Winbond Electronics Corporation W25X80VSSIG
- Part No.:
- W25X80VSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X80VSSIG.pdf
- Description:
- IC FLASH 8MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,688
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Product details
Overview
W25X80VSSIG from Winbond is an 8M-bit (1MB) serial Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It features uniform 4KB sectors, dual-output SPI interface supporting up to 75MHz clock (150Mbps effective), and operates from a single 2.7–3.6V supply with 5mA active and 1µA power-down current. It is commonly used in firmware boot storage for microcontrollers and parameter retention in industrial controllers.
For engineers reviewing the W25X80VSSIG datasheet, W25X80VSSIG pinout, W25X80VSSIG application, or W25X80VSSIG equivalent, key selection criteria include sector granularity (4KB), dual-output read performance, hardware/software write protection flexibility, JEDEC ID compatibility, and SOIC-208-mil package compatibility with legacy PCB footprints.
Technical Context
The W25X80VSSIG implements a standard SPI bus compliant with Modes 0 and 3, using four dedicated pins: /CS, CLK, DIO (bidirectional), and DO (dedicated output). Its dual-output mode activates only during Fast Read Dual Output (3Bh) instruction, repurposing DIO as a second data output line to double throughput without requiring additional I/O resources.
Internal architecture includes a 4096-page (256-byte/page) array organized into 256 erasable 4KB sectors and 16 erasable 64KB blocks. Write protection is enforced via both hardware (/WP pin) and software (Status Register BP2–BP0, TB, SRP bits), enabling selective top/bottom array locking with non-volatile configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 M-bit (1,048,576 bytes), organized as 4096 × 256-byte pages |
| Interface | Quad-pin SPI with dual-output capability (CLK, /CS, DIO, DO); supports Mode 0/3 |
| Max Clock Frequency | 75 MHz - enables 150 Mbps effective read rate using Fast Read Dual Output (3Bh) |
| Erase Granularity | 4 KB sectors (256 total) and 64 KB blocks (16 total) - allows fine-grained firmware patching |
| Endurance & Retention | 100,000 program/erase cycles minimum; 20-year data retention at +85°C |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3V logic systems without level shifting |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded applications |
Pinout & Package
W25X80VSSIG is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.33 mm × 5.33 mm. This package is pin-compatible with other W25X-series devices in the same footprint and supports reflow soldering per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first instruction |
| 2 DO | Serial Data Output | Dedicated output for standard SPI reads; outputs MSB-first on CLK falling edge |
| 3 /WP | Write Protect Input | Hardware lock for Status Register when SRP=1; active-low, internally pulled up |
| 4 GND | Ground Reference | Primary return path for VCC and all I/O signals; requires low-impedance PCB connection |
| 5 DIO | Serial Data I/O | Bidirectional SPI data line; used for input (instructions/addresses) and dual-output during 3Bh |
| 6 CLK | Serial Clock Input | Master-generated timing signal; latches DIO on rising edge, clocks DO/DIO out on falling edge |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction while /CS remains low; enables multi-device bus sharing |
| 8 VCC | Power Supply | 2.7–3.6V supply; decoupling capacitor (0.1 µF) required within 5 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output SPI Read | Enables 150 Mbps effective throughput via Fast Read Dual Output (3Bh), matching parallel Flash performance with 4-pin interface |
| Uniform 4KB Sector Architecture | Supports precise firmware updates and parameter storage without over-erasing; 256 independent sectors |
| Hardware + Software Write Protection | /WP pin and Status Register (BP2–BP0, TB, SRP) allow layered, field-upgradeable memory lockdown |
| JEDEC Standard Identification | Returns Manufacturer ID EFh and Device ID 13h (W25X80) via ABh/90h/9Fh instructions - ensures toolchain and bootloader compatibility |
| Low-Power Power-Down Mode | 1 µA typical standby current with full instruction retention; resumes operation instantly on Release Power-down (ABh) |
Applications
| Industrial PLC Firmware Storage | IoT Edge Device Configuration |
|---|---|
Use Scenario: Storing firmware images and runtime configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile code and data storage device interfaced directly to ARM Cortex-M7 MCU via SPI, serving as primary boot source and parameter archive. Use Value: 4KB sector erase enables incremental firmware patching without full chip erase; −40°C to +85°C rating ensures reliability in uncontrolled cabinet environments. |
Use Scenario: Holding device-specific credentials, sensor calibration tables, and OTA update staging buffers in battery-powered smart sensors. IC Role / Device Role / Timing Role: Low-power persistent memory co-located with ESP32-WROVER; accessed intermittently for secure credential retrieval and update validation. Use Value: 1 µA power-down current extends battery life; hardware /WP pin prevents accidental overwrite during brown-out events. |
| Medical Diagnostic Instrument Boot Memory | Automotive Infotainment System Asset Cache |
Use Scenario: Hosting bootloader and safety-critical diagnostic application code in portable ultrasound units requiring rapid cold-start execution. IC Role / Device Role / Timing Role: Primary SPI Flash for XIP-capable MCU; Fast Read Dual Output (3Bh) reduces boot time by 40% vs. standard SPI reads. Use Value: 75 MHz dual-output read speed delivers >10 MB/s effective bandwidth - sufficient for loading real-time DSP kernels from flash to RAM. |
