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Winbond Electronics Corporation W25X80AVZPIG
- Part No.:
- W25X80AVZPIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25X80AVZPIG.pdf
- Description:
- IC FLASH 8MBIT SPI 100MHZ 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,228
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Product details
Overview
W25X80AVZPIG from Winbond is an 8M-bit (1MB) serial Flash memory IC with uniform 4KB sectors and dual-output SPI interface, operating from 2.7V to 3.6V, supporting up to 100MHz clock and 200Mbps data transfer via Fast Read Dual Output (3Bh), used for code storage and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25X80AVZPIG datasheet, W25X80AVZPIG pinout, W25X80AVZPIG application, or W25X80AVZPIG equivalent, key selection criteria include sector-erase granularity (4KB), hardware/software write protection via /WP and status register, JEDEC ID compatibility (EFh/3014h), and WSON-8 (6×5mm) package suitability for high-density PCB layouts.
Technical Context
The W25X80AVZPIG implements a standard SPI bus (Modes 0 and 3) with dedicated DO and bidirectional DIO pins, enabling both single-output and dual-output read modes. Its internal architecture supports page programming (256 bytes/page, <2ms), sector erase (4KB), block erase (64KB), and chip erase - all controlled via 8-bit opcodes aligned to byte boundaries.
Write protection is enforced through a non-volatile status register with BP2–BP0, TB, and SRP bits, configurable via Write Status Register (01h) and enabled/disabled by the active-low /WP pin. The /HOLD pin provides deterministic pause/resume capability during active /CS, preserving internal state across shared-SPI arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 M-bit (1,048,576 bytes), organized as 4096 × 256-byte pages |
| Operating Voltage | 2.7V to 3.6V - compatible with 3.3V logic systems without level shifting |
| Max Clock Frequency | 100 MHz - enables 200 Mbps effective throughput using Fast Read Dual Output (3Bh) |
| Erase Granularity | Uniform 4 KB sectors (256 sectors) and 64 KB blocks (16 blocks) - supports fine-grained firmware update partitioning |
| Write Endurance | 100,000 program/erase cycles per sector - suitable for field-upgradable bootloaders and configuration storage |
| Data Retention | 20 years at +25°C - ensures long-term reliability in industrial and automotive control modules |
| Package | 8-pad WSON (6 mm × 5 mm, 0.5 mm pitch, ZP code) - surface-mount, thermally enhanced, footprint-efficient |
Pinout & Package
W25X80AVZPIG is packaged in an 8-pad WSON (6×5 mm, ZP code) with exposed thermal pad. Pin 4 is GND; Pin 8 is VCC; all other pins are signal I/O with defined SPI roles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives device into high-impedance output and standby current (1 µA) when high |
| 2 DO | Serial Data Output | Unidirectional output for standard SPI reads and dual-output mode (3Bh); latched on CLK falling edge |
| 3 /WP | Write Protect Input | Hardware lock for status register writes when SRP=1 and /WP low - prevents accidental firmware corruption |
| 4 GND | Ground Reference | Primary return path for VCC and all I/O signals; connects to thermal pad for thermal dissipation |
| 5 DIO | Serial Data I/O | Bidirectional SPI data line: input for commands/addresses, output during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Timing reference for all SPI transfers; sampled on rising edge for input, driven on falling edge for output |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction while /CS remains low - preserves internal state during bus arbitration |
| 8 VCC | Power Supply | Single 2.7–3.6V supply; powers core logic, memory array, and I/O buffers |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI Mode | Enables 200 Mbps read throughput via Fast Read Dual Output (3Bh), doubling bandwidth over standard SPI for rapid code shadowing |
| Hardware Write Protection | /WP pin + SRP bit combination locks status register writes, preventing unauthorized memory protection changes in deployed systems |
| Flexible Erase Architecture | Independent 4 KB sector and 64 KB block erase - allows partial firmware updates without full chip reprogramming |
| JEDEC Standard IDs | Manufacturer ID EFh and Device ID 3014h - ensures interoperability with standardized flash programming tools and bootloader frameworks |
| Low-Power Power-down | 1 µA typical standby current with B9h instruction - extends battery life in always-on IoT sensor nodes and wearables |
Applications
| Firmware Storage | Industrial HMI |
|---|---|
Use Scenario: Storing boot code, application firmware, and calibration tables in microcontroller-based edge devices. IC Role / Device Role / Timing Role: Non-volatile code storage with fast read access via dual-output SPI to minimize boot time. Use Value: 4KB sector granularity enables atomic firmware patching; 20-year data retention ensures field reliability without recalibration. | Use Scenario: Persistent storage of UI assets, language packs, and operational logs in panel-mounted HMIs. IC Role / Device Role / Timing Role: High-density, low-pin-count memory for graphics and configuration data in space-limited enclosures. Use Value: WSON-8 package reduces PCB area vs. SOIC; hardware /WP protection prevents UI corruption during ESD events. |
| Automotive Telematics | Medical Diagnostic Equipment |
