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Winbond Electronics Corporation W25X80AVSSIG

Part No.:
W25X80AVSSIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25X80AVSSIG.pdf
Description:
IC FLASH 8MBIT SPI 100MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,453

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Product details

Overview

W25X80AVSSIG from Winbond is an 8M-bit (1MB) serial Flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating at 2.7–3.6V supply, supporting up to 100MHz clock and 200Mbps data transfer via Fast Read Dual Output (3Bh), used for code shadowing, firmware storage, and parameter retention in space-constrained embedded systems.

For engineers reviewing the W25X80AVSSIG datasheet, W25X80AVSSIG pinout, W25X80AVSSIG application, or W25X80AVSSIG equivalent, key selection considerations include sector-erase granularity (4KB), hardware/software write protection (/WP pin + BP/TB bits), SOIC-208-mil package compatibility, and JEDEC ID (EFh/3014h) verification.

Technical Context

The W25X80AVSSIG implements a standard SPI bus (Modes 0 and 3) with dedicated DO and bidirectional DIO pins, enabling dual-output read mode where DIO functions as a second data output during Fast Read Dual Output (3Bh) instruction. Its internal architecture supports page-program (256B max, <2ms), sector-erase (4KB), block-erase (64KB), and chip-erase operations.

Write protection is enforced through both hardware (/WP pin active-low control of Status Register writes when SRP=1) and software (BP2–BP0 and TB bits in Status Register defining protected address ranges), with factory-default unprotected state and >100,000 erase/write cycles. The device enters power-down mode (1µA typical) via B9h instruction and resumes via ABh.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 8 M-bit (1,048,576 bytes), organized as 4096 × 256-byte pages
Sector Size Uniform 4 KB sectors (256 sectors total), enabling fine-grained data/parameter updates
Max Clock Frequency 100 MHz SPI clock, enabling 200 Mbps effective throughput in Fast Read Dual Output mode
Supply Voltage 2.7 V to 3.6 V single supply; supports industrial temperature range (−40°C to +85°C)
Active/Power-down Current 5 mA typical active current; 1 µA typical power-down current for low-power system sleep modes
Erase/Write Endurance ≥100,000 program/erase cycles per sector; ≥20 years data retention at 25°C
JEDEC ID Manufacturer ID = EFh, Device ID = 3014h - enables automated flash detection in bootloaders

Pinout & Package

W25X80AVSSIG is packaged in an 8-pin SOIC 208-mil (Package Code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.33 mm × 5.33 mm. Pin 1 marked by notch or dot; pin 4 = GND, pin 8 = VCC.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; must transition high→low before instruction acceptance; controls DO high-impedance state
DO Serial Data Output Unidirectional output; data shifted out on CLK falling edge; used in standard and dual-output reads
/WP Write Protect Input Hardware lock for Status Register writes when SRP=1; active-low; enables top/bottom array protection
GND Ground Reference Signal and power return path; decoupling capacitor required near pin 4 for noise immunity
DIO Serial Data I/O Bidirectional SPI data line; latched on CLK rising edge; serves as second output during 3Bh instruction
CLK Serial Clock Input Master-generated timing signal; supports Modes 0 and 3; defines setup/hold timing for DIO/DO
/HOLD Hold Input Pauses ongoing SPI operation while /CS remains low; isolates DIO/CLK; useful in multi-device bus sharing
VCC Power Supply 2.7–3.6 V core supply; requires local 0.1 µF ceramic decoupling between pins 4 and 8

Key Features

Feature Design Value
Dual Output SPI Interface Enables 200 Mbps read throughput using Fast Read Dual Output (3Bh), doubling standard SPI bandwidth for fast code loading
Hardware Write Protection /WP pin combined with SRP bit blocks Status Register writes, preventing accidental configuration changes during power transients
Flexible Memory Protection BP2–BP0 + TB bits allow configurable 4KB–1MB protected regions (top or bottom), supporting secure bootloader and parameter partitioning
Low-Power Power-down Mode B9h instruction reduces current to 1 µA typical, ideal for battery-backed systems requiring long-term non-volatile retention
Industrial Temperature Range Guaranteed operation from −40°C to +85°C, validated across voltage and timing margins for automotive and industrial control applications

Applications

Firmware Storage Bootloader Execution

Use Scenario: Storing MCU firmware images in resource-constrained IoT edge nodes with limited PCB area and no parallel bus.

IC Role / Device Role / Timing Role: Non-volatile code storage accessed via SPI during cold start; supports auto-increment sequential reads for fast image streaming.

Use Value: 4KB sector granularity allows over-the-air (OTA) updates without erasing full application; dual-output mode cuts boot time by ~50% vs. standard SPI.

Use Scenario: Hosting secure bootloader code that validates application integrity before execution in medical diagnostic equipment.

IC Role / Device Role / Timing Role: Trusted code source verified at power-on reset; uses hardware /WP and BP bits to lock bootloader region against runtime corruption.

Use Value: Factory-configurable top/bottom protection (TB bit) ensures bootloader resides in immutable memory, meeting IEC 62304 safety requirements.

Parameter Configuration Audio Data Caching

Use Scenario: Retaining calibration coefficients and user preferences across power cycles in industrial motor drives.

IC Role / Device Role / Timing Role: Parameter store accessed infrequently but requiring high endurance; erased/written per 4KB sector to minimize wear.