Use Scenario: Caching UI assets, voice recognition models, and map tile fragments in head-unit systems where NAND Flash wear-leveling overhead is undesirable. IC Role / Device Role / Timing Role: High-reliability serial Flash paired with i.MX6Q processor; used for deterministic read latency-critical assets. Use Value: 100,000-cycle endurance exceeds automotive lifecycle requirements; 64KB block erase supports modular asset updates without disturbing core OS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF081-SSHN-B | 8 M-bit, 3.0–3.6V supply, 85 MHz max clock, supports Quad SPI but no dual-output mode | Lacks dual-output acceleration; requires different read instruction (0Bh only); higher active current (12 mA) | Choose if Quad SPI controller support exists and dual-output speed is not required |
| SST25VF080B-80-4I-SAE | 8 M-bit, 2.7–3.6V, 80 MHz max clock, standard SPI only, no /HOLD pin | No hold functionality limits multi-device bus arbitration; no JEDEC ID support complicates auto-detection | Choose for cost-sensitive designs where /HOLD and JEDEC ID are unused |
Compared with AT25DF081-SSHN-B and SST25VF080B-80-4I-SAE, W25X80VSSIG provides superior read throughput via dual-output mode, integrated /HOLD for robust bus sharing, and JEDEC-compliant identification - making it optimal for boot-critical and resource-constrained embedded systems.
Availability
W25X80VSSIG is available at Aetrix Electronics and suitable for industrial control systems, medical diagnostics equipment, and automotive infotainment modules requiring stable component supply across extended product lifecycles.
Supply support for W25X80VSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, Flash memory, and mobile DRAM solutions for industrial, communications, and consumer markets.
The W25X series was designed specifically for embedded systems needing compact, low-power, high-reliability serial Flash with flexible protection and fast read performance - targeting MCU boot, firmware storage, and parameter logging applications.
FAQ
What is the maximum SPI clock frequency supported by the W25X80VSSIG?
The W25X80VSSIG supports SPI clock frequencies up to 75 MHz under standard operating conditions. When using the Fast Read Dual Output (3Bh) instruction, this enables an effective data transfer rate of 150 Mbps. The device meets AC timing specifications at this speed, including setup/hold margins for DIO and DO relative to CLK, as verified in Section 11.7 of the official datasheet.
Does the W25X80VSSIG support Quad SPI mode?
No, the W25X80VSSIG does not support Quad SPI mode. It supports standard SPI (single I/O) and dual-output SPI (DIO + DO simultaneously during Fast Read Dual Output instruction only). Quad SPI functionality - requiring four bidirectional I/O lines - is absent; the pinout and instruction set confirm only two data lines (DIO and DO) are implemented.
How many 4KB sectors does the W25X80VSSIG contain?
The W25X80VSSIG contains exactly 256 uniform 4KB sectors, totaling 1,048,576 bytes (8 M-bit) of addressable memory. Each sector can be erased independently using the Sector Erase (20h) instruction. This sector count is explicitly stated in the General Description section and confirmed in the Status Register Memory Protection table for the W25X80 variant.
What is the function of the /HOLD pin on the W25X80VSSIG?
The /HOLD pin on the W25X80VSSIG pauses ongoing SPI transactions while /CS remains low, placing DO in high-impedance state and ignoring DIO and CLK inputs. This enables safe bus sharing among multiple SPI peripherals. The hold condition activates on the falling edge of /HOLD (or next CLK falling edge if CLK is high), and terminates on the rising edge (or next CLK falling edge), as detailed in Section 9.1.3.
Is the W25X80VSSIG pin-compatible with other W25X-series devices in SOIC-208-mil packages?
Yes, the W25X80VSSIG uses the SOIC-208-mil package (code SS), which is shared with the W25X40 in the same footprint. Pin assignment (1–8: /CS, DO, /WP, GND, DIO, CLK, /HOLD, VCC) is identical across all W25X-series variants in this package type, enabling direct substitution where density and timing requirements align.
W25X80VSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X80VSSIG FAQ
1.How can I place an order for W25X80VSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X80VSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X80VSSIG reliable?
The price and inventory of W25X80VSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X80VSSIG is usually 5 days.
3.What payment methods are accepted for W25X80VSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X80VSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X80VSSIG?
W25X80VSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X80VSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X80VSSIG?
For technical support, including W25X80VSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X80VSSIG requirements.
6.How does Aetrix verify that W25X80VSSIG is sourced from the original manufacturer or authorized distributors?
All W25X80VSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X80VSSIG meets industry standards.
7.What is the process for return or replacement of W25X80VSSIG?
All W25X80VSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25X80VSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X80VSSIG part is unused and in its original packaging.
Return procedure for W25X80VSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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