Use Scenario: Secure storage of GPS map tiles, OTA update staging, and vehicle configuration profiles. IC Role / Device Role / Timing Role: SPI-connected Flash with JEDEC ID verification for secure boot chain integration. Use Value: Block protect bits (BP2–BP0) isolate critical firmware partitions; -40°C to +85°C rating meets AEC-Q100 ambient requirements. | Use Scenario: Storing diagnostic algorithms, patient history templates, and regulatory compliance logs in portable analyzers. IC Role / Device Role / Timing Role: Reliable, low-power non-volatile memory for FDA-cleared Class II devices requiring traceable data integrity. Use Value: 100,000 erase cycles support frequent calibration logging; SRP+/WP hardware lock prevents accidental overwrite during service. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF081A-SSHN-B | 8 M-bit, 3.0–3.6V operation, 85 MHz max clock, SOIC-8 only (no WSON option) | Lacks dual-output SPI; slower read performance; no /HOLD pin | Choose if SOIC-208-mil footprint is required and dual-output bandwidth is not needed. |
| S25FL008A0XMFI010 | 8 M-bit, 2.7–3.6V, 66 MHz max clock, supports Quad SPI but no dual-output mode | Requires different instruction set (03h/0Bh/6Bh); larger WSON-8 footprint (8×6 mm) | Prefer for designs migrating to Quad SPI infrastructure; verify bootloader opcode compatibility. |
Compared with AT25DF081A-SSHN-B and S25FL008A0XMFI010, W25X80AVZPIG delivers higher read bandwidth (200 Mbps vs ≤132 Mbps), native /HOLD support for multi-device SPI arbitration, and identical WSON-8 (6×5 mm) footprint - making it optimal for compact, high-throughput embedded firmware storage.
Availability
W25X80AVZPIG is available at Aetrix Electronics and suitable for industrial HMI, automotive telematics, medical diagnostics, and IoT edge node applications requiring stable component supply, long-life availability, and RoHS-compliant packaging.
Supply support for W25X80AVZPIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial NOR Flash memory solutions for consumer, industrial, and automotive markets.
The W25X series was designed specifically for cost-sensitive, space-constrained embedded systems requiring fast, reliable, low-power non-volatile code and data storage with minimal pin count and robust write protection.
FAQ
What is the memory organization of the W25X80AVZPIG?
The W25X80AVZPIG contains 8 M-bit (1,048,576 bytes) of NOR Flash memory, organized into 4096 programmable pages of 256 bytes each, 256 uniform 4 KB sectors, and 16 erasable 64 KB blocks. This structure supports flexible firmware partitioning and atomic sector-level updates essential for robust embedded system design.
Does the W25X80AVZPIG support dual-output SPI mode?
Yes, the W25X80AVZPIG supports dual-output SPI using the Fast Read Dual Output instruction (0x3B). In this mode, the DIO pin functions as a second data output alongside DO, enabling 200 Mbps effective read throughput at 100 MHz clock - ideal for rapid code shadowing and high-speed data retrieval in the W25X80AVZPIG.
What package type is used for the W25X80AVZPIG?
The W25X80AVZPIG uses an 8-pad WSON (6 mm × 5 mm) package with 0.5 mm pitch and exposed thermal pad (package code ZP). This compact, surface-mount package minimizes PCB area while providing thermal performance suitable for dense industrial and automotive PCB layouts.
How does hardware write protection work on the W25X80AVZPIG?
Hardware write protection on the W25X80AVZPIG combines the active-low /WP pin with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is low, the Write Status Register instruction (01h) is locked out - preventing modification of block protection bits (BP2–BP0) and top/bottom control (TB), ensuring firmware integrity in the W25X80AVZPIG.
What JEDEC identifiers does the W25X80AVZPIG report?
The W25X80AVZPIG reports Manufacturer ID 0xEF and Device ID 0x3014 via the Release Power-down / Device ID (0xAB) and JEDEC ID (0x9F) instructions. These standardized identifiers ensure compatibility with universal flash programmers, bootloader frameworks, and automated test equipment verifying the W25X80AVZPIG in production.
W25X80AVZPIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25X80AVZPIG FAQ
1.How can I place an order for W25X80AVZPIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X80AVZPIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X80AVZPIG reliable?
The price and inventory of W25X80AVZPIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X80AVZPIG is usually 5 days.
3.What payment methods are accepted for W25X80AVZPIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X80AVZPIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X80AVZPIG?
W25X80AVZPIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X80AVZPIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X80AVZPIG?
For technical support, including W25X80AVZPIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X80AVZPIG requirements.
6.How does Aetrix verify that W25X80AVZPIG is sourced from the original manufacturer or authorized distributors?
All W25X80AVZPIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X80AVZPIG meets industry standards.
7.What is the process for return or replacement of W25X80AVZPIG?
All W25X80AVZPIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X80AVZPIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X80AVZPIG part is unused and in its original packaging.
Return procedure for W25X80AVZPIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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