Use Value: >100,000 erase/write cycles and 20-year retention guarantee stable operation over product lifetime without refresh logic.

Use Scenario: Buffering compressed audio samples for real-time playback in portable voice assistants.

IC Role / Device Role / Timing Role: High-speed read buffer; leverages Fast Read Dual Output (3Bh) to sustain 200 Mbps streaming to DAC controller.

Use Value: 100 MHz clock support and dual-output capability eliminate need for larger parallel Flash, reducing BOM cost and layout complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25Q80DVSSIG Successor with Quad SPI (QPI) support, 3-byte addressing, and enhanced security registers; same pinout and voltage range Required for designs needing faster random-access reads or QPI protocol compatibility (e.g., XIP-capable MCUs) Select W25Q80DVSSIG if migrating to newer Winbond generation with quad-mode capability; not drop-in for legacy dual-SPI-only firmware
AT25DF081A-SSH-T 8 M-bit SPI Flash from Microchip; supports standard SPI only (no dual-output); identical SOIC-208 package and 2.7–3.6 V operation Suitable where dual-output bandwidth is unnecessary and cross-manufacturer second sourcing is prioritized Choose AT25DF081A-SSH-T for pin-compatible replacement with simplified driver stack; verify timing margins due to different tPP/tSE values

Compared with W25X80AVSSIG, W25Q80DVSSIG adds quad-SPI and security features but requires firmware updates, while AT25DF081A-SSH-T offers direct pin compatibility with reduced feature set-making it suitable for cost-sensitive, bandwidth-tolerant replacements.

Availability

W25X80AVSSIG is available at Aetrix Electronics and suitable for firmware storage, bootloader execution, parameter configuration, and audio data caching requiring stable component supply across industrial, medical, and consumer electronics programs.

Supply support for W25X80AVSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR Flash memory solutions for embedded and industrial markets.

The W25X series was designed specifically for cost-sensitive, space-constrained applications requiring reliable code and data storage with minimal pin count and power consumption-targeting microcontroller-based systems without parallel bus interfaces.

FAQ

What is the memory organization of the W25X80AVSSIG?

The W25X80AVSSIG contains 8 M-bit (1,048,576 bytes) of NOR Flash memory, organized into 4096 programmable pages of 256 bytes each, grouped into 256 uniform 4KB sectors and 16 erasable 64KB blocks. This structure enables flexible updates-such as modifying individual configuration sectors without affecting firmware code stored elsewhere-and is explicitly defined in the "General Description" section of the August 2009 datasheet.

Does the W25X80AVSSIG support dual-output SPI reads, and how is it enabled?

Yes, the W25X80AVSSIG supports dual-output SPI reads using the Fast Read Dual Output instruction (0x3B). When this command is issued, the DIO pin functions as a second data output alongside DO, delivering two bits per clock cycle and achieving up to 200 Mbps throughput at 100 MHz clock. This mode is distinct from standard SPI and requires explicit instruction initiation-not automatic activation-and is documented in Section 9.1.2 of the datasheet.

How does hardware write protection work on the W25X80AVSSIG?

Hardware write protection on the W25X80AVSSIG is implemented via the /WP pin in conjunction with the Status Register Protect (SRP) bit. When SRP = 1, asserting /WP low disables all Status Register writes-including Block Protect (BP2–BP0) and Top/Bottom (TB) bit modifications-preventing unauthorized memory lockdown. This mechanism is independent of software write-enable state and is detailed in Sections 7.4 and 9.2.1 of the datasheet.

What package type does the W25X80AVSSIG use, and what are its mechanical identifiers?

The W25X80AVSSIG uses an 8-pin SOIC 208-mil package (Package Code SS), with body dimensions of 5.33 mm × 5.33 mm, 1.27 mm lead pitch, and gull-wing leads. It is distinct from the 150-mil SOIC (SN) and WSON (ZP) variants-only W25X40A and W25X80A are offered in this 208-mil variant per Section 7.1 of the datasheet, and the "VSSIG" suffix confirms this packaging.

Can the W25X80AVSSIG be used in industrial temperature applications?

Yes, the W25X80AVSSIG is rated for operation from −40°C to +85°C, as specified in Section 11.2 ("Operating Ranges") of the datasheet. This industrial temperature grade is guaranteed across all electrical parameters-including timing, endurance, and data retention-making it suitable for deployment in motor drives, industrial HMIs, and outdoor sensor nodes without derating.

W25X80AVSSIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
8Mbit
Memory Organization:
1M x 8
Memory Interface:
SPI
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25X80AVSSIG FAQ

1.How can I place an order for W25X80AVSSIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25X80AVSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25X80AVSSIG reliable?

The price and inventory of W25X80AVSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X80AVSSIG is usually 5 days.

3.What payment methods are accepted for W25X80AVSSIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X80AVSSIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25X80AVSSIG?

W25X80AVSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25X80AVSSIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25X80AVSSIG?

For technical support, including W25X80AVSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X80AVSSIG requirements.

6.How does Aetrix verify that W25X80AVSSIG is sourced from the original manufacturer or authorized distributors?

All W25X80AVSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X80AVSSIG meets industry standards.

7.What is the process for return or replacement of W25X80AVSSIG?

All W25X80AVSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X80AVSSIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25X80AVSSIG part is unused and in its original packaging.

Return procedure for W25X80AVSSIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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