient for full MCU boot images and firmware binaries in compact designs. |
| Sector Size | 4 KB uniform sectors - enables fine-grained data logging and parameter storage without over-erasing. |
| SPI Clock Max | 75 MHz - delivers up to 150 Mbps effective throughput using Fast Read Dual Output (3Bh). |
| Supply Voltage | 2.7 V to 3.6 V - compatible with common 3.3V logic domains and low-power embedded rails. |
| Active Current | 5 mA typical - minimizes system power budget during firmware reads or updates. |
| Power-down Current | 1 µA typical - enables ultra-low standby power in battery-backed or energy-harvested systems. |
| Data Retention | 20 years - ensures long-term reliability for industrial and automotive firmware storage. |
| Endurance | 100,000 program/erase cycles - supports frequent field firmware updates over product lifetime. |
Pinout & Package
W25X64VSFIG is packaged in an 8-pin SOIC 208-mil (package code SS), per Winbond's ordering documentation and pin configuration figures. This surface-mount package measures 5.3mm × 5.3mm with 1.27mm pitch and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives DO to high-Z when high; required to transition high→low after power-up before accepting instructions. |
| 2 DO | Serial Data Output | Primary output for standard SPI reads; outputs data on CLK falling edge; remains high-Z during /HOLD or /CS high. |
| 3 /WP | Write Protect Input | Hardware lock: when low and SRP=1, prevents Status Register writes - used with BP bits for robust firmware protection. |
| 4 GND | Ground Reference | System return path for all I/O and core logic; must be low-impedance to ensure timing integrity and noise immunity. |
| 5 DIO | Serial Data I/O | Bi-directional SPI data line: input for commands/addresses; output during Fast Read Dual Output (3Bh) only. |
| 6 CLK | Serial Clock Input | Timing reference: data latched on rising edge, output shifted on falling edge; supports Modes 0 and 3. |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction while /CS remains low - essential for multi-device bus sharing without aborting writes. |
| 8 VCC | Power Supply | Single 2.7–3.6V supply; requires local 0.1µF decoupling; voltage tracking with /CS at power-up is mandatory. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI (3Bh) | Enables 150 Mbps read throughput by using DIO as second data output - accelerates boot code shadowing to RAM. |
| Uniform 4KB Sectors | Allows independent erase of small data regions - critical for reliable parameter storage without disrupting firmware. |
| Hardware + Software Write Protection | Combines /WP pin control with non-volatile BP/TB/SRP bits - prevents accidental firmware corruption during field updates. |
| Page Program (02h) | Writes up to 256 bytes per operation in <2 ms - balances speed and endurance for frequent small-data updates. |
| JEDEC ID Support (9Fh) | Enables automatic device identification in bootloader software - eliminates hard-coded part assumptions in production firmware. |
| Power-down Mode (B9h) | Reduces current to 1 µA while preserving memory state - extends battery life in always-on IoT edge nodes. |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with no external programming interface. IC Role / Device Role / Timing Role: Non-volatile code storage accessed via SPI during cold boot and field update; uses /HOLD to yield bus to HMI controller. Use Value: 4KB sector erase enables patch-based updates without full reflash; 20-year retention ensures 15+ year product lifecycle support. |
Use Scenario: Holding certified boot loader and safety-critical application code in portable diagnostic equipment. IC Role / Device Role / Timing Role: Primary boot memory mapped via MCU XIP or copied to RAM; dual-output read reduces boot time under strict FDA startup deadlines. Use Value: Hardware write protection (/WP + SRP) prevents unauthorized code modification - satisfies IEC 62304 traceability requirements. |
| Automotive Telematics OTA Updates | Smart Meter Parameter Logging |
|
Use Scenario: Receiving and validating encrypted firmware patches over cellular network in vehicle telematics units. IC Role / Device Role / Timing Role: Secure storage partition for signed firmware images; uses Status Register BP bits to lock bootloader region during OTA. Use Value: 100,000 erase cycles support >10 years of quarterly updates; 2.7–3.6V range matches automotive 3.3V rail tolerances. |
Use Scenario: Recording time-stamped consumption data and tariff tables in utility smart meters with 15-year field life. IC Role / Device Role / Timing Role: Circular buffer storage managed by metering SoC; sector erase isolates corrupted logs without losing historical billing data. Use Value: 1 µA power-down current extends primary battery life beyond 15 years; -40°C to +85°C rating covers outdoor deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6405D-M2I | 64M-bit, same SOIC-8 208-mil package; supports standard SPI only (no dual-output); max clock 50MHz. | Lacks Fast Read Dual Output - boot time ~1.5× longer than W25X64VSFIG for same image size. | Choose when cost sensitivity outweighs performance; verify /HOLD and /WP timing compatibility with host MCU. |
| S25FL164K0XMFI010 | 64M-bit, quad-SPI capable (QPI mode); SOIC-8 208-mil; 80MHz clock; includes SFDP for auto-configuration. | Supports QPI for higher bandwidth but requires QSPI-capable host; no native dual-output SPI mode. | Prefer for new designs with QSPI-enabled MCUs; not drop-in compatible due to instruction set and mode differences. |
Compared with MX25L6405D-M2I and S25FL164K0XMFI010, the W25X64VSFIG delivers superior read throughput via dual-output SPI at lower clock frequency, offers simpler integration with legacy SPI hosts, and provides proven field reliability in industrial temperature-grade applications - making it optimal for cost-performance balanced boot memory designs.
