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Winbond Electronics Corporation W25X64VZEIG
- Part No.:
- W25X64VZEIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X64VZEIG.pdf
- Description:
- IC FLASH 64MBIT SPI 75MHZ 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,618
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Product details
Overview
W25X64VZEIG from Winbond is a 64M-bit (8MB) serial flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 75MHz clock and 150Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and firmware boot in space-constrained embedded systems.
For engineers reviewing the W25X64VZEIG datasheet, W25X64VZEIG pinout, W25X64VZEIG application, or W25X64VZEIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware write protection via /WP pin, JEDEC ID compatibility, and 8-pad 8x6mm WSON package with validated 8-pin SOIC/PDIP/WSON pin mapping.
Technical Context
The W25X64VZEIG implements a standard SPI bus (Modes 0 and 3) with four-signal interface (CLK, /CS, DIO, DO) and extends functionality with dual-output read mode using the 3Bh instruction, enabling simultaneous data output on both DIO and DO pins during fast reads. It features a 2048-sector (4KB each), 128-block (64KB each) architecture with page-program capability (256 bytes/page, <2ms).
Write protection is implemented through layered mechanisms: hardware control via active-low /WP pin, software configuration of Status Register bits (BP2–BP0, TB, SRP), and automatic WEL latch management. The device supports power-down mode (1µA typical) and maintains 20-year data retention with ≥100,000 program/erase cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) - supports full firmware images for mid-complexity microcontrollers without external memory expansion. |
| Sector Size | 4 KB uniform sectors - enables fine-grained firmware updates and parameter storage without erasing unrelated code regions. |
| SPI Clock Max | 75 MHz - delivers up to 150 Mbps effective throughput in Fast Read Dual Output mode, matching parallel flash performance. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3V logic systems and tolerant of brown-out conditions down to 2.7V. |
| Endurance | 100,000 program/erase cycles - ensures reliable field operation over product lifetime in OTA update or logging applications. |
| Data Retention | 20 years at +85°C - guarantees long-term firmware integrity in industrial and automotive environments. |
| Operating Temp | −40°C to +85°C - qualified for extended temperature range deployment in uncontrolled ambient conditions. |
Pinout & Package
W25X64VZEIG is packaged in an 8-contact 8×6 mm WSON (package code ZE), with exposed pad for thermal dissipation and no internal die attach paddle connection required. Pin 1 is marked by a dot or beveled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (/CS) | Chip Select Input | Active-low enable: drives DO high-impedance when high; initiates instruction decoding on falling edge. |
| 2 (DO) | Serial Data Output | Primary output for standard SPI reads; second output path in Fast Read Dual Output (3Bh) mode. |
| 3 (/WP) | Write Protect Input | Hardware lock: disables Status Register writes when low, working with SRP bit for robust firmware protection. |
| 4 (GND) | Ground Reference | Signal and power return path; must be low-inductance for stable SPI timing and noise immunity. |
| 5 (DIO) | Serial Data I/O | Input for instructions/addresses; bidirectional-serves as secondary output during dual-output reads. |
| 6 (CLK) | Serial Clock Input | Timing reference: data latched on rising edge (DIO input), shifted out on falling edge (DO/DIO output). |
| 7 (/HOLD) | Hold Input | Pauses ongoing SPI transaction without deselecting device; essential for multi-peripheral bus sharing. |
| 8 (VCC) | Power Supply | 2.7–3.6V supply; decoupling capacitor (0.1 µF) required near pin for transient current stability. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI (3Bh) | Enables 150 Mbps read throughput by using DIO as second output during fast reads-critical for rapid code shadowing at boot. |
| Uniform 4KB Sectors | Allows independent erase of firmware partitions or configuration blocks without disturbing adjacent application code or bootloader. |
| Hardware + Software Write Protection | Combines /WP pin control with programmable BP/TB/SRP bits to prevent accidental or malicious firmware corruption across voltage and reset conditions. |
| JEDEC Manufacturer & Device ID | Supports automated identification (9Fh) and compatibility verification in production programming and field diagnostics. |
| Low-Power Power-down Mode | Reduces standby current to 1 µA typical-enables energy-sensitive designs such as battery-backed IoT nodes and portable medical devices. |
Applications
| Firmware Boot Storage | Industrial HMI Configuration |
|---|---|
|
Use Scenario: Stores boot code and application firmware for ARM Cortex-M or RISC-V microcontrollers requiring fast, reliable startup. IC Role / Device Role / Timing Role: Non-volatile code storage with dual-output SPI read acceleration to minimize boot time. Use Value: 75 MHz clock + Fast Read Dual Output reduces full-image load time by ~2× vs. standard SPI, meeting sub-100ms boot targets. |
Use Scenario: Holds UI assets, calibration tables, and user preferences in panel-mounted HMIs subject to frequent power cycling. IC Role / Device Role / Timing Role: Parameter and asset storage with hardware write protection to prevent corruption during brown-outs. Use Value: /WP pin + SRP/BP bits ensure configuration survives unexpected resets, eliminating factory re-calibration after field power loss. |
| Wireless Module OTA Updates | Automotive Diagnostic Log Buffer |
|