Availability
W25X64VSFIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, automotive telematics OTA updates, and smart meter parameter logging requiring stable component supply across extended product lifecycles.
Supply support for W25X64VSFIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, SRAM, and mobile DRAM, serving industrial, communications, and consumer markets.
The W25X series was designed specifically for embedded code storage applications demanding high reliability, low power, and SPI simplicity - targeting microcontroller-based systems where footprint, pin count, and firmware integrity are critical.
FAQ
What is the maximum SPI clock frequency supported by W25X64VSFIG?
The W25X64VSFIG supports SPI clock frequencies up to 75 MHz. When using the Fast Read Dual Output (3Bh) instruction, this enables an effective data transfer rate of 150 Mbps. This specification is validated across the full industrial temperature range (-40°C to +85°C) and 2.7–3.6V supply, as confirmed in the AC Electrical Characteristics section of the May 2008 datasheet.
Does W25X64VSFIG support Quad SPI (QSPI) mode?
No, W25X64VSFIG does not support Quad SPI mode. It implements only standard SPI (4-wire: CLK, /CS, DIO, DO) and dual-output SPI (using DIO as second output during Fast Read Dual Output instruction). QSPI capability is found in later Winbond families such as W25Qxx, not the W25X64VSFIG or its 25X-series predecessors.
What package type does W25X64VSFIG use, and is it RoHS-compliant?
W25X64VSFIG uses the 8-pin SOIC 208-mil package (package code SS), measuring 5.3mm × 5.3mm with 1.27mm lead pitch. Per Winbond's ordering information and package specification section, this variant is RoHS-compliant and rated for industrial temperature operation (-40°C to +85°C).
How many erase/write cycles does W25X64VSFIG guarantee?
W25X64VSFIG guarantees a minimum of 100,000 program/erase cycles per sector, as specified in the Endurance and Data Retention section of the datasheet. This endurance rating applies across the full operating temperature and voltage range and is validated with standard sector erase (20h) and page program (02h) operations.
Can W25X64VSFIG be used with SPI Mode 3 (CPOL=1, CPHA=1)?
Yes, W25X64VSFIG fully supports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1), as explicitly stated in Section 11.1.1. Data is sampled on the rising edge of CLK and output on the falling edge in both modes. Host MCU SPI peripheral configuration must match the selected mode for reliable communication with W25X64VSFIG.
W25X64VSFIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25X64VSFIG FAQ
1.How can I place an order for W25X64VSFIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X64VSFIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X64VSFIG reliable?
The price and inventory of W25X64VSFIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X64VSFIG is usually 5 days.
3.What payment methods are accepted for W25X64VSFIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X64VSFIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X64VSFIG?
W25X64VSFIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X64VSFIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X64VSFIG?
For technical support, including W25X64VSFIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X64VSFIG requirements.
6.How does Aetrix verify that W25X64VSFIG is sourced from the original manufacturer or authorized distributors?
All W25X64VSFIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X64VSFIG meets industry standards.
7.What is the process for return or replacement of W25X64VSFIG?
All W25X64VSFIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X64VSFIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X64VSFIG part is unused and in its original packaging.
Return procedure for W25X64VSFIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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