Use Scenario: Hosts firmware delta patches and recovery images in BLE/Wi-Fi modules performing over-the-air updates. IC Role / Device Role / Timing Role: Dual-bank capable storage (via sector management) enabling atomic A/B firmware swaps. Use Value: 4KB sector granularity allows patch installation without erasing entire firmware, reducing update window and network bandwidth. |
Use Scenario: Captures CAN bus diagnostic events and fault codes in telematics gateways where power may be interrupted. IC Role / Device Role / Timing Role: High-endurance non-volatile buffer with fast page programming (<2ms) for burst logging. Use Value: 100,000-cycle endurance supports >5 years of daily log rotation in vehicles with infrequent maintenance intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6405D | 64M-bit, 3.3V, SOIC-8 only; lacks dual-output SPI; max clock 50MHz; no /HOLD pin. | Lower throughput limits use in boot-critical systems; suitable for static config storage only. | Choose when dual-output speed is unnecessary and legacy SOIC-8 footprint is mandatory. |
| S25FL164K0 | 64M-bit, 2.7–3.6V, supports Quad SPI (QSPI); 80MHz clock; includes security registers and OTP area. | Higher protocol complexity but enables secure boot and encrypted firmware loading. | Prefer when cryptographic integrity or QSPI bus efficiency outweighs cost and design simplicity. |
Compared with W25X64VZEIG, MX25L6405D trades dual-output speed and /HOLD flexibility for broader distributor availability, while S25FL164K0 adds security and QSPI at the cost of increased initialization overhead and higher BOM cost.
Availability
W25X64VZEIG is available at Aetrix Electronics and suitable for firmware boot storage, industrial HMI configuration, and wireless module OTA updates requiring stable component supply, long-lifecycle support, and consistent WSON-8 packaging.
Supply support for W25X64VZEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, RAM, and trusted computing components.
The W25X series was designed specifically for embedded code storage applications demanding high-speed serial interfaces, robust write protection, and compact packaging-targeting MCU-based systems with strict pin count and power constraints.
FAQ
What is the package type and dimensions of the W25X64VZEIG?
The W25X64VZEIG uses an 8-contact 8×6 mm WSON package (Winbond package code ZE), with pin 1 identified by a dot or beveled corner. It has no internal thermal pad connection requirement and is RoHS-compliant. This package provides board-area savings over SOIC-8 while maintaining thermal performance suitable for industrial temperature operation.
Does the W25X64VZEIG support dual-output SPI, and how is it enabled?
Yes, the W25X64VZEIG supports dual-output SPI using the Fast Read Dual Output instruction (0x3B). When this command is issued, both the DO and DIO pins output data simultaneously on the falling edge of CLK, doubling effective throughput. No configuration register setting is required-activation is instruction-driven and fully compliant with JEDEC-standard SPI protocols.
How does hardware write protection work on the W25X64VZEIG?
Hardware write protection on the W25X64VZEIG is enforced via the active-low /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is low, all Status Register writes-including block protect (BP) and top/bottom (TB) bit changes-are blocked. This prevents unauthorized firmware modification even during power-up transients or software faults.
What is the sector and block organization of the W25X64VZEIG memory array?
The W25X64VZEIG memory array is organized into 2048 uniform 4KB sectors and 128 64KB blocks. Each sector can be erased independently using the 20h instruction; blocks use D8h; full chip erase uses C7h. This structure enables precise firmware partitioning-for example, isolating bootloader, application, and parameter sections within separate erasable regions.
Can the W25X64VZEIG be used in place of the W25X64VSIQ or W25X64VSFIQ?
No-W25X64VZEIG is not a direct replacement for W25X64VSIQ (SOIC-208) or W25X64VSFIQ (SOIC-300), due to incompatible packages and pinouts. While electrical and functional specifications match, the 8×6 mm WSON (ZE) footprint requires PCB redesign. Equivalent functionality in SOIC-208 is offered by W25X64VSSIQ, not VSIQ.
W25X64VZEIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25X64VZEIG FAQ
1.How can I place an order for W25X64VZEIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X64VZEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X64VZEIG reliable?
The price and inventory of W25X64VZEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X64VZEIG is usually 5 days.
3.What payment methods are accepted for W25X64VZEIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X64VZEIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X64VZEIG?
W25X64VZEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X64VZEIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X64VZEIG?
For technical support, including W25X64VZEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X64VZEIG requirements.
6.How does Aetrix verify that W25X64VZEIG is sourced from the original manufacturer or authorized distributors?
All W25X64VZEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X64VZEIG meets industry standards.
7.What is the process for return or replacement of W25X64VZEIG?
All W25X64VZEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X64VZEIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X64VZEIG part is unused and in its original packaging.
Return procedure for W25X64VZEIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25X64VZEIG Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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AT24C04C-SSHM-T
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